XCV812E-7BG560C

The XCV812E-7BG560C is a Virtex®-E EM field programmable gate array (FPGA) IC providing high-density logic and on-chip memory in a 560-ball L-BGA exposed pad package. The device offers 21,168 logic elements, approximately 1.15 Mbits of embedded RAM, and 404 I/O pins, making it suitable for designs that require substantial logic capacity and I/O integration.

Packaged in a 560-MBGA (42.5 × 42.5 mm) surface-mount case with a metal exposed pad, the device operates from a 1.71 V to 1.89 V core supply and is rated for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Core Logic Capacity  Contains 21,168 logic elements and approximately 254,016 gates for implementing complex digital logic.
• Embedded Memory  Total on-chip RAM is 1,146,880 bits (approximately 1.15 Mbits) to support buffering, storage, and state-machine resources.
• I/O and Connectivity  Provides 404 I/O pins to support broad external interfacing requirements.
• Package and Mounting  560-LBGA exposed pad, metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
• Power  Core voltage supply range of 1.71 V to 1.89 V.
• Temperature and Grade  Commercial operating temperature range from 0 °C to 85 °C; commercial grade device.
• Regulatory  RoHS compliant.

Typical Applications

• Digital Logic Integration: Implement complex logic functions and custom digital circuits using the device's 21,168 logic elements and on-chip RAM.
• High-I/O Systems: Use the 404 I/O pins for multi-signal interfacing, board-level integration, and extensive peripheral connectivity.
• Prototyping and Development: Leverage the programmable fabric and embedded memory for iterative hardware development and validation.

Unique Advantages

• High Logic Density: 21,168 logic elements provide substantial capacity for large or partitioned designs.
• Significant On-Chip Memory: Approximately 1.15 Mbits of embedded RAM reduces reliance on external memory for many designs.
• Extensive I/O Count: 404 I/Os allow flexible interfacing with multiple peripherals and subsystems.
• Compact, Serviceable Package: 560-LBGA exposed pad with a 42.5 × 42.5 mm footprint supports surface-mount assembly and thermal management via the exposed pad.
• Controlled Power Envelope: Narrow core voltage range (1.71 V–1.89 V) facilitates predictable power design.
• Compliance and Grade: RoHS compliance and commercial temperature rating align with standard electronic product requirements.

Why Choose XCV812E-7BG560C?

The XCV812E-7BG560C delivers a balance of logic capacity, on-chip memory, and high I/O density in a 560-ball L-BGA exposed pad package. Its specifications—21,168 logic elements, approximately 1.15 Mbits of RAM, 404 I/Os, and a 42.5 × 42.5 mm 560-MBGA package—address designs that require integrated digital resources and significant external interfacing within a commercial temperature range.

This device is suited to engineering teams and procurement looking for a RoHS-compliant, surface-mount FPGA option that provides predictable power requirements and a compact mechanical footprint for board-level implementation.

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