XCV800-5BG432I

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 114688 21168 432-LBGA Exposed Pad, Metal

Quantity 724 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-5BG432I – Virtex FPGA, 21,168 logic cells, 432‑LBGA

The XCV800-5BG432I is an AMD Virtex® SRAM-based field programmable gate array (FPGA) offering 21,168 logic cells and approximately 114,688 bits of embedded memory. It delivers high-density programmable logic, a hierarchical memory system, and extensive I/O capability for industrial applications and complex system designs.

Built on the Virtex family architecture, this device targets applications requiring reprogrammability, flexible I/O standards, and on-chip resources for arithmetic and memory-intensive functions while supporting industrial operating temperatures and surface-mount deployment.

Key Features

  • Programmable Logic Capacity — 21,168 logic cells and approximately 888,439 system gates provide a high-density platform for complex logic implementation.
  • Embedded Memory — Approximately 114,688 bits of on-chip RAM in a hierarchical memory architecture with configurable LUT-based RAM and dedicated block RAM options.
  • I/O and Interface Support — 316 user I/O pins and multi-standard SelectIO™ interfaces for flexible connection to system peripherals and external memory devices.
  • Clock Management — On-chip clock-management circuitry including multiple delay-locked loops (DLLs) and dedicated global and local clock distribution resources.
  • Arithmetic and Logic Resources — Dedicated carry logic, multiplier support and cascade chains to accelerate wide-input and arithmetic functions.
  • Packaging and Mounting — 432-LBGA exposed pad, metal package (supplier device package: 432‑MBGA 40×40) designed for surface-mount assembly.
  • Power and Temperature — Supply voltage range 2.375 V to 2.625 V; industrial operating temperature range −40 °C to 100 °C.
  • Configuration and Reprogrammability — SRAM-based in-system configuration with multiple programming modes for unlimited re-programmability.
  • Compliance — RoHS compliant.

Typical Applications

  • PCI and Compact PCI Systems — Suitable for designs requiring 66‑MHz PCI compliance and support for hot-swappable Compact PCI topologies.
  • High‑Performance Memory Interfaces — Interfaces to external high-performance RAMs and direct connection to compatible memory devices for bandwidth-critical designs.
  • Signal Processing and Math‑Intensive Logic — Use of dedicated multipliers and carry logic for DSP, encoding/decoding, and other arithmetic-heavy functions.
  • Industrial Control and Embedded Systems — Industrial temperature rating and surface-mount LBGA packaging make it appropriate for rugged embedded platforms.

Unique Advantages

  • High Logic Density: 21,168 logic cells enable implementation of large, complex designs without external glue logic.
  • Flexible Memory Architecture: A mix of LUT-configurable RAM and dedicated block RAM provides designers with varied memory constructs for optimized data paths.
  • Rich I/O Capability: 316 I/O pins and multi-standard SelectIO support simplify interfacing with diverse peripherals and memory devices.
  • Clocking and Timing Control: Built-in DLLs and hierarchical clock networks facilitate precise clock-management for synchronous systems.
  • Industrial Readiness: −40 °C to 100 °C operating range and RoHS compliance address demanding environmental and regulatory requirements.
  • In-System Reconfigurability: SRAM-based configuration offers unlimited re-programmability and multiple programming modes for iterative development and field updates.

Why Choose XCV800-5BG432I?

The XCV800-5BG432I positions itself as a high-density, reprogrammable FPGA suitable for industrial and system-level designs that require substantial on-chip logic, embedded memory, and flexible I/O. Its Virtex family architecture—combined with dedicated arithmetic resources and on-chip clock management—provides a balanced platform for both control and data-processing tasks.

This device is well suited to design teams seeking a configurable, industrial-grade FPGA with sustained vendor ecosystem support for development tools and in-system configuration. The combination of capacity, packaging, and temperature rating delivers long-term value for scalable, maintainable systems.

Request a quote or submit an inquiry to get availability and pricing information for the XCV800-5BG432I. Our team can assist with lead times, packaging options, and volume pricing to support your project requirements.

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