XCV800-6BG432C

The XCV800-6BG432C is an SRAM-based Virtex FPGA offering a programmable logic platform with 21,168 logic elements and approximately 0.115 Mbits of embedded memory. Built on the Virtex family architecture, it delivers a high-density, reprogrammable solution suited for designs requiring substantial logic capacity, multi-standard I/O, and on-chip memory.

Typical use cases supported by the device include PCI-compliant expansion designs and Compact PCI hot-swappable modules, high-speed memory interface designs, and custom logic or DSP functions where reprogrammability and abundant I/O are required. The device is supplied in a 432-LBGA exposed pad metal package and is specified for commercial-grade operation (0 °C to 85 °C) with a core supply range of 2.375 V to 2.625 V.

Key Features

• Core Architecture Virtex FPGA family architecture with SRAM-based configuration and reprogrammability; built on a 0.22 μm, 5-layer-metal CMOS process.
• Logic Capacity 21,168 logic elements and approximately 888,439 system gates provide substantial programmable logic resources for complex designs.
• Embedded Memory Approximately 0.115 Mbits of on-chip RAM and configurable LUT-based RAM modes (including dual-ported and shift-register options) for flexible on-chip storage.
• I/O & Interfaces 316 available I/O pins with multi-standard SelectIO support and direct connectivity options for compatible memory devices.
• Clock & Timing Built-in clock management including four dedicated delay-locked loops (DLLs), multiple global and local clock distribution nets to support advanced timing control.
• On-chip Arithmetic & Logic Support Dedicated carry logic, multiplier support, and cascade chains to accelerate arithmetic and wide-input logic functions.
• Configuration & Reprogrammability SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (SelectMAP™, master/slave serial, JTAG).
• Package & Thermal 432-LBGA exposed pad, metal package (432-MBGA supplier package, 40 × 40) optimized for surface-mount assemblies; commercial operating range 0 °C to 85 °C.
• Manufacturing & Test 100% factory tested and supported by Xilinx development systems and libraries for design integration and verification.

Typical Applications

• PCI Expansion Cards Use in 66-MHz PCI-compliant expansion card designs where programmable logic and multiple I/O standards are needed.
• Compact PCI Modules Suitable for hot-swappable Compact PCI modules that require reconfigurable logic and reliable in-system configuration.
• High-Performance Memory Interfaces Interfaces to external high-performance RAMs and ZBTRAM-style devices, leveraging on-chip memory and fast I/O.
• Custom Logic and DSP Implement dedicated arithmetic, multiplier-heavy or wide combinational functions using built-in carry and multiplier resources.

Unique Advantages

• Substantial Logic Integration: 21,168 logic elements and ~888k system gates enable consolidation of complex digital functions into a single device, reducing BOM and board-level routing.
• Flexible On-chip Memory: Approximately 0.115 Mbits of embedded RAM with LUT-configurable RAM modes supports varied buffering and storage needs without external components.
• Advanced Clock Management: Four dedicated DLLs and multiple clock distribution nets provide the timing control needed for synchronous, high-performance designs.
• Multi-standard I/O Support: 316 I/Os with SelectIO capability enable direct interfacing to a range of external devices and memory types.
• SRAM-based Re-programmability: In-system reconfiguration and multiple programming modes allow field updates and design iteration without hardware replacement.
• Commercial Temperature & Standard Supply: Specified for 0 °C to 85 °C operation with a defined core voltage range of 2.375 V to 2.625 V for predictable system integration.

Why Choose XCV800-6BG432C?

The XCV800-6BG432C positions itself as a high-density, reprogrammable FPGA for applications that require a mix of large logic capacity, flexible on-chip memory, and robust clock and I/O features. Its Virtex family architecture and 0.22 μm, 5-layer-metal process provide the foundation for designs that demand scalable logic and reliable manufacturing.

This device is well suited for design teams building PCI or Compact PCI modules, memory-interface-heavy systems, and custom DSP or arithmetic logic blocks requiring dedicated multipliers and carry chains. Backed by Xilinx’s development tool support and factory testing, the device offers a practical combination of performance, integration, and in-system configurability for commercial-grade deployments.

Request a quote or submit a pricing inquiry for the XCV800-6BG432C to confirm availability and lead time for your project requirements.