XCV800-4HQ240I

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 114688 21168 240-BFQFP Exposed Pad

Quantity 678 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFP Exposed PadNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-4HQ240I – Virtex® FPGA, 240‑lead BFQFP Exposed Pad

The XCV800-4HQ240I is an SRAM-based Virtex field programmable gate array offering high-density, reprogrammable logic in a 240‑lead BFQFP exposed-pad package. It combines substantial logic capacity, embedded memory, and flexible I/O to support high-performance and industrial applications.

Designed for system-level integration, this device targets applications that require on-chip custom logic, fast external memory interfaces, and industry-grade operating conditions, delivering a balance of performance, integration, and in-system configurability.

Key Features

  • Core / Logic Density 21,168 logic elements (equivalent device gates: 888,439) for implementing complex, high-density logic functions.
  • Embedded Memory Approximately 0.115 Mbits of on-chip RAM (114,688 total RAM bits) plus configurable LUT-based RAM and dual-ported RAM options for flexible data storage and buffering.
  • I/O & Interfaces 166 user I/O pins and multi-standard SelectIO interfaces supporting a variety of high-performance signalling standards; includes direct connectivity options for external ZBTRAM devices as described in the family specification.
  • Clocking & Timing Built-in clock-management architecture with four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets, and 24 secondary local clock nets to support complex timing domains.
  • Configuration & Reprogrammability SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for flexible deployment and field updates.
  • Package, Mounting & Thermal 240-BFQFP (32×32) exposed-pad, surface-mount package; operating temperature range −40 °C to 100 °C and industrial grade classification.
  • Power Core voltage supply range: 2.375 V to 2.625 V (Virtex 2.5 V family operating range).
  • Manufacturing & Compliance 100% factory tested and RoHS compliant, supporting reliable integration into production designs.

Typical Applications

  • PCI & CompactPCI systems — Implement high-speed PCI logic and support hot-swappable CompactPCI applications using the device’s PCI-compliant capabilities.
  • Memory interface bridging — Fast interfaces to external high-performance RAMs and direct connection to ZBTRAM devices enable efficient data-path and buffer designs.
  • Custom embedded logic & prototyping — Leverage reprogrammability and abundant logic elements for in-system debugging, prototyping, and iterative product development.
  • Industrial control & automation — Industrial temperature rating and robust packaging make this FPGA suitable for demanding control, monitoring, and automation tasks.

Unique Advantages

  • High-density programmable logic: 21,168 logic elements and 888,439 gates enable complex system functions on a single device, reducing external glue logic.
  • Flexible on-chip memory: Approximately 0.115 Mbits of embedded RAM with LUT-configurable RAM and dual-ported RAM options support varied buffering and storage needs.
  • Advanced clock management: Four DLLs and multiple global/local clock nets simplify multi-domain timing and facilitate deterministic performance.
  • Field reprogrammability: SRAM-based architecture with multiple programming modes enables updates and feature evolution post-deployment.
  • Industrial-ready thermal range: −40 °C to 100 °C operating range and exposed-pad BFQFP package support deployment in industrial environments.
  • Proven ecosystem support: Supported by the Virtex family development systems for design, place-and-route, and configuration workflows.

Why Choose XCV800-4HQ240I?

The XCV800-4HQ240I positions itself as a versatile, industrial-grade FPGA option for engineers who need substantial on-chip logic, configurable embedded memory, and robust clocking in a surface-mount exposed-pad package. Its combination of density, reprogrammability, and industry-oriented thermal range makes it suitable for system-level designs that demand flexibility and long-term scalability.

Backed by the Virtex development ecosystem and factory-tested manufacturing, this device is well suited to teams building high-performance interfaces, memory-centric designs, and industrial control systems where in-field updates and reliable operation are required.

Request a quote or submit your RFQ today to evaluate the XCV800-4HQ240I for your next project.

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