XCV600E-7BG560I

The XCV600E-7BG560I is an industrial‑grade Virtex®-E FPGA IC offering high-density, reprogrammable logic for system-level digital designs. It combines a 1.8 V core architecture with extensive I/O and embedded memory to address demanding interface, processing, and memory‑intensive tasks.

Designed for applications that require flexible I/O standards, on‑chip memory, and robust thermal and voltage operating windows, this device delivers a balance of performance, integration, and industrial reliability for embedded and communications applications.

Key Features

• Logic Resources — 15,552 logic elements providing substantial programmable logic capacity for mid- to high-density designs.
• Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on‑chip RAM for data buffering, FIFOs, and local storage.
• I/O Capability — 404 user I/Os to support broad interfacing requirements and complex system topologies.
• Family-Level Performance — Virtex‑E family characteristics include high-density 1.8 V operation and internal performance around 130 MHz (four LUT levels), based on the series specification.
• Differential Signalling and SelectI/O+ Support — Series features include differential signaling support (LVDS, BLVDS, LVPECL) and SelectI/O+ technology for flexible interface standard selection and high‑speed links.
• Clock Management — Family-level clocking resources include multiple digital DLLs for flexible clock multiply/divide and duty‑cycle control (series specification).
• Package — 560‑LBGA exposed pad, metal package (560‑MBGA 42.5 × 42.5 mm supplier package) for compact system integration and thermal conduction.
• Power and Temperature — Core supply 1.71 V to 1.89 V; rated for industrial operation from −40 °C to 100 °C.
• Quality and Compliance — RoHS compliant and specified in production datasheet; family documentation states 100% factory tested devices.

Typical Applications

• PCI-based Systems — PCI‑compliant family features make the device suitable for bridging and interface logic in PCI 3.3 V, 32/64‑bit, 33/66‑MHz environments (series specification).
• High‑Speed Interfaces — Use in designs requiring differential signalling and high aggregate I/O bandwidth supported by SelectI/O+ and LVDS/LVPECL options.
• Memory Interface and Buffering — On‑chip RAM and family memory hierarchy support implementations that interface to external memories and require local buffering or packet staging.
• Embedded and Industrial Control — Industrial temperature rating and surface‑mount 560‑LBGA packaging suit rugged embedded systems and control applications.

Unique Advantages

• Substantial Logic Density: 15,552 logic elements enable feature‑rich designs without immediate migration to larger device families.
• Broad I/O Count: 404 I/Os provide flexibility to connect multiple peripherals, memory buses, and high-speed serial interfaces directly to the FPGA.
• Integrated On‑Chip Memory: Approximately 0.295 Mbits of embedded RAM reduces external memory dependency for many buffering and local storage tasks.
• Industrial‑Grade Operating Range: −40 °C to 100 °C rating and surface‑mount 560‑LBGA package support deployment in industrial environments.
• Power‑Efficient Core Voltage: 1.71 V–1.89 V supply range aligns with low‑voltage system designs while leveraging the Virtex‑E family’s 1.8 V architecture.
• Proven Series Feature Set: Family‑level capabilities such as differential signalling support, DLL‑based clock management, and extensive interface standard support enable versatile system designs.

Why Choose XCV600E-7BG560I?

The XCV600E-7BG560I positions itself as a versatile, industrial‑grade FPGA that blends significant logic capacity, ample I/O, and on‑chip memory within a compact 560‑LBGA package. Its 1.8 V Virtex‑E heritage and family features—differential I/O support, clock management, and PCI compatibility—make it well suited for embedded systems, interface bridging, and memory‑centric applications where reliable operation across a wide temperature range is required.

For engineering teams seeking a field‑programmable solution with series‑level ecosystem support and factory‑tested quality, this device offers a balanced platform for prototyping, integration, and deployment in industrial and communication‑focused designs.

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