XCVU080-2FFVA2104E

The XCVU080-2FFVA2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) supplied in a 2104-ball FCBGA package. It delivers high on-chip logic capacity and I/O density with a substantial amount of embedded RAM, suitable for designs that require large-scale programmable logic and extensive connectivity.

Key attributes include 975,000 logic elements, approximately 51.2 Mbits of embedded memory, and 832 general-purpose I/O, packaged in a 2104-FCBGA (47.5 × 47.5 mm) form factor with an extended-grade operating range.

Key Features

• Core Logic  975,000 logic elements provide high-density programmable logic for complex implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic.
• I/O  832 available I/O pins for extensive external interfacing and system-level connectivity.
• Package  2104-FCBGA supplier package (47.5 × 47.5 mm) delivered as a 2104-BBGA, FCBGA package case suitable for high-density board designs.
• Power  Core voltage supply range specified from 922 mV to 979 mV for power budgeting and supply design.
• Thermal and Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Mounting and Compliance  Surface mount device with RoHS-compliant status for regulatory alignment.

Typical Applications

• High-density digital processing  Implement large-scale programmable logic functions where extensive logic elements and embedded memory are required.
• Hardware acceleration  Use the device’s logic capacity and on-chip RAM to offload compute-intensive tasks into programmable hardware.
• I/O-intensive systems  Leverage 832 I/O pins to interface with multiple peripherals, sensors, or high-speed data lanes in complex systems.
• Prototype and system integration  Suitable for designs that need a high degree of reconfigurability and dense integration in a single package.

Unique Advantages

• High logic density: 975,000 logic elements allow for large and complex designs to be implemented on a single FPGA.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports memory-heavy functions without immediate external RAM dependency.
• Extensive I/O: 832 I/O pins provide broad connectivity options to reduce the need for external interfacing components.
• Compact, high-pin-count package: The 2104-FCBGA (47.5 × 47.5 mm) package balances board area with high integration for system-level consolidation.
• Defined power envelope: A specified core supply range of 922 mV to 979 mV aids precise power-supply design and validation.
• RoHS-compliant, extended grade: RoHS compliance and a 0 °C to 100 °C operating range support regulatory and thermal planning requirements.

Why Choose XCVU080-2FFVA2104E?

The XCVU080-2FFVA2104E positions itself as a high-capacity, highly connected programmable logic device that brings together significant logic resources, large embedded memory, and a high I/O count in a single 2104-FCBGA package. Its electrical and thermal specifications support integration into designs that require precise power management and extended operating temperatures.

This device is well suited for development teams and system designers who need scalability in logic and memory resources, along with broad connectivity, enabling consolidation of functions and streamlined board-level integration while maintaining compliance with RoHS requirements.

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