XCV800-6FG676C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 444 114688 21168 676-BGA |
|---|---|
| Quantity | 994 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 444 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4704 | Number of Logic Elements/Cells | 21168 | ||
| Number of Gates | 888439 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV800-6FG676C – Virtex® FPGA 676-FBGA (2.375–2.625 V)
The XCV800-6FG676C is a Virtex® SRAM-based Field Programmable Gate Array from AMD offering a high-density, reprogrammable logic fabric for system-level designs. Built on a 0.22 µm, five-layer-metal process, this device targets high-performance, high-capacity programmable logic applications requiring extensive I/O and embedded memory.
With 21,168 logic elements, approximately 114,688 bits of embedded RAM, and 444 user I/Os in a 676-BGA (27 × 27 mm) package, the XCV800-6FG676C is suited for board- and system-level designs that demand flexible memory structures, advanced clock management, and in-system reprogrammability.
Key Features
- Logic Density — 21,168 logic elements and 888,439 system gates provide substantial capacity for complex custom logic and glue functions.
- Embedded Memory — Approximately 114,688 bits of on-chip RAM with configurable LUT-based RAM and 4k-bit synchronous dual-ported RAM options to support buffering and local storage.
- I/O Capability — 444 user I/Os enable high-pin-count board-level interfacing for multi-channel and multi-protocol designs.
- Clock Management — Four dedicated delay-locked loops (DLLs) plus multiple global and local clock nets for advanced clock control and low-skew distribution.
- High-performance Architecture — Dedicated carry logic, multiplier support, cascade chains, and abundant registers/latches for arithmetic and wide-input functions.
- Flexible Configuration — SRAM-based in-system configuration with unlimited re-programmability and four programming modes for development and field updates.
- Package & Mounting — 676-FBGA (27 × 27 mm) surface-mount package suitable for dense board integration.
- Electrical & Environmental — Voltage supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
- Manufacturing & Quality — Fabricated in a 0.22 µm CMOS process with five metal layers and 100% factory-tested devices.
Typical Applications
- PCI and CompactPCI Systems — Support for 66-MHz PCI and hot-swappable CompactPCI configurations enables use in legacy and embedded bus architectures.
- High-density Custom Logic — Large logic and gate count for mid- to high-complexity custom processing, protocol bridging, and control logic.
- Memory Interface and Buffering — Hierarchical on-chip memory and fast external RAM interfaces for implementing custom memory controllers and buffering logic.
- Board-level Prototyping — High I/O count and reprogrammability make the device suitable for prototyping system functions and iterating designs in the lab or production environment.
Unique Advantages
- High integration density: 21,168 logic elements and 888,439 gates reduce the need for multiple discrete devices in medium- to large-scale designs.
- Comprehensive memory options: Approximately 114,688 bits of embedded RAM and configurable LUT RAM provide flexible storage architectures for data path and buffering needs.
- Extensive I/O: 444 I/Os support complex board-level interfacing and multi-channel applications without external I/O expanders.
- Advanced clock control: Multiple DLLs and global/local clock nets enable precise timing control across large designs.
- In-system reprogrammability: SRAM-based configuration with multiple programming modes supports rapid firmware updates and field revisions.
- Proven process and testing: 0.22 µm, five-layer-metal manufacturing and 100% factory testing help ensure predictable, production-ready units.
Why Choose XCV800-6FG676C?
The XCV800-6FG676C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 676-FBGA package, making it well suited for developers and OEMs implementing medium- to high-complexity programmable logic functions. Its SRAM-based architecture and multiple configuration modes enable iterative development and field updates without hardware changes.
Choose this Virtex FPGA when your design requires flexible memory structures, advanced clock management, and a high pin-count interface platform supported by a proven manufacturing and test flow.
Request a quote or submit an inquiry to receive pricing and availability for the XCV800-6FG676C. Our team can provide lead-time information and support for volume planning and deployment.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








