XCV800-5FG676C

The XCV800-5FG676C is a high-density Virtex® Field Programmable Gate Array (FPGA) in a 676-ball BGA package, delivering 21,168 logic elements and approximately 0.115 Mbits of embedded block RAM. It is an SRAM-based, reprogrammable FPGA designed for system designs that require substantial programmable logic, abundant I/O, and integrated memory and clock-management resources.

This device targets high-performance programmable logic applications where on-chip integration of logic, memory, and multi-standard I/O reduces system complexity and accelerates time-to-market.

Key Features

• Logic Capacity — 21,168 logic elements and 888,439 system gates provide substantial on-chip programmable logic density for complex designs.
• Embedded Memory — Approximately 0.115 Mbits (114,688 bits) of block RAM for implementing data buffers, FIFOs, and small on-chip memory structures.
• I/O Density — 444 user I/O pins to support wide parallel interfaces and multiple external peripherals.
• Clock Management — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for flexible, low-skew clock distribution.
• Configurable Logic — LUTs configurable as RAM (16/32-bit), dual-ported RAM, or shift registers; dedicated carry logic and multiplier support for arithmetic-intensive functions.
• In-System Reprogrammability — SRAM-based configuration with multiple programming modes for unlimited re-programmability and iterative development.
• Package & Mounting — 676‑FBGA (27×27) surface-mount package (676‑BGA) for compact board-level integration.
• Power and Operating Range — Core supply 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• PCI and CompactPCI systems — Supports PCI-compliant interfaces and hot-swappable CompactPCI applications requiring programmable logic and high I/O counts.
• High-performance embedded systems — On-chip memory, clock management and arithmetic resources for signal processing and control tasks.
• Custom interface bridging — Extensive I/O and multi-standard SelectIO capability for bridging between different bus and memory standards.

Unique Advantages

• High on-chip integration: Combines 21,168 logic elements and embedded block RAM to reduce external component count and simplify BOM.
• Flexible clocking: Multiple DLLs and hierarchical clock nets enable precise timing control across large designs.
• Extensive I/O capacity: 444 I/O pins support wide parallel buses and multiple peripheral interfaces without external expanders.
• Reconfigurable development flow: SRAM-based, in-system configuration allows iterative prototyping and field updates.
• Compact board footprint: 676‑FBGA (27×27) surface-mount package supports dense PCB layouts while keeping high pin-count accessibility.
• Standards-oriented features: Built-in support for multi-standard I/O and memory interfacing to streamline system-level integration.

Why Choose XCV800-5FG676C?

The XCV800-5FG676C provides a balance of logic density, embedded memory, and extensive I/O in a compact 676‑BGA package, suited to engineers building high-performance programmable solutions. With dedicated clock-management resources and reprogrammable SRAM configuration, it supports iterative development and flexible deployment models.

This device is appropriate for design teams seeking a robust, field-programmable logic element with clear electrical and environmental specifications (2.375–2.625 V core supply, 0 °C to 85 °C operating range) and RoHS compliance for modern electronic assemblies.

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