UCX1A331MCL6GS
| Part Description |
330 µF 10 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 876 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCX |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 330 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 200 mOhm @ 100 kHz | Height Seated (Max) | 1.05 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 135°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 135°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 270 mA @ 10 kHz | Ripple Current Low Frequency | 135 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 10 V |
Overview of UCX1A331MCL6GS – 330 µF, 10 V High‑Temperature SMD Aluminum Electrolytic Capacitor
The UCX1A331MCL6GS is a chip‑type aluminum electrolytic capacitor designed for high‑temperature operation up to +135°C. It delivers 330 µF at 10 V in a compact surface‑mount package compatible with carrier‑tape automated assembly.
Targeted for demanding environments, the device combines a high operating temperature range, explicit low‑temperature ESR characterization, and AEC‑Q200 qualification, making it suitable for designs that require reliable bulk capacitance and thermal endurance.
Key Features
- Capacitance & Voltage — 330 µF nominal capacitance at a rated voltage of 10 V with a tolerance of −20% to +20% (±20% at 120 Hz, 20°C).
- High‑Temperature Rating — Rated operating temperature range of −40°C to +135°C with an endurance specification of 2000 hours at 135°C.
- Low‑temperature ESR Specification — ESR characterized (200 mΩ at 100 kHz) and an added ESR specification after the −40°C test, helping predict performance across temperature extremes.
- Ripple Current Performance — Rated ripple currents of 135 mA at 120 Hz and 270 mA at 10 kHz for decoupling and smoothing in power paths.
- Surface‑Mount Chip Package — Chip (radial, can‑SMD) package designed for surface mount placement; compatible with automatic mounting machines fed by carrier tape. Recommended PCB land size: 8.3 × 8.3 mm.
- Reliability & Compliance — AEC‑Q200 qualified and RoHS compliant for regulated environments and long‑term reliability requirements.
Typical Applications
- Automotive electronics — Bulk smoothing and decoupling in modules and systems that require AEC‑Q200 qualification and operation at elevated temperatures.
- High‑temperature power modules — Local energy storage and transient suppression in boards exposed to sustained high ambient temperature.
- Automated SMT production — Surface‑mount chip form factor and carrier‑tape compatibility for efficient pick‑and‑place assembly in volume manufacturing.
Unique Advantages
- Designed for elevated temperatures — Rated to −40°C to +135°C with a 2000‑hour endurance at 135°C, supporting prolonged operation in hot environments.
- AEC‑Q200 qualification — Explicit qualification for applications requiring automotive‑grade reliability and traceable performance expectations.
- Characterized ESR at low temperature — ESR specified (200 mΩ at 100 kHz) with post‑−40°C test data to help validate performance in cold starts and wide thermal cycles.
- SMD form factor for automated assembly — Chip‑type, can‑SMD package and carrier‑tape compatibility reduce assembly complexity and accelerate production flow.
- Practical ripple handling — Specified ripple currents at both 120 Hz and 10 kHz to support filtering and decoupling across a range of power applications.
- Regulatory compliance — RoHS compliant for use in regulated product lines and global markets.
Why Choose UCX1A331MCL6GS?
The UCX1A331MCL6GS is positioned for engineers who need a robust, high‑temperature aluminum electrolytic capacitor in a surface‑mount chip package. With a 330 µF capacitance at 10 V, explicit low‑temperature ESR characterization, and long‑term endurance at 135°C, it addresses applications that demand thermal resilience and predictable electrical behavior.
Combined with AEC‑Q200 qualification and carrier‑tape compatibility for automated assembly, this part delivers a balance of performance, manufacturability, and regulatory compliance for designs in automotive and other high‑temperature environments.
Request a quote or submit an inquiry to our sales team for pricing, availability, and lead‑time information for UCX1A331MCL6GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016