XCV800-6HQ240C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 166 114688 21168 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 69 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 166 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4704 | Number of Logic Elements/Cells | 21168 | ||
| Number of Gates | 888439 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV800-6HQ240C – Virtex Field Programmable Gate Array (FPGA) IC 240-BFQFP
The XCV800-6HQ240C is an SRAM-based Virtex FPGA offering a high-capacity, reprogrammable logic platform in a 240-pin BFQFP exposed-pad package. It integrates 21,168 logic elements, approximately 114.7 Kbits of on-chip RAM, and 166 I/O to address demanding programmable-logic tasks.
Designed for applications that require configurable high-performance logic and multi-standard I/O, this device provides built-in clock management, flexible memory primitives and four DLLs for advanced clock control. Typical use cases include PCI-compliant systems and hot-swappable Compact PCI applications where reprogrammability and system-level integration are required.
Key Features
- Logic Capacity — 21,168 logic elements and 888,439 system gates provide substantial programmable logic resources for complex designs.
- Embedded Memory — Approximately 114.7 Kbits of on-chip RAM for LUT-configured RAM, dual-ported RAM and shift-register implementations.
- I/O Density — 166 user I/O pins to support multi-device interfaces and board-level connectivity.
- Clock Management — Four dedicated delay-locked loops (DLLs) plus multiple global and local clock distribution nets for advanced timing control.
- Multi-Standard SelectIO — Support for multiple high-performance interface standards for flexible external device interfacing.
- SRAM-Based Configuration — In-system configuration with unlimited re-programmability and multiple programming modes.
- Process and Test — Implemented in a 0.22 μm, 5-layer metal process and 100% factory tested.
- Package and Mounting — 240-BFQFP exposed-pad package (supplier package: 240-PQFP 32×32) with surface-mount mounting type.
- Electrical and Environmental — Voltage supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.
Typical Applications
- PCI and Compact PCI Systems — 66-MHz PCI compliance and hot-swappable Compact PCI capability make the device suitable for board-level system expansion and PCI-based I/O implementations.
- High-Performance Prototyping — Large logic capacity and reprogrammability support complex prototype designs and iterative development.
- Multi-Standard Interface Bridging — SelectIO multi-standard interfaces enable protocol translation and high-performance external memory or peripheral interfacing.
- Clock-Critical Designs — Multiple DLLs and hierarchical clock distribution support designs that require precise timing control across logic regions.
Unique Advantages
- Reprogrammable Flexibility: SRAM-based configuration enables unlimited re-programmability for design updates and field revisions.
- Substantial On-Chip Resources: A combination of 21,168 logic elements and embedded RAM reduces external component count and simplifies board-level design.
- Advanced Clocking: Four DLLs and multiple clock nets provide fine-grained timing control, improving system timing closure.
- Multi-Standard I/O Support: SelectIO capability eases integration with a wide range of external devices and memory technologies.
- Proven Silicon Process: 0.22 μm, 5-layer metal process and full factory testing support predictable manufacturing and yield characteristics.
- Vendor Development Support: Supported by FPGA Foundation and Alliance development systems for design and toolchain integration.
Why Choose XCV800-6HQ240C?
The XCV800-6HQ240C combines substantial logic capacity, embedded memory, and flexible I/O in a commercially graded, surface-mount 240-BFQFP package to serve reprogrammable system designs that require sustained performance and configurability. Its on-chip clock management and SelectIO interfaces make it suitable for PCI-compliant and Compact PCI environments as well as other high-performance programmable logic tasks.
Engineers and procurement teams will find long-term value in the device’s reprogrammability, mature silicon process, and support within established FPGA development ecosystems—advantages that simplify iterative design, reduce board-level complexity and help accelerate time-to-market.
Request a quote or submit an RFQ to receive pricing and availability for XCV800-6HQ240C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








