XCV800-6BG560C

The XCV800-6BG560C is an SRAM-based Virtex® FPGA optimized for high-density, reprogrammable logic. It provides 21,168 logic elements, approximately 0.115 Mbits of embedded memory, and 404 user I/O in a 560-ball L-BGA exposed-pad package for surface-mount assembly.

Designed for commercial-temperature applications, this device targets designs that require high logic capacity, flexible I/O, on-chip memory and integrated clock management while operating from a 2.375 V to 2.625 V core supply.

Key Features

• Logic Capacity — 21,168 logic elements and approximately 888,439 system gates to support complex programmable logic implementations.
• Embedded Memory — 114,688 total RAM bits (approximately 0.115 Mbits) with LUTs that can be configured as RAM or shift registers and dedicated 4k-bit synchronous dual-ported RAMs.
• I/O and SelectIO™ — 404 user I/O pins with multi-standard SelectIO capability supporting a variety of high-performance interface standards.
• Clock Management — On-chip clock-management circuitry including four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock control and distribution.
• Arithmetic and DSP Support — Dedicated carry logic and multiplier support to accelerate high-speed arithmetic functions.
• Packaging and Mounting — 560-LBGA exposed pad, metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) for surface-mount assembly.
• Power and Temperature — Core voltage supply range 2.375 V to 2.625 V; operating temperature range 0°C to 85°C (commercial grade).
• Compliance — RoHS compliant.
• Re-programmability and Development Support — SRAM-based in-system configuration with multiple programming modes and support from established FPGA development systems and libraries.

Typical Applications

• PCI and Compact PCI Systems — 66-MHz PCI compliance and hot-swappable compatibility for Compact PCI modules, enabling integration on PCI-based expansion cards and chassis-based systems.
• High-speed Arithmetic and DSP — Dedicated carry chains and multiplier support are suited to arithmetic-intensive functions and signal processing blocks.
• Memory-centric Designs — Hierarchical on-chip memory and fast external memory interfaces for buffering, packet processing, and protocol bridging.
• Prototyping and Custom Logic — High logic density and unlimited re-programmability make the device suitable for complex logic prototyping and iterative system development.

Unique Advantages

• High Integration — Large logic capacity and abundant embedded RAM reduce external components and simplify board-level design.
• Flexible I/O — Multi-standard SelectIO support and 404 I/O pins allow direct interfacing with a wide range of external devices and memory.
• Robust Clocking — Multiple DLLs and extensive global/local clock networks enable fine-grained timing control for synchronous designs.
• Arithmetic Acceleration — Dedicated carry logic and multiplier support accelerate implementation of wide arithmetic and DSP algorithms.
• Commercial Temperature Suitability — Rated for 0°C to 85°C operation to match commercial embedded and industrial-adjacent electronics requirements.
• Standards and Compliance — RoHS-compliant construction supports regulatory requirements for lead-free assemblies.

Why Choose XCV800-6BG560C?

The XCV800-6BG560C combines substantial programmable logic resources, flexible I/O and on-chip memory with integrated clock management to address complex, reprogrammable system requirements. Its 560-LBGA package and surface-mount mounting make it suitable for compact, high-density board designs operating within commercial temperature ranges.

Supported by established FPGA development systems and offering multiple configuration modes, this Virtex device is a practical choice for teams needing scalable logic capacity, in-system reprogramming and a well-documented development ecosystem for medium- to high-complexity designs.

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