UCD1V680MCS1GS

The UCD1V680MCS1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a surface-mount can package designed for high-density PCB assembly. It provides 68 µF capacitance at 35 V in a compact φ6.3 × 7.7 mm SMD footprint with embossed carrier taping for automated placement.

Targeted at demanding electronics applications including automotive systems, this part combines a wide operating temperature range, vibration resistance and defined ripple current capability to support reliable power-conditioning in constrained spaces.

Key Features

• Capacitance & Voltage: 68 µF nominal capacitance rated at 35 V with tolerance −20% to +20%.
• Low-impedance chip type: Chip-type construction optimized for low impedance; specified tangent of loss angle (tanδ) of 0.12 (measured at 20°C, 120 Hz) for the 35 V rating.
• Ripple current capability: Low-frequency ripple current 145 mA at 120 Hz and high-frequency ripple current 290 mA at 10 kHz.
• Leakage current: Specified leakage current of 23.8 µA.
• Robust thermal and endurance performance: Operating temperature range −55°C to +105°C and rated endurance of 2000 hours at 105°C.
• Compact SMD package: Can-type SMD package with dimensions φ6.3 × 7.7 mm and recommended land size 6.6 × 6.6 mm; supplied in embossed carrier taping for automated mounting.
• Mechanical resilience: Vibration resistant construction suitable for mechanically demanding assemblies.
• Quality & compliance: AEC-Q200 rated and RoHS compliant; part is in mass production.

Typical Applications

• Automotive electronics: AEC-Q200 qualification and vibration-resistant construction make this capacitor suitable for automotive electronic assemblies that require verified component reliability.
• High-density SMD assemblies: Chip-type, surface-mount can and embossed carrier taping enable automated placement on high-density printed circuit boards.
• Power conditioning in compact designs: Low-impedance construction combined with defined ripple current ratings supports localized filtering and voltage stabilization where board space is limited.

Unique Advantages

• Automotive-grade qualification: AEC-Q200 rating supports use in designs requiring recognized component-level automotive qualification.
• Low-impedance performance: Specified tanδ and ripple current ratings translate to effective AC performance in power-conditioning applications.
• Wide temperature and proven endurance: −55°C to +105°C range and 2000 hours at 105°C provide predictable performance in elevated-temperature environments.
• Compact SMD form factor: φ6.3 × 7.7 mm can and standard land pattern reduce PCB footprint while remaining compatible with automated assembly processes.
• Vibration resistance: Mechanical resilience increases assembly robustness in environments subject to shock and vibration.
• Mass-production availability and RoHS compliance: Ready availability and regulatory compliance simplify procurement and product development timelines.

Why Choose UCD1V680MCS1GS?

The UCD1V680MCS1GS offers a concise combination of low-impedance electrical performance, automotive-level qualification, and compact SMD packaging—making it well suited for engineers designing space-constrained, high-reliability power modules and electronic control units. Its defined ripple current ratings, low leakage, and extended temperature and endurance specifications provide predictable behavior in challenging operating conditions.

For projects that demand consistent supply and regulatory compliance, this part’s mass-production status and RoHS conformance help streamline design-in and production planning while maintaining component-level traceability and quality.

If you need pricing, lead-time or technical support for integrating UCD1V680MCS1GS into your design, request a quote or submit an inquiry to our sales team to start the process.