XCV600E-7HQ240I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 158 294912 15552 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,241 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 158 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 985882 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of XCV600E-7HQ240I – Virtex®-E FPGA, 1.8 V, 15,552 Logic Elements, 240-BFQFP
The XCV600E-7HQ240I is a Virtex®-E series Field Programmable Gate Array (FPGA) provided in a 240-BFQFP exposed-pad package. It combines reprogrammable logic, embedded RAM, and a broad I/O count to support configurable digital designs for industrial and embedded applications.
Designed for 1.8 V core operation with 158 available I/O pins and approximately 0.295 Mbits of on-chip RAM, this device is suitable for designs that need a balance of logic capacity, local memory, and flexible I/O in a surface-mount package rated for industrial temperatures.
Key Features
- Programmable Logic Capacity Approximately 15,552 logic elements (cells) providing dense, reprogrammable logic resources for custom digital functions.
- Embedded Memory Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for buffering, FIFOs, and local data storage.
- I/O Resources 158 I/O pins available for interfacing to peripherals, sensors, and external memory devices; supports versatile signal interfacing as described by the Virtex‑E family.
- Core Supply 1.71 V to 1.89 V core voltage range, matching the Virtex‑E 1.8 V family supply requirements.
- Clock Management Family-level clock features include multiple digitally controlled DLLs for clock multiply/divide and duty-cycle control (Virtex‑E series features).
- Packaging & Mounting 240-BFQFP exposed pad package (supplier package: 240-PQFP, 32×32) with surface-mount mounting for PCB assembly.
- Industrial Temperature Rated for operation from −40°C to 100°C for deployment in industrial environments.
- Standards & Compliance RoHS compliant.
Typical Applications
- Industrial Control Implement custom control logic, signal aggregation, and protocol handling where industrial temperature operation and reprogrammability are required.
- Embedded Systems Provide glue logic, peripheral interfacing, and on-board processing for embedded platforms leveraging local RAM and flexible I/O.
- Interface and Protocol Bridging Use the device’s I/O resources and programmable logic to implement protocol conversion, bus interfacing, and timing adaptation.
- In-System Reconfigurable Designs SRAM-based reprogrammability enables iterative development, field updates, and design customization without hardware changes.
Unique Advantages
- Balanced Logic and Memory: A sizable logic element count paired with approximately 0.295 Mbits of embedded RAM supports mid-density designs that require local storage and compute.
- Flexible I/O Count: 158 I/O pins provide design flexibility to connect multiple peripherals or external memories without immediate need for external GPIO expanders.
- Industrial Temperature Rating: Operation from −40°C to 100°C makes the device suitable for many industrial deployments where wider temperature tolerance is required.
- Surface-Mount Packaging with Exposed Pad: 240-BFQFP exposed-pad package supports thermal management and standard SMT assembly processes.
- Reprogrammable SRAM Architecture: SRAM-based in-system configuration supports repeated reprogramming for updates and iterative development cycles.
- Standards-Aligned Family Features: Built on the Virtex‑E 1.8 V family architecture, benefiting from documented family-level capabilities such as advanced I/O signaling and clock management circuitry.
Why Choose XCV600E-7HQ240I?
The XCV600E-7HQ240I is positioned for engineers who need a reprogrammable, mid-density FPGA with a solid balance of logic, embedded memory, and I/O in an industrial-temperature, surface-mount form factor. Its 1.8 V core operation, family-level clock and I/O capabilities, and exposed-pad 240-BFQFP package make it suitable for embedded and industrial designs that require field updates and flexible interfacing.
For designs that demand predictable thermal handling and RoHS-compliant components, this device provides a verifiable specification set for procurement and system integration while leveraging the Virtex‑E family feature set for clock management and I/O versatility.
Request a quote or submit a purchase inquiry to check availability, pricing, and lead time for the XCV600E-7HQ240I.

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