XCV800-5HQ240I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 166 114688 21168 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,327 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 166 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4704 | Number of Logic Elements/Cells | 21168 | ||
| Number of Gates | 888439 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV800-5HQ240I – Virtex® FPGA, 2.375–2.625 V, 240-BFQFP Exposed Pad
The XCV800-5HQ240I is a high-density Virtex® field programmable gate array (FPGA) offering SRAM-based in-system configuration and re-programmability. It provides 21,168 logic cells, approximately 114,688 bits of embedded memory, and 166 user I/Os in a 240-pin BFQFP package for demanding industrial applications.
Designed for system-level integration, the device supports a wide operating range (2.375 V to 2.625 V) and an industrial temperature range (−40 °C to 100 °C), making it suitable for high-performance computing, interface bridging, and reconfigurable logic tasks where reliability and flexibility are required.
Key Features
- Core logic density — 21,168 logic cells and approximately 888,439 system gates deliver substantial programmable logic capacity for complex designs.
- Embedded memory — Approximately 114,688 bits of on-chip RAM and configurable LUT-based RAM modes support local buffering and algorithm state storage.
- I/O and interfacing — 166 user I/Os in a 240-BFQFP exposed-pad surface-mount package enable dense board integration and multiple interface options.
- Clock management — Built-in clock-management circuitry including multiple global and local clock distribution resources supports advanced timing architectures.
- Configuration and flexibility — SRAM-based in-system configuration with multiple programming modes provides unlimited re-programmability for iterative development and field updates.
- Package and mounting — 240-BFQFP exposed pad, surface-mount package (240-PQFP, 32×32) for thermal support and high-density PCB layouts.
- Supply and temperature — Operates from 2.375 V to 2.625 V and rated for industrial temperatures (−40 °C to 100 °C) to meet robust system requirements.
- Compliance and testing — RoHS compliant and 100% factory tested for consistent manufacturing quality.
Typical Applications
- PCI and CompactPCI systems — 66-MHz PCI compliance and hot-swappable support make this device suitable for interface and bridge functions in PCI/CompactPCI systems.
- High-performance logic and prototyping — Large logic capacity and re-programmability enable prototype validation and iterative system development.
- Embedded system integration — Abundant I/O and on-chip memory support custom peripheral control, protocol translation, and glue-logic integration.
- Signal processing and arithmetic acceleration — Dedicated arithmetic resources and flexible LUT configurations facilitate custom DSP and arithmetic implementations.
Unique Advantages
- Substantial programmable capacity: 21,168 logic cells and ~888,439 gates provide the scale needed for complex, multi-function designs.
- Flexible embedded memory: Approximately 114,688 bits of RAM and configurable LUT-based RAM modes simplify local buffering and state retention without external components.
- Advanced clock and timing resources: Integrated clock-management features and multiple clock distribution nets enable precise timing control across large designs.
- Robust industrial operating range: Rated for −40 °C to 100 °C and a defined supply range (2.375 V–2.625 V) to support reliable operation in harsh environments.
- Board-level integration: 240-BFQFP exposed-pad package and surface-mount mounting support thermal management and compact PCB layouts.
- Field re-programmability: SRAM-based configuration enables unlimited re-programmability and flexible in-system updates for long-term product evolution.
Why Choose XCV800-5HQ240I?
The XCV800-5HQ240I combines significant logic capacity, embedded memory, and flexible I/O in a rugged industrial package, delivering a balanced platform for reconfigurable system design. Its SRAM-based configuration and clock-management features support iterative development, system integration, and field updates while the defined voltage and temperature ranges ensure reliable operation in demanding environments.
This device is a solid choice for engineers and teams building complex interfaces, prototype platforms, or embedded compute blocks that require re-programmability, ample on-chip resources, and industrial-grade operating characteristics.
Request a quote or submit an RFQ to receive pricing and availability information for the XCV800-5HQ240I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








