UCL0J220MCL1GS

The UCL0J220MCL1GS is a chip‑type, low‑impedance surface mount aluminum electrolytic capacitor with a nominal capacitance of 22 µF and a rated voltage of 6.3 V. It is designed for automated assembly and compact board layouts, in a φ4 × 5.8 mm can‑style SMD package.

Engineered for elevated operating conditions, the part offers a wide temperature range (−55 °C to +105 °C), AEC‑Q200 qualification, and endurance of 2000 hours at 105 °C, making it suitable for demanding electronics where reliable decoupling, filtering and ripple handling on low‑voltage rails are required.

Key Features

• Capacitance & Voltage — 22 µF nominal capacitance with a rated voltage of 6.3 V and capacitance tolerance ±20% at 120 Hz, 20 °C.
• Low Impedance Chip Type — Chip‑type construction with specified impedance of 850 mΩ and a tan δ (DF) max of 0.26 at 20 °C, 120 Hz for stable AC performance.
• Ripple Current & Leakage — Supports low‑frequency ripple current of 80 mA (120 Hz) and high‑frequency ripple current of 160 mA (10 kHz), with leakage current specified at 3 µA.
• Temperature & Endurance — Operating range −55 °C to +105 °C and endurance rated to 2000 hours at 105 °C with defined limits for capacitance change, tan δ and leakage current after test.
• Surface Mount Package — Compact φ4 × 5.8 mm can‑style SMD package with surface mount land size L: 4.3 × W: 4.3 mm and supplied in embossed carrier tape for automatic placement.
• Compliance & Qualification — AEC‑Q200 qualified and compliant with the RoHS directive (2011/65/EU, (EU)2015/863), supporting regulated manufacturing and automotive design requirements.

Typical Applications

• Automotive electronic modules — Decoupling and local energy storage on 6.3 V rails in modules requiring AEC‑Q200 qualification and extended temperature tolerance.
• Power rail smoothing — Bulk decoupling and ripple suppression on low‑voltage power supplies where 22 µF and the specified ripple current capability are appropriate.
• Automated SMD assembly — Designed for pick‑and‑place from embossed carrier tape and evaluated for soldering heat resistance suitable for typical surface mount processes.

Unique Advantages

• AEC‑Q200 qualification: Provides a known qualification level for designers targeting automotive and similarly demanding applications.
• Compact footprint: φ4 × 5.8 mm SMD can minimizes board space while delivering 22 µF capacitance for dense designs.
• Thermal durability: Rated for operation to +105 °C with 2000 hours endurance at that temperature, supporting higher ambient designs.
• Effective ripple handling: Defined low‑ and high‑frequency ripple current ratings (80 mA at 120 Hz, 160 mA at 10 kHz) help manage AC stress on power rails.
• Low leakage and controlled dissipation: Leakage current specified at 3 µA and tan δ characterized at 120 Hz for predictable power loss and charge retention.
• Assembly ready: Supplied in embossed carrier tape for compatibility with automatic mounting equipment and SMD manufacturing flows.

Why Choose UCL0J220MCL1GS?

UCL0J220MCL1GS positions itself as a compact, low‑impedance aluminum electrolytic solution for designs that require verified endurance, wide operating temperature, and automotive‑grade qualification. Its combination of 22 µF capacitance at 6.3 V, defined ripple current capability, and AEC‑Q200 qualification makes it a practical choice for engineers addressing reliability and space constraints.

This part is well suited to design teams building robust power delivery and decoupling networks in automotive and industrial electronics, and for production lines using automated SMD assembly. The specified endurance and RoHS compliance support long‑term product reliability and regulatory requirements.

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