XCVU080-1FFVA2104I

IC FPGA 832 I/O 2104FCBGA
Part Description

Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC 832 51200000 975000 2104-BBGA, FCBGA

Quantity 775 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package2104-FCBGA (47.5x47.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2104-BBGA, FCBGANumber of I/O832Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs55714Number of Logic Elements/Cells975000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of XCVU080-1FFVA2104I – Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC

The XCVU080-1FFVA2104I is a Virtex® UltraScale™ field programmable gate array (FPGA) IC from AMD, supplied in a 2104-FCBGA package. It delivers a combination of large logic capacity, substantial embedded memory, and a high I/O count for demanding industrial embedded designs.

Key Features

  • Core Logic 975,000 logic elements provide substantial on-chip programmability for complex digital functions and custom logic implementation.
  • Embedded Memory Approximately 51.2 Mbits of total on-chip RAM to support buffering, lookup tables, and data-path storage requirements.
  • I/O Capacity 832 user I/O pins to accommodate parallel interfaces, multi-channel peripherals, and extensive board-level connectivity.
  • Package 2104-BBGA (2104-FCBGA, 47.5 × 47.5 mm) surface-mount package suitable for dense board integration.
  • Power Core supply range specified at 0.922 V to 0.979 V, enabling defined power delivery for the FPGA core.
  • Operating Range Industrial-grade operating temperature from −40 °C to 100 °C for use in thermally challenging environments.
  • Mounting Surface-mount construction for standard PCB assembly processes.
  • Compliance RoHS-compliant to support environmentally conscious assembly and regulatory requirements.

Unique Advantages

  • High logic capacity: 975,000 logic elements enable implementation of large-scale, custom logic and complex FPGA designs without partitioning.
  • Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces reliance on external memory for many buffering and data-path needs.
  • Extensive I/O resources: 832 I/Os support wide parallel interfaces and multiple peripheral channels, simplifying board-level design.
  • Industrial temperature grade: Rated from −40 °C to 100 °C to meet extended environmental requirements in industrial applications.
  • Dense, board-friendly package: 2104-FCBGA (47.5 × 47.5 mm) provides a compact footprint for high-density system designs.
  • Manufacturer pedigree: Supplied by AMD as part of the Virtex® UltraScale™ family for customers tracking vendor product lines.

Why Choose XCVU080-1FFVA2104I?

The XCVU080-1FFVA2104I positions itself where large programmable logic capacity, significant embedded memory, and a high I/O count are required in an industrial-temperature FPGA. Its combination of 975,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 832 I/Os in a 2104-FCBGA package makes it suitable for engineers designing complex embedded systems that need substantial integration on a single device.

For development and production programs that demand defined power supply ranges and broad operating temperature margins, this AMD Virtex® UltraScale™ device provides clear, verifiable specifications to guide system architecture and thermal/power design decisions.

Request a quote or submit an RFQ to receive pricing, lead-time, and ordering details for the XCVU080-1FFVA2104I. Provide your quantity and required delivery timelines for a tailored response.

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