XCVU080-2FFVB2104E

The XCVU080-2FFVB2104E is a Virtex® UltraScale™ field programmable gate array (FPGA) IC from AMD. It delivers high logic capacity, substantial embedded memory, and a large I/O complement in a 2104-ball FCBGA package for surface-mount applications.

With 975,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 702 I/O pins, this device is intended for designs that require dense programmable logic, significant on-chip memory, and extensive external connectivity while operating within the specified supply and temperature ranges.

Key Features

• Logic Capacity  Contains 975,000 logic elements to support complex, high-density logic implementations.
• Configurable Logic Blocks  Built with 55,714 CLBs to organize and structure programmable logic resources across designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and local storage of intermediate data.
• I/O Density  702 I/O pins provide broad external connectivity for multi-channel interfaces and large system integrations.
• Package  2104-BBGA / 2104-FCBGA package (2104-FCBGA (47.5x47.5)) optimized for high-pin-count surface-mount mounting.
• Power  Specified operating core voltage range from 922 mV to 979 mV to match system power-rail requirements.
• Operating Range  Grade: Extended. Rated for operation from 0 °C to 100 °C for a range of commercial and extended-temperature applications.
• Mounting and Compliance  Surface-mount device with RoHS compliance for lead-free assembly processes.

Typical Applications

• High-density digital signal processing  Leverage the large logic element count and embedded RAM for compute-heavy signal processing pipelines and stream processing tasks.
• Multi-channel interface aggregation  Use the 702 I/O pins to aggregate and manage numerous high-pin-count interfaces in communication and networking equipment.
• Complex control and instrumentation  Implement sophisticated control logic and local data buffering where significant on-chip memory and logic resources reduce external component count.

Unique Advantages

• High logic density: 975,000 logic elements enable implementation of large-scale, integrated FPGA designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 51.2 Mbits of RAM supports deep buffering and on-chip data handling to minimize external memory dependency.
• Extensive I/O availability: 702 I/O pins allow flexible connectivity for multi-channel systems, reducing the need for external I/O expanders.
• Compact high-pin-count package: The 2104-FCBGA form factor consolidates many signals in a single surface-mount package for dense board layouts.
• Controlled power window: Operation across a defined 922 mV–979 mV supply range aids predictable power design and regulation planning.
• RoHS-compliant and extended grade: Ready for lead-free assembly and rated for extended operating temperatures to fit a variety of system environments.

Why Choose XCVU080-2FFVB2104E?

The XCVU080-2FFVB2104E positions itself as a high-capacity FPGA solution that balances large programmable logic resources, significant on-chip RAM, and a broad I/O complement in a single 2104-ball FCBGA surface-mount package. Its specified voltage and temperature ranges, combined with RoHS compliance and extended-grade rating, make it suitable for engineers targeting dense, I/O-rich FPGA implementations.

This device is well suited to teams developing complex digital systems that require on-chip memory, high logic density, and many external interfaces, offering a scalable platform for consolidating system functions and reducing external component count.

Request a quote or submit an inquiry for pricing and availability of the XCVU080-2FFVB2104E to evaluate its fit for your next high-density FPGA design.