XCV800-5BG432C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 316 114688 21168 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 195 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4704 | Number of Logic Elements/Cells | 21168 | ||
| Number of Gates | 888439 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV800-5BG432C – Virtex® FPGA, 316 I/O, 21,168 logic elements
The XCV800-5BG432C is an SRAM-based Virtex® Field Programmable Gate Array (FPGA) in a 432-LBGA exposed pad metal package. It integrates 21,168 logic elements (approximately 888,439 gates) with 114,688 bits of on-chip RAM and up to 316 user I/O pins to support high-density, reprogrammable digital designs.
Designed for commercial-grade applications, the device targets systems requiring significant logic capacity, flexible I/O, and in-system reconfigurability. Key value comes from its high logic density, embedded memory, multi-standard I/O capability, and on-chip clock-management resources.
Key Features
- Logic Capacity The device provides 21,168 logic elements (roughly 888,439 system gates), enabling complex digital functions and high integration of custom logic.
- Embedded Memory Approximately 114,688 bits of on-chip RAM for LUT-based RAM, dual-ported RAM, and shift-register structures to support buffering, FIFOs, and local data storage.
- I/O and Interfaces Up to 316 user I/O pins support multi-standard SelectIO interfaces and direct connections to external memory and peripherals.
- Clock Management Built-in clock-management circuitry including dedicated delay-locked loops (DLLs) and multiple global/local clock distribution nets for advanced timing control.
- Package and Mounting Surface-mount 432-LBGA exposed pad metal package (432-MBGA 40×40) for dense board-level integration and thermal path through the exposed pad.
- Power and Temperature Operates from a 2.375 V to 2.625 V supply window and is specified for commercial operating temperatures from 0 °C to 85 °C.
- Configuration and Re-programmability SRAM-based in-system configuration supports multiple programming modes and unlimited re-programmability for iterative development and field updates.
- Compliance RoHS compliant for lead-free assembly and environmental compliance in commercial applications.
Typical Applications
- PCI and Compact PCI Systems Suited for PCI-compliant designs and Compact PCI modules where hot-swappable or high-throughput logic is required.
- Custom High‑Performance Logic Use in applications that require dense programmable logic and embedded memory for algorithm acceleration, protocol handling, or custom datapaths.
- Memory Interface Control Acts as the programmable interface and control logic for high-performance external memory subsystems.
Unique Advantages
- High logic density: 21,168 logic elements and ~888k gates enable consolidation of multiple functions into a single device, reducing system BOM and board area.
- Flexible I/O: 316 I/O pins with multi-standard SelectIO support provide direct connectivity options to a wide range of peripherals and memories.
- On-chip memory: Approximately 114,688 bits of embedded RAM reduce the need for external buffering and speed up local data handling.
- Advanced clock control: Dedicated DLLs and multiple clock distribution nets facilitate precise timing and low-skew clocking for complex designs.
- Re-programmable architecture: SRAM-based configuration allows iterative development, field updates, and rapid prototyping without mask changes.
- Commercial-grade qualification: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.
Why Choose XCV800-5BG432C?
The XCV800-5BG432C combines substantial logic capacity, embedded RAM, and a large configurable I/O complement in a compact 432-LBGA package, making it well suited for commercial designs that demand reprogrammable, high-density logic. Its SRAM-based architecture and built-in clock management support iterative development and precise timing control, while the exposed-pad LBGA package supports board-level thermal management.
This device is appropriate for development teams and integrators building PCI/Compact PCI modules, high-performance interface controllers, and other custom digital systems that benefit from in-system reconfigurability and significant on-chip resources. The Virtex family development ecosystem provides additional design support and tools to accelerate time-to-market.
Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the XCV800-5BG432C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








