XCV800-5BG560C

IC FPGA 404 I/O 560MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 404 114688 21168 560-LBGA Exposed Pad, Metal

Quantity 1,702 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-5BG560C – Virtex® FPGA, 21,168 Logic Elements, 560-LBGA

The XCV800-5BG560C is a Virtex® SRAM-based field programmable gate array optimized for high-density, high-performance programmable logic applications. Built around a flexible architecture with abundant logic and routing resources, this surface-mount device targets system-level designs that require reprogrammability, on-chip memory, and extensive I/O connectivity.

Key use cases include compute-intensive control and interface functions in commercial electronic systems where deterministic temperature and supply ranges, and a high I/O count, are required. The device combines 21,168 logic elements with on-chip embedded memory and advanced clock-management resources to support complex designs.

Key Features

  • Logic Capacity — 21,168 logic elements and 888,439 system gates provide substantial programmable logic resource for complex designs.
  • Embedded Memory — Approximately 0.115 Mbits of embedded memory (114,688 bits) for on-chip data buffering, FIFOs, and state storage.
  • I/O Resources — 404 I/O pins to support a wide range of peripheral and high-density interfacing requirements.
  • Clock Management — Four dedicated delay-locked loops (DLLs) plus multiple global and local clock distribution nets for advanced clock control and low-skew distribution.
  • Configurable Logic & RAM — LUTs can be configured as 16-bit/32-bit RAM, dual-ported RAM, or shift registers; includes configurable synchronous dual-ported 4k-bit RAM blocks.
  • High-Speed Interface Support — Multi-standard SelectIO™ interfaces with support for numerous high-performance interface standards.
  • Dedicated Arithmetic Support — Dedicated carry logic, multiplier support, and cascade chains for high-speed arithmetic and wide-input functions.
  • Package & Mounting — 560-LBGA exposed pad, metal package (supplier package 560-MBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
  • Supply & Temperature — Core supply range of 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant and 100% factory tested.
  • Configuration & Reprogrammability — SRAM-based in-system configuration enabling unlimited re-programmability and multiple programming modes.

Typical Applications

  • System Control & Glue Logic — Implement complex control state machines and protocol bridging across multiple subsystems using abundant logic and I/O resources.
  • High-Speed I/O and Interface Bridging — Use SelectIO™-capable I/Os and on-chip memory to create protocol converters, wide parallel interfaces, or buffered serial links.
  • Digital Signal Processing — Leverage dedicated multipliers, carry logic, and embedded RAM for DSP building blocks such as filters, transforms, and arithmetic pipelines.
  • Prototyping & In-System Development — SRAM-based reprogrammability supports design iteration, firmware updates, and in-field modification without replacing hardware.

Unique Advantages

  • Substantial Logic Density: 21,168 logic elements and nearly 900k system gates enable implementation of sizeable, integrated digital functions on a single device.
  • Flexible Memory Options: A mix of LUT-configurable RAM and dedicated RAM blocks provides designers multiple on-chip memory architectures to match application needs.
  • Robust Clocking: Four DLLs and hierarchical clock nets simplify timing architecture and help maintain low-skew distribution across large designs.
  • High I/O Count: 404 I/O pins accommodate dense external connectivity without requiring additional interface components, reducing BOM complexity.
  • Proven Configuration Model: SRAM-based in-system configuration supports unlimited re-programmability and a variety of programming modes for flexible deployment.
  • Commercial Temperature & RoHS Compliance: Designed for commercial environments (0 °C to 85 °C) and RoHS compliant to meet contemporary manufacturing requirements.

Why Choose XCV800-5BG560C?

The XCV800-5BG560C combines high logic capacity, embedded memory, and extensive I/O in a single surface-mount Virtex FPGA package. Its configurable logic and memory primitives, dedicated arithmetic resources, and advanced clock-management features make it well suited for complex control, interface, and signal-processing designs in commercial electronic systems.

Choose this device when your design requires substantial on-chip resources, flexible reprogrammability, and a proven FPGA architecture that supports development toolchains and in-system configuration modes. The 560-LBGA package and RoHS compliance support modern manufacturing and assembly processes while delivering long-term design adaptability.

Request a quote today to check availability and pricing for the XCV800-5BG560C and to discuss how it can fit into your next design.

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