XCV600E-7HQ240I

IC FPGA 158 I/O 240QFP
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 158 294912 15552 240-BFQFP Exposed Pad

Quantity 1,241 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFP Exposed PadNumber of I/O158Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-7HQ240I – Virtex®-E FPGA, 1.8 V, 15,552 Logic Elements, 240-BFQFP

The XCV600E-7HQ240I is a Virtex®-E series Field Programmable Gate Array (FPGA) provided in a 240-BFQFP exposed-pad package. It combines reprogrammable logic, embedded RAM, and a broad I/O count to support configurable digital designs for industrial and embedded applications.

Designed for 1.8 V core operation with 158 available I/O pins and approximately 0.295 Mbits of on-chip RAM, this device is suitable for designs that need a balance of logic capacity, local memory, and flexible I/O in a surface-mount package rated for industrial temperatures.

Key Features

  • Programmable Logic Capacity  Approximately 15,552 logic elements (cells) providing dense, reprogrammable logic resources for custom digital functions.
  • Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for buffering, FIFOs, and local data storage.
  • I/O Resources  158 I/O pins available for interfacing to peripherals, sensors, and external memory devices; supports versatile signal interfacing as described by the Virtex‑E family.
  • Core Supply  1.71 V to 1.89 V core voltage range, matching the Virtex‑E 1.8 V family supply requirements.
  • Clock Management  Family-level clock features include multiple digitally controlled DLLs for clock multiply/divide and duty-cycle control (Virtex‑E series features).
  • Packaging & Mounting  240-BFQFP exposed pad package (supplier package: 240-PQFP, 32×32) with surface-mount mounting for PCB assembly.
  • Industrial Temperature  Rated for operation from −40°C to 100°C for deployment in industrial environments.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Implement custom control logic, signal aggregation, and protocol handling where industrial temperature operation and reprogrammability are required.
  • Embedded Systems  Provide glue logic, peripheral interfacing, and on-board processing for embedded platforms leveraging local RAM and flexible I/O.
  • Interface and Protocol Bridging  Use the device’s I/O resources and programmable logic to implement protocol conversion, bus interfacing, and timing adaptation.
  • In-System Reconfigurable Designs  SRAM-based reprogrammability enables iterative development, field updates, and design customization without hardware changes.

Unique Advantages

  • Balanced Logic and Memory:  A sizable logic element count paired with approximately 0.295 Mbits of embedded RAM supports mid-density designs that require local storage and compute.
  • Flexible I/O Count:  158 I/O pins provide design flexibility to connect multiple peripherals or external memories without immediate need for external GPIO expanders.
  • Industrial Temperature Rating:  Operation from −40°C to 100°C makes the device suitable for many industrial deployments where wider temperature tolerance is required.
  • Surface-Mount Packaging with Exposed Pad:  240-BFQFP exposed-pad package supports thermal management and standard SMT assembly processes.
  • Reprogrammable SRAM Architecture:  SRAM-based in-system configuration supports repeated reprogramming for updates and iterative development cycles.
  • Standards-Aligned Family Features:  Built on the Virtex‑E 1.8 V family architecture, benefiting from documented family-level capabilities such as advanced I/O signaling and clock management circuitry.

Why Choose XCV600E-7HQ240I?

The XCV600E-7HQ240I is positioned for engineers who need a reprogrammable, mid-density FPGA with a solid balance of logic, embedded memory, and I/O in an industrial-temperature, surface-mount form factor. Its 1.8 V core operation, family-level clock and I/O capabilities, and exposed-pad 240-BFQFP package make it suitable for embedded and industrial designs that require field updates and flexible interfacing.

For designs that demand predictable thermal handling and RoHS-compliant components, this device provides a verifiable specification set for procurement and system integration while leveraging the Virtex‑E family feature set for clock management and I/O versatility.

Request a quote or submit a purchase inquiry to check availability, pricing, and lead time for the XCV600E-7HQ240I.

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