XCVU080-2FFVD1517E

The XCVU080-2FFVD1517E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC offering high logic density and substantial on‑chip memory. The device provides 975,000 logic elements and approximately 51.2 Mbits of embedded memory in a 1517‑FCBGA package.

With 338 I/O, a supply voltage range of 922 mV to 979 mV, an operating temperature range of 0 °C to 100 °C, and an Extended grade, this FPGA is suited for designs that require large programmable logic capacity, significant embedded RAM, and a compact surface‑mount BGA package.

Key Features

• Core Logic  975,000 logic elements provide large-scale programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support buffering, look‑up tables, and data storage within the FPGA fabric.
• I/O Count  338 I/O pins to support multiple external interfaces and system connectivity.
• Power  Voltage supply range from 922 mV to 979 mV to match system power-rail requirements.
• Package & Mounting  1517‑FCBGA (40 × 40) package, surface mount for compact board-level integration.
• Temperature & Grade  Operating range 0 °C to 100 °C and Extended grade classification; RoHS compliant.

Typical Applications

• High‑density digital systems  Use the large logic element count and on‑chip RAM to implement complex programmable logic and custom processing pipelines.
• Data buffering and memory‑intensive designs  Approximately 51.2 Mbits of embedded memory supports buffering, packet handling, and intermediate data storage.
• Multi‑interface platforms  338 I/O pins enable integration with multiple external peripherals, sensors, and interface standards on a single FPGA.

Unique Advantages

• High logic density: 975,000 logic elements enable consolidation of larger functions into a single device, reducing component count.
• Significant on‑chip memory: Approximately 51.2 Mbits of RAM reduces dependency on external memory for many buffering and data‑processing tasks.
• Flexible I/O capacity: 338 I/O pins provide headroom for extensive system interfacing without immediate need for I/O expanders.
• Compact BGA packaging: 1517‑FCBGA (40 × 40) surface‑mount package supports dense PCB implementations while maintaining high integration.
• Defined operating window: Supply voltage range (922 mV–979 mV) and operating temperature (0 °C–100 °C) provide clear system integration boundaries.
• Compliance: RoHS compliant and available in Extended grade for specified environmental requirements.

Why Choose XCVU080-2FFVD1517E?

The XCVU080-2FFVD1517E positions itself as a high‑capacity programmable logic device for designs that require extensive logic resources, substantial on‑chip RAM, and a large number of I/O signals in a compact FCBGA footprint. Its specified supply voltage range, operating temperature window, and Extended grade classification make it suitable for engineered systems where these explicit parameters match the design requirements.

For developers and procurement teams seeking scalability and consolidation of complex logic functions into a single FPGA package, this device offers a combination of logic density, embedded memory, and I/O capacity that supports substantial integration while remaining RoHS compliant.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XCVU080-2FFVD1517E.