XCV800-6FG676C

IC FPGA 444 I/O 676FCBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 444 114688 21168 676-BGA

Quantity 994 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O444Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-6FG676C – Virtex® FPGA 676-FBGA (2.375–2.625 V)

The XCV800-6FG676C is a Virtex® SRAM-based Field Programmable Gate Array from AMD offering a high-density, reprogrammable logic fabric for system-level designs. Built on a 0.22 µm, five-layer-metal process, this device targets high-performance, high-capacity programmable logic applications requiring extensive I/O and embedded memory.

With 21,168 logic elements, approximately 114,688 bits of embedded RAM, and 444 user I/Os in a 676-BGA (27 × 27 mm) package, the XCV800-6FG676C is suited for board- and system-level designs that demand flexible memory structures, advanced clock management, and in-system reprogrammability.

Key Features

  • Logic Density — 21,168 logic elements and 888,439 system gates provide substantial capacity for complex custom logic and glue functions.
  • Embedded Memory — Approximately 114,688 bits of on-chip RAM with configurable LUT-based RAM and 4k-bit synchronous dual-ported RAM options to support buffering and local storage.
  • I/O Capability — 444 user I/Os enable high-pin-count board-level interfacing for multi-channel and multi-protocol designs.
  • Clock Management — Four dedicated delay-locked loops (DLLs) plus multiple global and local clock nets for advanced clock control and low-skew distribution.
  • High-performance Architecture — Dedicated carry logic, multiplier support, cascade chains, and abundant registers/latches for arithmetic and wide-input functions.
  • Flexible Configuration — SRAM-based in-system configuration with unlimited re-programmability and four programming modes for development and field updates.
  • Package & Mounting — 676-FBGA (27 × 27 mm) surface-mount package suitable for dense board integration.
  • Electrical & Environmental — Voltage supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
  • Manufacturing & Quality — Fabricated in a 0.22 µm CMOS process with five metal layers and 100% factory-tested devices.

Typical Applications

  • PCI and CompactPCI Systems — Support for 66-MHz PCI and hot-swappable CompactPCI configurations enables use in legacy and embedded bus architectures.
  • High-density Custom Logic — Large logic and gate count for mid- to high-complexity custom processing, protocol bridging, and control logic.
  • Memory Interface and Buffering — Hierarchical on-chip memory and fast external RAM interfaces for implementing custom memory controllers and buffering logic.
  • Board-level Prototyping — High I/O count and reprogrammability make the device suitable for prototyping system functions and iterating designs in the lab or production environment.

Unique Advantages

  • High integration density: 21,168 logic elements and 888,439 gates reduce the need for multiple discrete devices in medium- to large-scale designs.
  • Comprehensive memory options: Approximately 114,688 bits of embedded RAM and configurable LUT RAM provide flexible storage architectures for data path and buffering needs.
  • Extensive I/O: 444 I/Os support complex board-level interfacing and multi-channel applications without external I/O expanders.
  • Advanced clock control: Multiple DLLs and global/local clock nets enable precise timing control across large designs.
  • In-system reprogrammability: SRAM-based configuration with multiple programming modes supports rapid firmware updates and field revisions.
  • Proven process and testing: 0.22 µm, five-layer-metal manufacturing and 100% factory testing help ensure predictable, production-ready units.

Why Choose XCV800-6FG676C?

The XCV800-6FG676C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 676-FBGA package, making it well suited for developers and OEMs implementing medium- to high-complexity programmable logic functions. Its SRAM-based architecture and multiple configuration modes enable iterative development and field updates without hardware changes.

Choose this Virtex FPGA when your design requires flexible memory structures, advanced clock management, and a high pin-count interface platform supported by a proven manufacturing and test flow.

Request a quote or submit an inquiry to receive pricing and availability for the XCV800-6FG676C. Our team can provide lead-time information and support for volume planning and deployment.

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