XCV600E-7FG676C0773

The XCV600E-7FG676C0773 is a Virtex®-E field programmable gate array (FPGA) supplied in a 676-ball BGA package. It provides a combination of programmable logic, embedded memory, and a high I/O count suitable for complex digital designs in commercial applications.

With 15,552 logic elements, approximately 0.295 Mbits of embedded memory, and 444 I/O pins, this device is intended for designs that require substantial on-chip resources, high connectivity, and a compact surface-mount 676-FBGA package.

Key Features

• Programmable Logic: 15,552 logic elements and 3,456 logic blocks provide configurable resources for implementing custom digital logic and datapaths.
• Embedded Memory: Approximately 0.295 Mbits (294,912 bits) of on-chip RAM for buffering, FIFOs, and intermediate storage within designs.
• I/O Capacity: 444 user I/O pins to support dense external interfacing and parallel connectivity requirements.
• Gate Complexity: 985,882 gates of equivalent logic density to support complex implementations.
• Package and Mounting: 676-ball FBGA package (27 × 27 mm) with surface-mount mounting type for compact board-level integration.
• Power Requirements: Voltage supply range 1.71 V to 1.89 V to match design power rails within its specified range.
• Operating Conditions: Commercial grade device specified for 0 °C to 85 °C ambient operation.
• Environmental Compliance: RoHS-compliant for adherence to common environmental and materials requirements.

Unique Advantages

• High Logic Density: 15,552 logic elements enable implementation of sizable custom logic functions on a single device, reducing the need for multiple discrete ICs.
• Significant On-Chip Memory: Approximately 0.295 Mbits of embedded RAM supports local buffering and state storage without external memory devices.
• Extensive I/O: 444 I/O pins provide broad external connectivity for interfacing with peripherals, buses, and parallel data paths.
• Compact, Surface-Mount BGA: The 676-FBGA (27×27) package delivers a high-pin-count solution in a compact footprint for board-level space savings.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match typical commercial application environments.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious product designs and supply chain requirements.

Why Choose XCV600E-7FG676C0773?

The XCV600E-7FG676C0773 positions itself as a versatile Virtex®-E FPGA that balances programmable logic density, embedded memory, and extensive I/O in a compact 676-ball FBGA package. Its specification set—15,552 logic elements, roughly 0.295 Mbits of on-chip RAM, 444 I/Os, and nearly one million gates of logic capacity—makes it appropriate for commercial designs that require substantial on-chip resources and high connectivity.

Designed for engineers looking to consolidate functionality and optimize board space, this device offers a clearly defined electrical and thermal envelope (1.71–1.89 V supply, 0 °C to 85 °C operating range) and RoHS compliance for streamlined integration into commercial product lines.

Request a quote or submit an RFQ today to begin evaluating the XCV600E-7FG676C0773 for your next design project.