XCVU065-2FFVC1517I

The XCVU065-2FFVC1517I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD offered in a 1517-FCBGA (40×40) package. It provides a high logic capacity platform with 783,300 logic elements, approximately 45.36 Mbits of embedded memory, and up to 520 I/O pins for dense, flexible system integration.

Designed for industrial environments, the device supports a supply voltage range of 922 mV to 979 mV and an operating temperature range of −40 °C to 100 °C. The surface-mount 1517-BBGA FCBGA package combines large integration density with a compact board footprint.

Key Features

• Core Logic  783,300 logic elements provide a large programmable fabric for complex logic implementation and parallel processing tasks.
• Embedded Memory  Approximately 45.36 Mbits of on-chip RAM (Total Ram Bits: 45,363,200) to support buffering, lookup tables, and on-chip data storage.
• I/O Capacity  520 available I/O pins to connect a wide range of external devices and interfaces.
• Power Requirements  Specified supply voltage range from 922 mV to 979 mV for the core supply domain.
• Package & Mounting  1517-FCBGA (1517-BBGA) package in a 40×40 format, designed for surface-mount assembly to minimize board area.
• Environmental & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS-compliant materials.

Unique Advantages

• High integration density: Hundreds of thousands of logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 45.36 Mbits of embedded RAM supports local data storage and high-bandwidth buffering without external memory.
• Extensive I/O resources: 520 I/Os provide flexibility for interfacing multiple peripherals, sensors, and high-speed links.
• Industrial operating range: −40 °C to 100 °C temperature support allows deployment in a wide range of environmental conditions.
• Compact BGA packaging: 1517-FCBGA package offers a dense form factor for systems where board space is constrained.
• Regulatory readiness: RoHS compliance supports designs targeting markets with restricted hazardous materials requirements.

Why Choose XCVU065-2FFVC1517I?

The XCVU065-2FFVC1517I targets designs that require substantial logic capacity, significant embedded memory, and many external interfaces within a compact, surface-mount FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications that must operate reliably across a wide range of conditions.

As an AMD Virtex® UltraScale™ FPGA, this device is positioned for customers seeking a tightly integrated programmable platform to consolidate functions, reduce board-level complexity, and scale system capability while maintaining a compact footprint and defined supply and temperature specifications.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XCVU065-2FFVC1517I.