XCV800-4FG676C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 444 114688 21168 676-BGA |
|---|---|
| Quantity | 1,014 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 444 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4704 | Number of Logic Elements/Cells | 21168 | ||
| Number of Gates | 888439 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV800-4FG676C – Virtex® Field Programmable Gate Array (FPGA) IC 444 114688 21168 676-BGA
The XCV800-4FG676C is a Virtex® SRAM-based Field Programmable Gate Array optimized for high-capacity, reprogrammable logic implementations. The device integrates an array of configurable logic elements with abundant I/O and embedded RAM, delivered in a 676-ball BGA package for surface-mount deployment.
Designed for system designs that require significant on-chip logic and memory, the device targets applications such as PCI/Compact PCI systems and complex programmable logic where up to 200 MHz system performance and robust clock management are beneficial.
Key Features
- Logic Capacity — 21,168 logic elements (CLB-based architecture) providing a large, regular fabric for combinational and sequential logic implementation.
- On-chip Memory — Approximately 114,688 bits of embedded RAM with LUTs configurable as 16-bit/32-bit RAM, dual-ported RAM options, and Shift Register functionality for flexible local storage and buffering.
- I/O Density — 444 user I/O pins to support high-pin-count interfacing and parallel system connections.
- Gate Equivalence — Equivalent to 888,439 system gates, providing a measure of device complexity for large designs.
- Clocking and Timing — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets to support advanced clock distribution and low-skew timing architectures.
- Advanced Logic Resources — Dedicated carry logic, multiplier support, cascade chains for wide-input functions, and abundant registers with clock enable and synchronous/asynchronous control to simplify arithmetic and state-machine implementations.
- Configuration and Re-programmability — SRAM-based in-system configuration with multiple programming modes for unlimited re-programmability and field updates.
- Process and Quality — 0.22 μm, 5-layer-metal CMOS process with 100% factory testing; RoHS compliant.
- Package & Mounting — 676-ball BGA package (supplier device package: 676-FBGA, 27 × 27 mm) for surface-mount assembly.
- Electrical & Environmental — Core supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C; commercial grade device.
Typical Applications
- PCI / Compact PCI systems — Supports 66-MHz PCI-compliant operation and is suitable for hot-swappable Compact PCI applications where reprogrammable logic and abundant I/O are required.
- High-performance programmable systems — Large logic capacity and dedicated clock management make the device suitable for prototyping and deployment of complex digital subsystems.
- Memory-intensive logic — On-chip RAM and SelectRAM+ resources support designs that require significant embedded buffering, lookup tables, or small dual-ported memories.
Unique Advantages
- High logic integration: 21,168 logic elements provide a substantial resource pool to consolidate multiple functions into a single device and reduce system BOM.
- Generous I/O support: 444 I/O pins enable broad external interfacing and parallel connections without external expander ICs.
- Flexible embedded memory: Approximately 114,688 bits of on-chip RAM with configurable LUT-based RAM and dual-ported blocks simplify data-path and buffering design.
- Robust clock management: Multiple DLLs and hierarchical global/local clock networks reduce clock skew and support complex timing domains.
- In-field reprogrammability: SRAM-based configuration allows unlimited reprogramming for iterative development and field feature updates.
- Proven manufacturing and compliance: Fabricated in a 0.22 μm, 5-layer-metal process and 100% factory tested; RoHS compliant for regulatory alignment.
Why Choose XCV800-4FG676C?
The XCV800-4FG676C combines a high-count logic fabric, substantial embedded memory, and extensive I/O in a surface-mount 676-BGA package, offering a balanced solution for designers who need significant programmable logic and flexible on-chip resources. With dedicated clock-management blocks and multiple configuration modes, it supports rapid development cycles and field updates while fitting within standard commercial temperature and voltage ranges.
This device is well-suited for engineering teams building complex digital subsystems, PCI/Compact PCI-based boards, or memory-intensive logic designs that benefit from reprogrammability and mature development support from the Virtex ecosystem.
Request a quote or submit an inquiry to receive pricing and availability for the XCV800-4FG676C and to discuss how it can fit into your next programmable-logic design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








