XCV600E-7FG676I

The XCV600E-7FG676I is a Virtex‑E family FPGA offering a mid-density, fast 1.8 V programmable logic solution. It provides 15,552 logic elements, approximately 0.295 Mbits of embedded memory (294,912 total RAM bits) and 444 I/O pins in a 676‑BGA package for compact, high‑I/O designs. Designed for industrial operation, the device supports system-level interfaces and on‑chip clock management found across the Virtex‑E series.

Key Features

• Logic Capacity 15,552 logic elements suited for complex glue logic, control, and mid-density FPGA functions.
• Embedded Memory Approximately 0.295 Mbits of on‑chip RAM (294,912 bits) to support buffering, FIFOs and small on‑chip data storage.
• High I/O Count 444 I/O pins enabling rich peripheral and bus connectivity in systems requiring many external interfaces.
• Voltage and Power Core supply range of 1.71 V to 1.89 V consistent with the Virtex‑E 1.8 V family architecture and designed for low‑power operation.
• Package & Mounting 676‑BGA; supplier device package listed as 676‑FBGA (27×27). Surface mount package optimized for dense PCB layouts.
• Industrial Temperature Range Rated for −40°C to 100°C operation to meet industrial environment requirements.
• Series-Level Interfaces and Clocking Virtex‑E family features include differential signalling standards (LVDS, BLVDS, LVPECL), and advanced clock management with multiple DLLs for high‑speed timing control.
• SRAM-Based, In‑System Reprogrammability Part of the Virtex‑E family architecture that supports unlimited re‑programmability for iterative development and field updates.

Typical Applications

• PCI‑based systems — Supports PCI‑compliant interfaces within the Virtex‑E series, making it suitable for designs that integrate PCI connectivity and bridging logic.
• High‑bandwidth memory interfaces — Series-level support for external memory interfaces and synchronous block RAM architectures helps implement high‑speed memory controllers and buffering.
• Multi‑standard serial interfaces — With Virtex‑E differential signalling support (LVDS, BLVDS, LVPECL), the device can be used where multi‑standard serial links are required.

Unique Advantages

• Balanced logic and memory density — 15,552 logic elements combined with nearly 0.295 Mbits of embedded RAM enable implementation of substantial on‑chip functionality without immediate reliance on external memory.
• High I/O scalability — 444 I/O pins in a compact 676‑BGA footprint provide substantial external connectivity while minimizing PCB area.
• Industrial readiness — Specified operating temperature of −40°C to 100°C supports deployment in demanding industrial environments.
• Flexible packaging for dense designs — 676‑FBGA (27×27) package and surface‑mount mounting facilitate dense board-level integration and reliable assembly.
• Reprogrammable architecture — SRAM‑based in‑system reprogramming enables design iteration, field updates, and adaptable system functionality over the product lifecycle.
• Robust clock and interface capability — Series-level clock management features and differential signalling support provide options for precise timing control and high‑speed link implementation.

Why Choose XCV600E-7FG676I?

The XCV600E-7FG676I positions itself as a mid‑density Virtex‑E FPGA offering a practical mix of logic capacity, embedded memory and I/O density for industrial applications. Its 1.8 V core architecture, series-proven clock management and reprogrammable SRAM foundation make it suitable for designs that require in‑system flexibility, extensive external connectivity and operation across a wide temperature range.

This device is well suited to engineering teams needing a compact, reprogrammable FPGA platform for applications that demand multi‑standard interface support and robust industrial temperature performance, while benefiting from the Virtex‑E family’s system-level capabilities.

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