XCV800-5BG560C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 404 114688 21168 560-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 1,702 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 560-MBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 560-LBGA Exposed Pad, Metal | Number of I/O | 404 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4704 | Number of Logic Elements/Cells | 21168 | ||
| Number of Gates | 888439 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV800-5BG560C – Virtex® FPGA, 21,168 Logic Elements, 560-LBGA
The XCV800-5BG560C is a Virtex® SRAM-based field programmable gate array optimized for high-density, high-performance programmable logic applications. Built around a flexible architecture with abundant logic and routing resources, this surface-mount device targets system-level designs that require reprogrammability, on-chip memory, and extensive I/O connectivity.
Key use cases include compute-intensive control and interface functions in commercial electronic systems where deterministic temperature and supply ranges, and a high I/O count, are required. The device combines 21,168 logic elements with on-chip embedded memory and advanced clock-management resources to support complex designs.
Key Features
- Logic Capacity — 21,168 logic elements and 888,439 system gates provide substantial programmable logic resource for complex designs.
- Embedded Memory — Approximately 0.115 Mbits of embedded memory (114,688 bits) for on-chip data buffering, FIFOs, and state storage.
- I/O Resources — 404 I/O pins to support a wide range of peripheral and high-density interfacing requirements.
- Clock Management — Four dedicated delay-locked loops (DLLs) plus multiple global and local clock distribution nets for advanced clock control and low-skew distribution.
- Configurable Logic & RAM — LUTs can be configured as 16-bit/32-bit RAM, dual-ported RAM, or shift registers; includes configurable synchronous dual-ported 4k-bit RAM blocks.
- High-Speed Interface Support — Multi-standard SelectIO™ interfaces with support for numerous high-performance interface standards.
- Dedicated Arithmetic Support — Dedicated carry logic, multiplier support, and cascade chains for high-speed arithmetic and wide-input functions.
- Package & Mounting — 560-LBGA exposed pad, metal package (supplier package 560-MBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
- Supply & Temperature — Core supply range of 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS compliant and 100% factory tested.
- Configuration & Reprogrammability — SRAM-based in-system configuration enabling unlimited re-programmability and multiple programming modes.
Typical Applications
- System Control & Glue Logic — Implement complex control state machines and protocol bridging across multiple subsystems using abundant logic and I/O resources.
- High-Speed I/O and Interface Bridging — Use SelectIO™-capable I/Os and on-chip memory to create protocol converters, wide parallel interfaces, or buffered serial links.
- Digital Signal Processing — Leverage dedicated multipliers, carry logic, and embedded RAM for DSP building blocks such as filters, transforms, and arithmetic pipelines.
- Prototyping & In-System Development — SRAM-based reprogrammability supports design iteration, firmware updates, and in-field modification without replacing hardware.
Unique Advantages
- Substantial Logic Density: 21,168 logic elements and nearly 900k system gates enable implementation of sizeable, integrated digital functions on a single device.
- Flexible Memory Options: A mix of LUT-configurable RAM and dedicated RAM blocks provides designers multiple on-chip memory architectures to match application needs.
- Robust Clocking: Four DLLs and hierarchical clock nets simplify timing architecture and help maintain low-skew distribution across large designs.
- High I/O Count: 404 I/O pins accommodate dense external connectivity without requiring additional interface components, reducing BOM complexity.
- Proven Configuration Model: SRAM-based in-system configuration supports unlimited re-programmability and a variety of programming modes for flexible deployment.
- Commercial Temperature & RoHS Compliance: Designed for commercial environments (0 °C to 85 °C) and RoHS compliant to meet contemporary manufacturing requirements.
Why Choose XCV800-5BG560C?
The XCV800-5BG560C combines high logic capacity, embedded memory, and extensive I/O in a single surface-mount Virtex FPGA package. Its configurable logic and memory primitives, dedicated arithmetic resources, and advanced clock-management features make it well suited for complex control, interface, and signal-processing designs in commercial electronic systems.
Choose this device when your design requires substantial on-chip resources, flexible reprogrammability, and a proven FPGA architecture that supports development toolchains and in-system configuration modes. The 560-LBGA package and RoHS compliance support modern manufacturing and assembly processes while delivering long-term design adaptability.
Request a quote today to check availability and pricing for the XCV800-5BG560C and to discuss how it can fit into your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








