XCV800-4HQ240I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 166 114688 21168 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 678 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 166 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4704 | Number of Logic Elements/Cells | 21168 | ||
| Number of Gates | 888439 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV800-4HQ240I – Virtex® FPGA, 240‑lead BFQFP Exposed Pad
The XCV800-4HQ240I is an SRAM-based Virtex field programmable gate array offering high-density, reprogrammable logic in a 240‑lead BFQFP exposed-pad package. It combines substantial logic capacity, embedded memory, and flexible I/O to support high-performance and industrial applications.
Designed for system-level integration, this device targets applications that require on-chip custom logic, fast external memory interfaces, and industry-grade operating conditions, delivering a balance of performance, integration, and in-system configurability.
Key Features
- Core / Logic Density 21,168 logic elements (equivalent device gates: 888,439) for implementing complex, high-density logic functions.
- Embedded Memory Approximately 0.115 Mbits of on-chip RAM (114,688 total RAM bits) plus configurable LUT-based RAM and dual-ported RAM options for flexible data storage and buffering.
- I/O & Interfaces 166 user I/O pins and multi-standard SelectIO interfaces supporting a variety of high-performance signalling standards; includes direct connectivity options for external ZBTRAM devices as described in the family specification.
- Clocking & Timing Built-in clock-management architecture with four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets, and 24 secondary local clock nets to support complex timing domains.
- Configuration & Reprogrammability SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for flexible deployment and field updates.
- Package, Mounting & Thermal 240-BFQFP (32×32) exposed-pad, surface-mount package; operating temperature range −40 °C to 100 °C and industrial grade classification.
- Power Core voltage supply range: 2.375 V to 2.625 V (Virtex 2.5 V family operating range).
- Manufacturing & Compliance 100% factory tested and RoHS compliant, supporting reliable integration into production designs.
Typical Applications
- PCI & CompactPCI systems — Implement high-speed PCI logic and support hot-swappable CompactPCI applications using the device’s PCI-compliant capabilities.
- Memory interface bridging — Fast interfaces to external high-performance RAMs and direct connection to ZBTRAM devices enable efficient data-path and buffer designs.
- Custom embedded logic & prototyping — Leverage reprogrammability and abundant logic elements for in-system debugging, prototyping, and iterative product development.
- Industrial control & automation — Industrial temperature rating and robust packaging make this FPGA suitable for demanding control, monitoring, and automation tasks.
Unique Advantages
- High-density programmable logic: 21,168 logic elements and 888,439 gates enable complex system functions on a single device, reducing external glue logic.
- Flexible on-chip memory: Approximately 0.115 Mbits of embedded RAM with LUT-configurable RAM and dual-ported RAM options support varied buffering and storage needs.
- Advanced clock management: Four DLLs and multiple global/local clock nets simplify multi-domain timing and facilitate deterministic performance.
- Field reprogrammability: SRAM-based architecture with multiple programming modes enables updates and feature evolution post-deployment.
- Industrial-ready thermal range: −40 °C to 100 °C operating range and exposed-pad BFQFP package support deployment in industrial environments.
- Proven ecosystem support: Supported by the Virtex family development systems for design, place-and-route, and configuration workflows.
Why Choose XCV800-4HQ240I?
The XCV800-4HQ240I positions itself as a versatile, industrial-grade FPGA option for engineers who need substantial on-chip logic, configurable embedded memory, and robust clocking in a surface-mount exposed-pad package. Its combination of density, reprogrammability, and industry-oriented thermal range makes it suitable for system-level designs that demand flexibility and long-term scalability.
Backed by the Virtex development ecosystem and factory-tested manufacturing, this device is well suited to teams building high-performance interfaces, memory-centric designs, and industrial control systems where in-field updates and reliable operation are required.
Request a quote or submit your RFQ today to evaluate the XCV800-4HQ240I for your next project.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








