UCL0J182MNL1GS
| Part Description |
1800 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,557 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCL |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 1.8 mF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.05 cm | HTS Code | 8532.22.0020 | ||
| Impedance | 80 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 850 mA @ 10 kHz | Ripple Current Low Frequency | 425 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 10 mm | Surface Mount Land Size | 10.3 x 10.3 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of UCL0J182MNL1GS – Surface‑Mount Aluminum Electrolytic Capacitor, 1800 µF, 6.3 V
The UCL0J182MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor in a surface‑mount can package, engineered for high‑capacitance bulk decoupling in compact PCB footprints. Designed for demanding thermal and ripple environments, it targets electronic power subsystems where high capacitance, ripple handling and long endurance are required.
Key use cases include automotive and industrial electronics that require AEC‑Q200 reliability, extended life at elevated temperatures, and robust ripple performance in small SMD form factors.
Key Features
- Capacitance and Voltage — 1.8 mF (1800 µF) rated at 6.3 V for substantial bulk energy storage in low‑voltage power rails.
- Low Impedance — Designed as a low‑impedance chip type with a specified impedance of 80 mΩ to support stable power delivery and reduced voltage ripple.
- High Ripple Current Capability — Low‑frequency ripple current of 425 mA (120 Hz) and high‑frequency ripple current of 850 mA (10 kHz) to handle dynamic load conditions.
- Dielectric Loss (tan δ) — tan δ (DF) 0.26 measured at 20°C, 120 Hz, providing a quantified loss characteristic for AC applications.
- Wide Temperature Range & Endurance — Rated for operation from −55°C to 105°C with endurance of 2000 hours at 105°C, supporting high‑temperature deployments.
- Leakage Current & Tolerance — Specified leakage current 113.4 µA and capacitance tolerance of −20% to +20% for predictable behavior in designs.
- Package & Assembly — Chip/can SMD package (φ10 × 10 mm) supplied in embossed carrier taping for automated placement; surface‑mount mounting type.
- Qualification — AEC‑Q200 rated, suitable for applications requiring established component reliability standards.
Typical Applications
- Automotive electronics — Bulk decoupling and smoothing on low‑voltage rails in control modules and electronic subsystems where AEC‑Q200 qualification and high endurance are needed.
- Power supply filtering — Output filtering and energy storage for DC‑DC converters and regulators that require high capacitance and substantial ripple handling.
- Industrial control — Power buffering and transient suppression in industrial controllers and embedded power modules operating across wide temperature ranges.
Unique Advantages
- High capacitance in a compact SMD can: 1800 µF in a φ10 × 10 mm package delivers significant bulk energy without large board area.
- Measured low impedance (80 mΩ): Supports cleaner power rails and reduced voltage drop under load.
- Robust ripple performance: Rated ripple currents of 425 mA (120 Hz) and 850 mA (10 kHz) allow the capacitor to handle both low‑ and high‑frequency AC components.
- Extended high‑temperature life: 2000 hours at 105°C and an operating range down to −55°C provide durability in thermal stress environments.
- AEC‑Q200 rating: Enables deployment in systems that require recognized component reliability standards for automotive and similar applications.
- Tape‑and‑reel friendly packaging: Embossed carrier taping supports automated assembly processes for volume production.
Why Choose UCL0J182MNL1GS?
The UCL0J182MNL1GS positions itself as a reliable, high‑capacitance SMD solution for power management in temperature‑stressed and ripple‑intensive environments. Combining 1800 µF of storage with low impedance, quantified loss characteristics and high ripple capability, it is well suited to engineers designing compact power rails and energy buffering stages.
Its AEC‑Q200 rating, 2000‑hour endurance at 105°C and embossed carrier taping make it appropriate for production‑scale applications where long‑term robustness and automated assembly are priorities.
Request a quote or submit an inquiry for UCL0J182MNL1GS to discuss pricing, availability and lead times for your next design.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016