XCV812E-6BG560C

The XCV812E-6BG560C is a Virtex®-E EM field programmable gate array (FPGA) IC from AMD supplied in a 560-ball L-BGA package with an exposed metal pad. It is a surface-mount, commercial-grade FPGA designed to provide substantial on-chip logic, memory and I/O resources in a compact package.

This device offers 21,168 logic elements, approximately 1.147 Mbits of embedded memory and 404 user I/O pins, making it appropriate for designs that require significant programmable logic and connectivity while operating within a 1.71 V to 1.89 V supply window and a 0 °C to 85 °C temperature range.

Key Features

• Core logic: 21,168 logic elements (logic cells) delivering a total of 254,016 gates for implementing complex digital functions.
• Embedded memory: Approximately 1.147 Mbits of on-chip RAM for data buffering, state storage and local memory needs.
• I/O resources: 404 user I/O pins to support broad connectivity and system interfacing requirements.
• Power supply: Operates from a 1.71 V to 1.89 V supply range to match system power rails and sequencing constraints.
• Package and mounting: 560-LBGA with exposed metal pad; supplier device package listed as 560-MBGA (42.5×42.5). Surface-mount mounting type for PCB assembly.
• Operating conditions and grade: Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory compliance: RoHS compliant.

Unique Advantages

• Dense programmable logic: 21,168 logic elements enable implementation of sizeable digital subsystems without extensive external logic.
• On-chip memory capacity: Approximately 1.147 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• High connectivity: 404 I/O pins simplify integration with peripherals, sensors and external interfaces by providing ample signal routing options.
• High pin-count compact package: 560-ball LBGA (560-MBGA, 42.5×42.5) balances high I/O density with a compact PCB footprint.
• Controlled supply range: Narrow voltage supply range (1.71 V–1.89 V) supports predictable power sequencing and design planning.
• Environmental compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCV812E-6BG560C?

The XCV812E-6BG560C positions itself as a high-capacity Virtex®-E EM FPGA option for designs that require a combination of substantial logic resources, embedded memory and a large number of I/Os in a surface-mount 560-ball package. Its specified supply voltage range, commercial operating temperature span and RoHS compliance provide clear, verifiable parameters for system design and procurement.

This device is suitable for design teams and procurement groups seeking a programmable platform with defined resource counts (logic elements, gates, on-chip RAM and I/Os) and a compact, high-pin-count package from a recognized manufacturer.

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