UCX1A331MCL6GS

CAP ALUM 330UF ±20% 10V SMD
Part Description

330 µF 10 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 876 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCX
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance330 µFECCNEAR99
ESR200 mOhm @ 100 kHzHeight Seated (Max)1.05 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 135°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 135°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency270 mA @ 10 kHzRipple Current Low Frequency135 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension10 x 8 mmSurface Mount Land Size8.3 x 8.3 mm
Tolerance-20%~20%Voltage10 V

Overview of UCX1A331MCL6GS – 330 µF, 10 V High‑Temperature SMD Aluminum Electrolytic Capacitor

The UCX1A331MCL6GS is a chip‑type aluminum electrolytic capacitor designed for high‑temperature operation up to +135°C. It delivers 330 µF at 10 V in a compact surface‑mount package compatible with carrier‑tape automated assembly.

Targeted for demanding environments, the device combines a high operating temperature range, explicit low‑temperature ESR characterization, and AEC‑Q200 qualification, making it suitable for designs that require reliable bulk capacitance and thermal endurance.

Key Features

  • Capacitance & Voltage — 330 µF nominal capacitance at a rated voltage of 10 V with a tolerance of −20% to +20% (±20% at 120 Hz, 20°C).
  • High‑Temperature Rating — Rated operating temperature range of −40°C to +135°C with an endurance specification of 2000 hours at 135°C.
  • Low‑temperature ESR Specification — ESR characterized (200 mΩ at 100 kHz) and an added ESR specification after the −40°C test, helping predict performance across temperature extremes.
  • Ripple Current Performance — Rated ripple currents of 135 mA at 120 Hz and 270 mA at 10 kHz for decoupling and smoothing in power paths.
  • Surface‑Mount Chip Package — Chip (radial, can‑SMD) package designed for surface mount placement; compatible with automatic mounting machines fed by carrier tape. Recommended PCB land size: 8.3 × 8.3 mm.
  • Reliability & Compliance — AEC‑Q200 qualified and RoHS compliant for regulated environments and long‑term reliability requirements.

Typical Applications

  • Automotive electronics — Bulk smoothing and decoupling in modules and systems that require AEC‑Q200 qualification and operation at elevated temperatures.
  • High‑temperature power modules — Local energy storage and transient suppression in boards exposed to sustained high ambient temperature.
  • Automated SMT production — Surface‑mount chip form factor and carrier‑tape compatibility for efficient pick‑and‑place assembly in volume manufacturing.

Unique Advantages

  • Designed for elevated temperatures — Rated to −40°C to +135°C with a 2000‑hour endurance at 135°C, supporting prolonged operation in hot environments.
  • AEC‑Q200 qualification — Explicit qualification for applications requiring automotive‑grade reliability and traceable performance expectations.
  • Characterized ESR at low temperature — ESR specified (200 mΩ at 100 kHz) with post‑−40°C test data to help validate performance in cold starts and wide thermal cycles.
  • SMD form factor for automated assembly — Chip‑type, can‑SMD package and carrier‑tape compatibility reduce assembly complexity and accelerate production flow.
  • Practical ripple handling — Specified ripple currents at both 120 Hz and 10 kHz to support filtering and decoupling across a range of power applications.
  • Regulatory compliance — RoHS compliant for use in regulated product lines and global markets.

Why Choose UCX1A331MCL6GS?

The UCX1A331MCL6GS is positioned for engineers who need a robust, high‑temperature aluminum electrolytic capacitor in a surface‑mount chip package. With a 330 µF capacitance at 10 V, explicit low‑temperature ESR characterization, and long‑term endurance at 135°C, it addresses applications that demand thermal resilience and predictable electrical behavior.

Combined with AEC‑Q200 qualification and carrier‑tape compatibility for automated assembly, this part delivers a balance of performance, manufacturability, and regulatory compliance for designs in automotive and other high‑temperature environments.

Request a quote or submit an inquiry to our sales team for pricing, availability, and lead‑time information for UCX1A331MCL6GS.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


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