XCVU065-H1FFVC1517E

The XCVU065-H1FFVC1517E is a Virtex® UltraScale™ field programmable gate array (FPGA) IC designed for high-density programmable logic designs. It combines a large logic capacity with substantial on-chip memory and a high I/O count to support complex digital systems.

Key attributes include 783,300 logic elements, approximately 45.36 Mbits of embedded memory, 520 I/O pins, a 1517-FCBGA (40×40) surface-mount package, and extended-grade operating range, making it suitable for demanding designs that require integration and scalability.

Key Features

• Logic Density  Provides 783,300 logic elements to implement large, complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 45.36 Mbits of on-chip RAM for buffering, packet processing, and intermediate data storage within the FPGA fabric.
• I/O Capacity  520 user I/O pins to support wide bus interfaces, multiple high-density connections, and flexible board-level integration.
• Package & Mounting  1517-FCBGA (40×40) package in a surface-mount format for high pin-count designs and compact PCB layouts.
• Power Supply Range  Core voltage range from 0.922 V to 1.03 V to match system power rails and regulator designs.
• Operating Temperature  Extended-grade operation from 0°C to 100°C for a broad range of commercial and industrial ambient conditions.
• Regulatory Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements for many markets.

Typical Applications

• High-density digital systems  Ideal for implementations that require large programmable logic capacity and extensive on-chip memory, enabled by 783,300 logic elements and ~45.36 Mbits of RAM.
• Multi-channel I/O platforms  Well-suited to designs needing many external interfaces or wide parallel buses, leveraging 520 I/O pins.
• Compact, high-pin-count boards  The 1517-FCBGA (40×40) surface-mount package enables dense board-level integration in space-constrained systems.

Unique Advantages

• High integration density: Large logic and memory resources reduce the need for external components and simplify system architecture.
• Scalable I/O: 520 I/O pins provide flexibility for diverse interface requirements and multi-channel connectivity.
• Compact package: 1517-FCBGA (40×40) package supports high pin counts in a compact form factor for efficient PCB designs.
• Broad operating range: Extended 0°C to 100°C range and RoHS compliance help accommodate a wide set of deployment environments and manufacturing requirements.
• Defined core voltage window: 0.922 V to 1.03 V supply range aligns with modern power architectures for predictable integration.

Why Choose XCVU065-H1FFVC1517E?

The XCVU065-H1FFVC1517E delivers a high-capacity, highly integrated FPGA solution from the Virtex® UltraScale™ family, combining substantial logic resources, significant embedded memory, and a large I/O complement in a compact FCBGA package. It is positioned for engineers and procurement teams building complex digital systems that demand on-chip resources and flexible interfacing.

This part offers scalability for advanced designs while maintaining clear electrical and thermal operating parameters—making it a practical choice for projects that require high logic density, ample embedded RAM, and a high pin-count package backed by an established FPGA product family.

Request a quote or submit a procurement inquiry today to evaluate XCVU065-H1FFVC1517E for your next high-density programmable logic design.