UCL0J101MCL6GS
| Part Description |
100 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,152 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCL |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 100 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 360 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 240 mA @ 10 kHz | Ripple Current Low Frequency | 120 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 5 mm | Surface Mount Land Size | 5.3 x 5.3 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of UCL0J101MCL6GS – 100 µF, 6.3 V Surface‑Mount Aluminum Electrolytic Capacitor
The UCL0J101MCL6GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount applications. It provides 100 µF capacitance at a 6.3 V rating in a compact φ5 × 5.8 mm can‑style SMD package and is supplied in embossed carrier taping for automated placement.
Engineered for demanding operating conditions, this AEC‑Q200 rated component targets automotive and industrial power electronics where elevated temperature endurance, low loss, and controlled leakage are required. It is in mass production and suited to designs that need a small, robust SMD electrolytic solution.
Key Features
- Capacitance & Tolerance — 100 µF nominal with tolerance −20% to +20% at 120 Hz, 20°C.
- Rated Voltage — 6.3 V operating voltage suitable for low‑voltage power rails.
- Low‑Impedance Chip Design — Chip‑type, low impedance construction with a specified impedance of 360 mΩ, optimized for decoupling and smoothing.
- Loss Characteristics (tan δ) — tan δ (DF) max 0.26 measured at 120 Hz, 20°C for predictable AC loss behavior.
- Ripple Current Capability — Low‑frequency ripple current 120 mA at 120 Hz and high‑frequency ripple current 240 mA at 10 kHz for effective ripple handling in compact form factors.
- Leakage Current — Specified leakage current of 6.3 µA for stable standby performance.
- Temperature & Endurance — Rated for −55°C to +105°C with endurance of 2000 hours at 105°C under rated voltage.
- Package & Mounting — Surface mount radial can (SMD chip) with physical size φ5 × 5.8 mm and recommended land size 5.3 × 5.3 mm; supplied in embossed carrier taping for automated SMT.
- Automotive Qualification — AEC‑Q200 rated for automotive applications requiring component stress testing and reliability screening.
Typical Applications
- Automotive power rails — Bulk decoupling and smoothing on low‑voltage power rails in automotive electronic control units, enabled by AEC‑Q200 qualification and 105°C endurance.
- DC‑DC converter output filtering — Compact SMD form factor with high ripple current capability for post‑regulation filtering in power conversion stages.
- Infotainment and instrument clusters — Local energy storage and noise suppression in space‑constrained boards operating across a wide temperature range.
Unique Advantages
- Compact SMD footprint: φ5 × 5.8 mm can package and 5.3 × 5.3 mm recommended land simplify board layout in size‑limited designs.
- High temperature endurance: 2000 hours at 105°C supports long‑term reliability in elevated ambient conditions.
- Automotive readiness: AEC‑Q200 rating provides assurance for use in automotive electronic modules.
- Reliable ripple handling: Specified low‑ and high‑frequency ripple currents (120 mA at 120 Hz, 240 mA at 10 kHz) help maintain stable rail performance under dynamic loads.
- Controlled loss and leakage: tan δ max 0.26 and leakage current of 6.3 µA support predictable AC behavior and low standby current draw.
- Production‑ready packaging: Embossed carrier taping facilitates automated pick‑and‑place and high‑volume assembly.
Why Choose UCL0J101MCL6GS?
The UCL0J101MCL6GS combines a chip‑type low‑impedance aluminum electrolytic design with automotive‑grade screening and proven endurance at 105°C, making it a practical choice for engineers designing compact power systems. Its balance of capacitance, ripple capability, and low loss in a small SMD can delivers reliable decoupling and filtering where board space and thermal stress are constraints.
This part is well suited to designers of automotive and industrial electronics seeking a mass‑production‑ready electrolytic capacitor that supports automated assembly and long‑term thermal stress. The clear, specification‑based benefits simplify component selection and BOM decisions for robust power management designs.
Request a quote or contact sales to discuss availability, pricing, and sample options for UCL0J101MCL6GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016