XCV800-4FG676C

IC FPGA 444 I/O 676FCBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 444 114688 21168 676-BGA

Quantity 1,014 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O444Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-4FG676C – Virtex® Field Programmable Gate Array (FPGA) IC 444 114688 21168 676-BGA

The XCV800-4FG676C is a Virtex® SRAM-based Field Programmable Gate Array optimized for high-capacity, reprogrammable logic implementations. The device integrates an array of configurable logic elements with abundant I/O and embedded RAM, delivered in a 676-ball BGA package for surface-mount deployment.

Designed for system designs that require significant on-chip logic and memory, the device targets applications such as PCI/Compact PCI systems and complex programmable logic where up to 200 MHz system performance and robust clock management are beneficial.

Key Features

  • Logic Capacity — 21,168 logic elements (CLB-based architecture) providing a large, regular fabric for combinational and sequential logic implementation.
  • On-chip Memory — Approximately 114,688 bits of embedded RAM with LUTs configurable as 16-bit/32-bit RAM, dual-ported RAM options, and Shift Register functionality for flexible local storage and buffering.
  • I/O Density — 444 user I/O pins to support high-pin-count interfacing and parallel system connections.
  • Gate Equivalence — Equivalent to 888,439 system gates, providing a measure of device complexity for large designs.
  • Clocking and Timing — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets to support advanced clock distribution and low-skew timing architectures.
  • Advanced Logic Resources — Dedicated carry logic, multiplier support, cascade chains for wide-input functions, and abundant registers with clock enable and synchronous/asynchronous control to simplify arithmetic and state-machine implementations.
  • Configuration and Re-programmability — SRAM-based in-system configuration with multiple programming modes for unlimited re-programmability and field updates.
  • Process and Quality — 0.22 μm, 5-layer-metal CMOS process with 100% factory testing; RoHS compliant.
  • Package & Mounting — 676-ball BGA package (supplier device package: 676-FBGA, 27 × 27 mm) for surface-mount assembly.
  • Electrical & Environmental — Core supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C; commercial grade device.

Typical Applications

  • PCI / Compact PCI systems — Supports 66-MHz PCI-compliant operation and is suitable for hot-swappable Compact PCI applications where reprogrammable logic and abundant I/O are required.
  • High-performance programmable systems — Large logic capacity and dedicated clock management make the device suitable for prototyping and deployment of complex digital subsystems.
  • Memory-intensive logic — On-chip RAM and SelectRAM+ resources support designs that require significant embedded buffering, lookup tables, or small dual-ported memories.

Unique Advantages

  • High logic integration: 21,168 logic elements provide a substantial resource pool to consolidate multiple functions into a single device and reduce system BOM.
  • Generous I/O support: 444 I/O pins enable broad external interfacing and parallel connections without external expander ICs.
  • Flexible embedded memory: Approximately 114,688 bits of on-chip RAM with configurable LUT-based RAM and dual-ported blocks simplify data-path and buffering design.
  • Robust clock management: Multiple DLLs and hierarchical global/local clock networks reduce clock skew and support complex timing domains.
  • In-field reprogrammability: SRAM-based configuration allows unlimited reprogramming for iterative development and field feature updates.
  • Proven manufacturing and compliance: Fabricated in a 0.22 μm, 5-layer-metal process and 100% factory tested; RoHS compliant for regulatory alignment.

Why Choose XCV800-4FG676C?

The XCV800-4FG676C combines a high-count logic fabric, substantial embedded memory, and extensive I/O in a surface-mount 676-BGA package, offering a balanced solution for designers who need significant programmable logic and flexible on-chip resources. With dedicated clock-management blocks and multiple configuration modes, it supports rapid development cycles and field updates while fitting within standard commercial temperature and voltage ranges.

This device is well-suited for engineering teams building complex digital subsystems, PCI/Compact PCI-based boards, or memory-intensive logic designs that benefit from reprogrammability and mature development support from the Virtex ecosystem.

Request a quote or submit an inquiry to receive pricing and availability for the XCV800-4FG676C and to discuss how it can fit into your next programmable-logic design.

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