UCD1V681MNS1MS

The UCD1V681MNS1MS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a surface‑mount can package designed for high‑density PCBs. It delivers 680 µF at 35 V with a rated operating temperature range from -55 °C to +105 °C and is optimized for automated PCB assembly.

Targeted at applications requiring robust decoupling and energy storage in compact SMD formats, this part is RoHS compliant and AEC‑Q200 qualified for environments where established component qualification is required.

Key Features

• Core Type – Chip, Low Impedance Chip‑type aluminum electrolytic construction designed for low impedance behavior across frequency.
• Capacitance & Voltage 680 µF nominal capacitance at a rated voltage of 35 V with ±20% tolerance.
• Temperature Range & Endurance Operates from -55 °C to +105 °C with a specified lifetime of 5000 hours at 105 °C.
• Ripple Performance Rated ripple current of 550 mA at 120 Hz and 1.1 A at 10 kHz, supporting AC stress conditions typical in power circuits.
• Reliability & Compliance AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).
• Mounting & Package Surface‑mount radial can (SMD) package intended for high‑density PCBs and compatible with carrier‑tape automated mounting.
• Physical Footprint Package dimensions L: 1.35 × D: 1.25 cm with recommended surface‑mount land size L: 1.28 × W: 1.28 cm and a seated height up to 1.35 cm.
• Polarized Electrolytic Polarized device; observe polarity in assembly and circuit design.

Typical Applications

• Automotive Electronics Suitable for electronic modules where AEC‑Q200 qualification and elevated temperature operation to +105 °C are required.
• High‑Density SMD Assemblies Designed for surface mounting on high‑density printed circuit boards where compact, can‑style SMD capacitors are needed.
• Automated Production Lines Compatible with carrier‑tape feed for automatic placement and pick‑and‑place processes.

Unique Advantages

• Low Impedance Design: Chip‑type construction with specified ripple ratings (550 mA @ 120 Hz, 1.1 A @ 10 kHz) supports stable AC performance in power circuits.
• Wide Operating Temperature: Rated from -55 °C to +105 °C to address elevated temperature environments and extended thermal ranges.
• Long Endurance at High Temperature: Specified lifetime of 5000 hours at 105 °C provides designers with a clear reliability baseline for thermal stress planning.
• AEC‑Q200 Qualification: Qualification applicable to designs requiring industry qualification for component reliability.
• SMD Compatibility for High‑Density Layouts: Compact radial can SMD package and defined land pattern simplify layout and assembly on dense PCBs.
• Regulatory Compliance: RoHS compliant to current directives for environmental requirements.

Why Choose UCD1V681MNS1MS?

The UCD1V681MNS1MS combines a low‑impedance aluminum electrolytic chip design with a compact SMD can package and defined land pattern for reliable placement in high‑density assemblies. With a 680 µF/35 V rating, specified ripple current performance, extended temperature range to +105 °C and a 5000‑hour endurance rating at that temperature, it is positioned for designs that require durable, temperature‑tolerant bulk capacitance in a surface‑mount form factor.

This part is well suited for engineers and procurement teams developing modules that must meet qualification and environmental compliance requirements while retaining compact board footprint and automated assembly compatibility.

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