XCVU095-2FFVA2104E

The XCVU095-2FFVA2104E is a Virtex® UltraScale™ field programmable gate array (FPGA) in a 2104-FCBGA package. It provides high logic capacity and substantial on-chip memory for designs that require large programmable logic resources and extensive embedded RAM.

Key physical and operational attributes include a 2104-BBGA (47.5 × 47.5 mm) package, surface-mount mounting, an extended grade operating range, and RoHS compliance.

Key Features

• Core Logic Density  1,176,000 logic elements (cells) for implementing large-scale programmable logic designs.
• Embedded Memory  Approximately 62.26 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
• I/O Capability  832 I/O pins to support wide external interfacing and high-pin-count system integration.
• Package & Mounting  2104-FCBGA (2104-BBGA) supplier package with 47.5 × 47.5 mm footprint; surface mount for board-level integration.
• Power Supply Range  Specified core/voltage operation between 922 mV and 979 mV to match platform power planning requirements.
• Operating Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for applications within that thermal envelope.
• Environmental Compliance  RoHS-compliant for adherence to common environmental restrictions in electronic assembly.

Typical Applications

• High-density programmable logic systems  Implement complex custom logic and large finite-state machines using the device’s high logic-element count.
• Memory-intensive designs  Use the approximately 62.26 Mbits of on-chip RAM for buffering, packet processing, and large lookup tables.
• I/O-heavy platforms  Integrate numerous peripherals and external interfaces leveraging 832 available I/O pins.

Unique Advantages

• Substantial logic capacity:  1,176,000 logic elements enable consolidation of large designs into a single FPGA, reducing board-level complexity.
• Significant embedded memory:  Approximately 62.26 Mbits of on-chip RAM supports data buffering and on-chip data structures without external memory.
• High I/O count:  832 I/O pins allow flexible interfacing and integration with high-pin-count peripherals or parallel buses.
• Compact high-density packaging:  2104-FCBGA (47.5 × 47.5 mm) package provides a high-pin-density solution suitable for space-constrained PCB layouts.
• Design-grade reliability:  Extended grade rating and RoHS compliance align with deployment in systems operating within 0 °C to 100 °C.

Why Choose XCVU095-2FFVA2104E?

The XCVU095-2FFVA2104E positions itself as a high-capacity FPGA option for designs that need extensive programmable logic, large amounts of on-chip RAM, and a high I/O count in a compact BGA footprint. Its extended-grade rating and RoHS compliance support deployment in applications that operate within the specified 0 °C to 100 °C temperature range.

This device is well suited for engineers looking to consolidate complex logic and memory-intensive functions onto a single FPGA package while managing board real estate with a 2104-FCBGA surface-mount solution and planning for a defined supply voltage window of 922 mV to 979 mV.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XCVU095-2FFVA2104E. Our team can provide a formal quote tailored to your project requirements.