XCV812E-8BG560C

The XCV812E-8BG560C is a Virtex®-E EM Field Programmable Gate Array (FPGA) IC designed for commercial embedded applications. It combines substantial logic capacity, on-chip memory, and a high I/O count in a compact 560-ball L-BGA package for surface-mount assembly.

This device delivers a balanced set of resources—logic elements, embedded RAM, and I/O—along with defined supply and thermal limits to support reliable operation in commercial environments.

Key Features

• Core / Logic: 21,168 logic elements (cells) and 254,016 logic gates, implemented across 4,704 configurable logic blocks, providing significant digital capacity for custom logic implementations.
• Embedded Memory: Approximately 1.15 Mbits of on-chip RAM (1,146,880 total bits) for buffering, FIFOs, and local data storage without external memory.
• I/O Count: 404 dedicated I/O pins to support a wide range of external interfaces and parallel connections.
• Power: Defined core supply range of 1.71 V to 1.89 V for predictable power design and supply sequencing.
• Package & Mounting: 560-LBGA exposed pad, metal package (supplier package 560-MBGA, 42.5 × 42.5 mm) designed for surface-mount assembly and thermal conduction through the exposed pad.
• Operating Range & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Embedded processing platforms: Use on-chip logic and RAM to implement custom processing engines and control logic within commercial embedded systems.
• I/O-intensive interface hubs: High I/O count supports bridging and aggregation of multiple peripheral and sensor interfaces.
• Custom digital signal tasks: Logic density and on-chip memory enable implementation of custom data-paths, buffering, and protocol handling.

Unique Advantages

• High logic density: 21,168 logic elements and over 250K equivalent gates enable complex digital designs without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 1.15 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage needs.
• Large I/O capability: 404 I/O pins make the device suitable for designs requiring extensive external connectivity and parallel interfaces.
• Thermally-aware package: 560-LBGA with an exposed pad supports effective thermal conduction in surface-mount assemblies.
• Commercial readiness and compliance: Grade and RoHS status align the device with typical commercial product development and regulatory needs.

Why Choose XCV812E-8BG560C?

The XCV812E-8BG560C positions itself as a commercial-grade Virtex®-E FPGA that balances logic capacity, embedded memory, and high I/O in a single 560-ball L-BGA package. Its specified supply range and operating temperature make it suitable for a broad set of commercial embedded designs that require predictable electrical and thermal characteristics.

Choose this device when you need a mid-to-high density FPGA solution with ample on-chip RAM and extensive external connectivity for custom digital processing, interface bridging, or complex control tasks—providing scalability and integration within a compact surface-mount footprint.

Request a quote or submit an RFQ to receive pricing and availability information for the XCV812E-8BG560C.