XCV800-6HQ240C

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 114688 21168 240-BFQFP Exposed Pad

Quantity 69 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-6HQ240C – Virtex Field Programmable Gate Array (FPGA) IC 240-BFQFP

The XCV800-6HQ240C is an SRAM-based Virtex FPGA offering a high-capacity, reprogrammable logic platform in a 240-pin BFQFP exposed-pad package. It integrates 21,168 logic elements, approximately 114.7 Kbits of on-chip RAM, and 166 I/O to address demanding programmable-logic tasks.

Designed for applications that require configurable high-performance logic and multi-standard I/O, this device provides built-in clock management, flexible memory primitives and four DLLs for advanced clock control. Typical use cases include PCI-compliant systems and hot-swappable Compact PCI applications where reprogrammability and system-level integration are required.

Key Features

  • Logic Capacity — 21,168 logic elements and 888,439 system gates provide substantial programmable logic resources for complex designs.
  • Embedded Memory — Approximately 114.7 Kbits of on-chip RAM for LUT-configured RAM, dual-ported RAM and shift-register implementations.
  • I/O Density — 166 user I/O pins to support multi-device interfaces and board-level connectivity.
  • Clock Management — Four dedicated delay-locked loops (DLLs) plus multiple global and local clock distribution nets for advanced timing control.
  • Multi-Standard SelectIO — Support for multiple high-performance interface standards for flexible external device interfacing.
  • SRAM-Based Configuration — In-system configuration with unlimited re-programmability and multiple programming modes.
  • Process and Test — Implemented in a 0.22 μm, 5-layer metal process and 100% factory tested.
  • Package and Mounting — 240-BFQFP exposed-pad package (supplier package: 240-PQFP 32×32) with surface-mount mounting type.
  • Electrical and Environmental — Voltage supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • PCI and Compact PCI Systems — 66-MHz PCI compliance and hot-swappable Compact PCI capability make the device suitable for board-level system expansion and PCI-based I/O implementations.
  • High-Performance Prototyping — Large logic capacity and reprogrammability support complex prototype designs and iterative development.
  • Multi-Standard Interface Bridging — SelectIO multi-standard interfaces enable protocol translation and high-performance external memory or peripheral interfacing.
  • Clock-Critical Designs — Multiple DLLs and hierarchical clock distribution support designs that require precise timing control across logic regions.

Unique Advantages

  • Reprogrammable Flexibility: SRAM-based configuration enables unlimited re-programmability for design updates and field revisions.
  • Substantial On-Chip Resources: A combination of 21,168 logic elements and embedded RAM reduces external component count and simplifies board-level design.
  • Advanced Clocking: Four DLLs and multiple clock nets provide fine-grained timing control, improving system timing closure.
  • Multi-Standard I/O Support: SelectIO capability eases integration with a wide range of external devices and memory technologies.
  • Proven Silicon Process: 0.22 μm, 5-layer metal process and full factory testing support predictable manufacturing and yield characteristics.
  • Vendor Development Support: Supported by FPGA Foundation and Alliance development systems for design and toolchain integration.

Why Choose XCV800-6HQ240C?

The XCV800-6HQ240C combines substantial logic capacity, embedded memory, and flexible I/O in a commercially graded, surface-mount 240-BFQFP package to serve reprogrammable system designs that require sustained performance and configurability. Its on-chip clock management and SelectIO interfaces make it suitable for PCI-compliant and Compact PCI environments as well as other high-performance programmable logic tasks.

Engineers and procurement teams will find long-term value in the device’s reprogrammability, mature silicon process, and support within established FPGA development ecosystems—advantages that simplify iterative design, reduce board-level complexity and help accelerate time-to-market.

Request a quote or submit an RFQ to receive pricing and availability for XCV800-6HQ240C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up