UCD1V681MNQ1MS

The UCD1V681MNQ1MS is a surface-mount, low-impedance aluminum electrolytic chip capacitor offering 680 µF at a 35 V rating. It is designed for high-density PCB assembly and automatic mounting, delivering high capacitance in a compact SMD can package.

With a wide operating temperature range and long endurance at elevated temperature, this part targets applications that require bulk energy storage, smoothing and decoupling on compact, high-reliability assemblies, including automotive systems where AEC-Q200 qualification is required.

Key Features

• Capacitance & Voltage — 680 µF rated capacitance at 35 V for bulk storage and smoothing in power rails.
• Low Impedance Chip Type — Chip-type construction optimized for low impedance performance in SMD form.
• Loss Tangent (tan δ) — tanδ = 0.12 measured at 20 °C, 120 Hz, supporting predictable loss characteristics for power applications.
• Ripple Current Capability — 550 mA at 120 Hz (low frequency) and 1.1 A at 10 kHz (high frequency) to support ripple filtering and decoupling duties.
• Leakage Current — Specified leakage current of 238 µA for predictable standby and bias behavior.
• Extended Temperature & Endurance — Operating range −55 °C to +105 °C with rated endurance of 5000 hours at 105 °C.
• Surface-Mount Package — SMD radial can (φ12.5×13.5L / L:1.35 cm × D:1.25 cm) supplied on embossed carrier tape for automated placement.
• AEC-Q200 Qualified — Designed to meet AEC-Q200 reliability requirements for demanding applications.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Automotive power systems — Bulk smoothing and decoupling on 12 V/24 V power rails where AEC-Q200 qualification and extended temperature endurance are required.
• DC–DC converters — Input/output filtering and energy buffering for converters that require high capacitance and solid ripple current handling in an SMD form factor.
• High-density PCB power distribution — Local energy storage and transient suppression on compact, surface-mounted power boards assembled by automated pick-and-place.

Unique Advantages

• High capacitance in a compact SMD can — 680 µF in a φ12.5×13.5L (1.35×1.25 cm) package reduces board area compared with larger through-hole options.
• Designed for automated assembly — Supplied on embossed carrier tape for reliable feeding into pick-and-place equipment.
• Robust ripple handling — Combined low- and high-frequency ripple current ratings (550 mA @120 Hz, 1.1 A @10 kHz) support a range of filtering use cases.
• Extended temperature and endurance — −55 °C to +105 °C operation and 5000 hours at 105 °C provide long-term stability in thermal stress environments.
• AEC-Q200 qualification — Provides an added level of reliability assessment for applications with stringent quality requirements.
• Predictable electrical characteristics — Specified tanδ and leakage current values enable easier margining in power system design.

Why Choose UCD1V681MNQ1MS?

The UCD1V681MNQ1MS offers a balance of high capacitance, low impedance performance and assembly-friendly SMD packaging, making it suitable for compact power subsystems that demand stable filtering and energy storage over a wide temperature range. Its ripple current ratings, low loss tangent, and specified leakage behavior help engineers design predictable power rails and decoupling networks.

This capacitor is well suited for designers requiring a compact, durable SMD electrolytic with documented endurance at elevated temperature and AEC-Q200 qualification for demanding applications. The combination of automated-tape packaging and established electrical specifications supports efficient production and reliable operation in deployed systems.

If you would like pricing, availability or a technical quote for the UCD1V681MNQ1MS, please request a quote or contact our sales team to discuss your project requirements and volume needs.