XCV800-4BG432C

The XCV800-4BG432C is a Virtex® SRAM-based Field Programmable Gate Array (FPGA) supplied in a 432-LBGA exposed-pad metal package. It delivers a high-capacity, reprogrammable logic fabric intended for general commercial embedded and system-design applications that require dense logic, abundant I/O, and flexible memory resources.

With 21,168 logic elements, approximately 0.115 Mbits of embedded RAM, 316 I/O pins, and an architecture that includes advanced clock management and multi-standard I/O, this device is suited for high-performance programmable logic tasks, system prototyping, and board-level integration where reconfigurability and on-chip resources reduce system complexity.

Key Features

• Core Capacity — 21,168 logic elements and 888,439 system gates provide a high-density programmable logic fabric for complex logic implementations.
• Embedded Memory — 114,688 total RAM bits (approximately 0.115 Mbits) of on-chip block RAM supporting LUT-configured RAM and SelectRAM+ architectures for flexible data buffering and storage.
• I/O and Interfaces — 316 available I/O pins with multi-standard SelectIO™ support and compatibility with external ZBTRAM devices for diverse interface requirements.
• Clock Management — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and 24 secondary local clock nets for advanced clock control and low-skew distribution.
• Arithmetic and Logic Support — Dedicated carry logic, multiplier support, and cascade chains for efficient implementation of arithmetic and wide-input functions.
• Configuration and Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for flexible deployment and iterative development.
• Package and Power — Surface-mount 432-LBGA exposed pad, metal package (supplier package: 432-MBGA 40×40) and a recommended supply voltage range of 2.375 V to 2.625 V.
• Commercial Grade and Operating Range — Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-performance system logic — Use as the central programmable fabric for processing, protocol handling, and glue logic in complex systems requiring dense logic and reprogrammability.
• PCI and CompactPCI systems — Supports 66-MHz PCI compliance and hot-swappable CompactPCI use cases referenced in the product family description for board-level I/O and interface control.
• Memory interface and buffering — On-chip RAM and SelectRAM+ support, plus direct connection to ZBTRAM devices, make the device suitable for designs needing fast on-board buffering and external memory interfacing.
• Prototyping and in-system configurability — SRAM-based architecture with multiple configuration modes enables iterative design development and field updates.

Unique Advantages

• High logic density: 21,168 logic elements and 888,439 gates enable implementation of large, complex designs on a single device, reducing board-level component count.
• Flexible embedded memory: Approximately 0.115 Mbits of on-chip RAM and configurable LUT-based RAM modes simplify local buffering and state storage without external components.
• Robust clocking resources: Four DLLs and an extensive global/local clock net structure support tight timing control across large designs.
• Versatile I/O: 316 I/Os and multi-standard SelectIO capabilities allow direct interfacing to a wide range of peripherals and memory devices.
• In-system re-programmability: SRAM-based configuration and multiple programming modes enable field updates and rapid design iterations for evolving requirements.
• Commercial-grade readiness: RoHS-compliant and specified for 0 °C to 85 °C operation, suitable for standard commercial embedded designs.

Why Choose XCV800-4BG432C?

The XCV800-4BG432C combines substantial logic capacity, flexible embedded memory, extensive I/O, and dedicated clock-management resources in a compact 432-LBGA exposed-pad package. Its SRAM-based, reprogrammable architecture supports iterative development and in-field updates, while built-in arithmetic and routing features simplify implementation of complex algorithms and high-speed interfaces.

This device is well suited for engineers and teams building high-capacity, reconfigurable systems where integration, performance, and design flexibility are priorities. The combination of on-chip resources and configuration options delivers long-term value for prototype-to-production workflows and evolving product requirements.

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