UCD1V4R7MCL1GS

The UCD1V4R7MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount applications. It provides 4.7 µF capacitance at a 35 V rating in a compact φ4 × 5.8 mm can package suitable for automated PCB assembly.

Engineered for low impedance and wide temperature operation, this part targets high-density SMD boards and applications that require reliable, polarized bulk capacitance with defined ripple and leakage performance.

Key Features

• Capacitance & Tolerance — 4.7 µF nominal capacitance with tolerance −20% to +20% at 120 Hz, 20°C.
• Rated Voltage — 35 V working voltage for mid-voltage SMD power applications.
• Low Impedance — Specified impedance of 1.35 Ω and a low tangent of loss angle (tanδ = 0.12 at 20°C, 120 Hz) for efficient AC performance.
• Ripple Performance — Low-frequency ripple current 45 mA (120 Hz) and high-frequency ripple current 90 mA (10 kHz), enabling decoupling and smoothing across frequency ranges.
• Leakage Current — Low leakage current of 3 µA after rated voltage application, supporting low standby losses.
• Temperature & Endurance — Rated for −55°C to +105°C operation with life/endurance specified at 2000 hours at 105°C.
• Automotive-Grade Qualification — AEC‑Q200 rated and listed for automotive applications.
• Surface-Mount Package — Chip-type radial can (SMD) in φ4 × 5.8 mm size with surface-mount land recommendation 4.3 × 4.3 mm and supplied in embossed carrier taping for automatic placement.
• RoHS Compliant — Meets RoHS requirements for environmental compliance.

Typical Applications

• Automotive electronics — Use in automotive modules that require AEC‑Q200 qualified SMD capacitance for power filtering and energy storage.
• High-density SMD assemblies — Compact chip can format and embossed carrier taping support automated placement on tightly packed PCBs.
• Power supply decoupling — Provides bulk capacitance and ripple handling for mid-voltage SMD power rails where low leakage and defined ripple specs are needed.

Unique Advantages

• Compact, serviceable form factor: φ4 × 5.8 mm can package delivers 4.7 µF in a small SMD footprint for space-constrained boards.
• Validated endurance at elevated temperature: 2000 hours at 105°C supports designs requiring defined high-temperature lifetime behavior.
• Frequency-spanning ripple capability: Specified ripple currents at 120 Hz and 10 kHz enable confidence across low- and high-frequency power conditions.
• Low leakage and controlled dissipation: 3 µA leakage and tanδ = 0.12 (at 35 V, 120 Hz) help preserve efficiency in standby and active states.
• Automotive-ready qualification: AEC‑Q200 rating provides an established reliability framework for vehicle electronics applications.
• Assembly-friendly packaging: Embossed carrier taping and SMD can format simplify automated placement and reduce assembly handling.

Why Choose UCD1V4R7MCL1GS?

UCD1V4R7MCL1GS combines a compact SMD can package with measurable low-impedance performance and defined ripple/leakage specifications, making it well suited for designs that require reliable mid-voltage bulk capacitance in space-constrained assemblies. Its −55°C to +105°C rating and 2000-hour endurance at 105°C provide predictable behavior in elevated-temperature environments.

This part is a practical choice for engineers specifying AEC‑Q200 qualified, RoHS-compliant aluminum electrolytic capacitance for automotive electronics, high-density power boards, and automated SMD production flows where consistent electrical and mechanical characteristics are required.

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