XCV800-5BG432C

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 114688 21168 432-LBGA Exposed Pad, Metal

Quantity 195 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-5BG432C – Virtex® FPGA, 316 I/O, 21,168 logic elements

The XCV800-5BG432C is an SRAM-based Virtex® Field Programmable Gate Array (FPGA) in a 432-LBGA exposed pad metal package. It integrates 21,168 logic elements (approximately 888,439 gates) with 114,688 bits of on-chip RAM and up to 316 user I/O pins to support high-density, reprogrammable digital designs.

Designed for commercial-grade applications, the device targets systems requiring significant logic capacity, flexible I/O, and in-system reconfigurability. Key value comes from its high logic density, embedded memory, multi-standard I/O capability, and on-chip clock-management resources.

Key Features

  • Logic Capacity  The device provides 21,168 logic elements (roughly 888,439 system gates), enabling complex digital functions and high integration of custom logic.
  • Embedded Memory  Approximately 114,688 bits of on-chip RAM for LUT-based RAM, dual-ported RAM, and shift-register structures to support buffering, FIFOs, and local data storage.
  • I/O and Interfaces  Up to 316 user I/O pins support multi-standard SelectIO interfaces and direct connections to external memory and peripherals.
  • Clock Management  Built-in clock-management circuitry including dedicated delay-locked loops (DLLs) and multiple global/local clock distribution nets for advanced timing control.
  • Package and Mounting  Surface-mount 432-LBGA exposed pad metal package (432-MBGA 40×40) for dense board-level integration and thermal path through the exposed pad.
  • Power and Temperature  Operates from a 2.375 V to 2.625 V supply window and is specified for commercial operating temperatures from 0 °C to 85 °C.
  • Configuration and Re-programmability  SRAM-based in-system configuration supports multiple programming modes and unlimited re-programmability for iterative development and field updates.
  • Compliance  RoHS compliant for lead-free assembly and environmental compliance in commercial applications.

Typical Applications

  • PCI and Compact PCI Systems  Suited for PCI-compliant designs and Compact PCI modules where hot-swappable or high-throughput logic is required.
  • Custom High‑Performance Logic  Use in applications that require dense programmable logic and embedded memory for algorithm acceleration, protocol handling, or custom datapaths.
  • Memory Interface Control  Acts as the programmable interface and control logic for high-performance external memory subsystems.

Unique Advantages

  • High logic density: 21,168 logic elements and ~888k gates enable consolidation of multiple functions into a single device, reducing system BOM and board area.
  • Flexible I/O: 316 I/O pins with multi-standard SelectIO support provide direct connectivity options to a wide range of peripherals and memories.
  • On-chip memory: Approximately 114,688 bits of embedded RAM reduce the need for external buffering and speed up local data handling.
  • Advanced clock control: Dedicated DLLs and multiple clock distribution nets facilitate precise timing and low-skew clocking for complex designs.
  • Re-programmable architecture: SRAM-based configuration allows iterative development, field updates, and rapid prototyping without mask changes.
  • Commercial-grade qualification: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.

Why Choose XCV800-5BG432C?

The XCV800-5BG432C combines substantial logic capacity, embedded RAM, and a large configurable I/O complement in a compact 432-LBGA package, making it well suited for commercial designs that demand reprogrammable, high-density logic. Its SRAM-based architecture and built-in clock management support iterative development and precise timing control, while the exposed-pad LBGA package supports board-level thermal management.

This device is appropriate for development teams and integrators building PCI/Compact PCI modules, high-performance interface controllers, and other custom digital systems that benefit from in-system reconfigurability and significant on-chip resources. The Virtex family development ecosystem provides additional design support and tools to accelerate time-to-market.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the XCV800-5BG432C.

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