XCV800-5HQ240I

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 114688 21168 240-BFQFP Exposed Pad

Quantity 1,327 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFP Exposed PadNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-5HQ240I – Virtex® FPGA, 2.375–2.625 V, 240-BFQFP Exposed Pad

The XCV800-5HQ240I is a high-density Virtex® field programmable gate array (FPGA) offering SRAM-based in-system configuration and re-programmability. It provides 21,168 logic cells, approximately 114,688 bits of embedded memory, and 166 user I/Os in a 240-pin BFQFP package for demanding industrial applications.

Designed for system-level integration, the device supports a wide operating range (2.375 V to 2.625 V) and an industrial temperature range (−40 °C to 100 °C), making it suitable for high-performance computing, interface bridging, and reconfigurable logic tasks where reliability and flexibility are required.

Key Features

  • Core logic density — 21,168 logic cells and approximately 888,439 system gates deliver substantial programmable logic capacity for complex designs.
  • Embedded memory — Approximately 114,688 bits of on-chip RAM and configurable LUT-based RAM modes support local buffering and algorithm state storage.
  • I/O and interfacing — 166 user I/Os in a 240-BFQFP exposed-pad surface-mount package enable dense board integration and multiple interface options.
  • Clock management — Built-in clock-management circuitry including multiple global and local clock distribution resources supports advanced timing architectures.
  • Configuration and flexibility — SRAM-based in-system configuration with multiple programming modes provides unlimited re-programmability for iterative development and field updates.
  • Package and mounting — 240-BFQFP exposed pad, surface-mount package (240-PQFP, 32×32) for thermal support and high-density PCB layouts.
  • Supply and temperature — Operates from 2.375 V to 2.625 V and rated for industrial temperatures (−40 °C to 100 °C) to meet robust system requirements.
  • Compliance and testing — RoHS compliant and 100% factory tested for consistent manufacturing quality.

Typical Applications

  • PCI and CompactPCI systems — 66-MHz PCI compliance and hot-swappable support make this device suitable for interface and bridge functions in PCI/CompactPCI systems.
  • High-performance logic and prototyping — Large logic capacity and re-programmability enable prototype validation and iterative system development.
  • Embedded system integration — Abundant I/O and on-chip memory support custom peripheral control, protocol translation, and glue-logic integration.
  • Signal processing and arithmetic acceleration — Dedicated arithmetic resources and flexible LUT configurations facilitate custom DSP and arithmetic implementations.

Unique Advantages

  • Substantial programmable capacity: 21,168 logic cells and ~888,439 gates provide the scale needed for complex, multi-function designs.
  • Flexible embedded memory: Approximately 114,688 bits of RAM and configurable LUT-based RAM modes simplify local buffering and state retention without external components.
  • Advanced clock and timing resources: Integrated clock-management features and multiple clock distribution nets enable precise timing control across large designs.
  • Robust industrial operating range: Rated for −40 °C to 100 °C and a defined supply range (2.375 V–2.625 V) to support reliable operation in harsh environments.
  • Board-level integration: 240-BFQFP exposed-pad package and surface-mount mounting support thermal management and compact PCB layouts.
  • Field re-programmability: SRAM-based configuration enables unlimited re-programmability and flexible in-system updates for long-term product evolution.

Why Choose XCV800-5HQ240I?

The XCV800-5HQ240I combines significant logic capacity, embedded memory, and flexible I/O in a rugged industrial package, delivering a balanced platform for reconfigurable system design. Its SRAM-based configuration and clock-management features support iterative development, system integration, and field updates while the defined voltage and temperature ranges ensure reliable operation in demanding environments.

This device is a solid choice for engineers and teams building complex interfaces, prototype platforms, or embedded compute blocks that require re-programmability, ample on-chip resources, and industrial-grade operating characteristics.

Request a quote or submit an RFQ to receive pricing and availability information for the XCV800-5HQ240I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up