XCV600E-7BG432C

IC FPGA 316 I/O 432MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 316 294912 15552 432-LBGA Exposed Pad, Metal

Quantity 354 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-7BG432C – Virtex®-E Field Programmable Gate Array (FPGA), 432-LBGA

The XCV600E-7BG432C is a Virtex®-E family FPGA offered in a 432-LBGA exposed-pad metal package. It provides a balance of programmable logic capacity, on-chip memory, and a substantial I/O count for commercial embedded and communication designs.

This device targets applications that require flexible, reprogrammable logic with substantial I/O bandwidth and on-chip RAM, while operating from a 1.71 V to 1.89 V core supply and within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Capacity — 15,552 logic elements enabling mid-range programmable logic implementations; approximately 985,882 gates of logic resources.
  • Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on-chip RAM for data buffering, FIFOs, and local storage.
  • I/O Resources — 316 user I/Os suitable for diverse interface requirements; supports high-performance signalling as defined for the Virtex-E family.
  • Clock Management — Family-level clock management features including multiple digital DLLs for clock multiplication, division, and duty-cycle management.
  • Interface Support — Virtex-E series capabilities include support for high-performance differential and single-ended I/O standards and PCI-compliant operation at the family level.
  • Power and Supply — Core supply specified from 1.71 V to 1.89 V; designed for low-power operation within Virtex-E family design rules.
  • Package and Mounting — 432-LBGA exposed pad, metal package (supplier package: 432-MBGA, 40×40); surface-mount device for board-level integration.
  • Commercial Grade — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

  • High-performance I/O systems — Implement custom interface bridging and protocol handling using the device’s broad I/O complement and Virtex-E family signalling support.
  • Memory and buffering — Use the on-chip RAM for data buffering, FIFOs, and packet processing in communication or networking endpoints.
  • Custom logic and prototyping — Deploy reprogrammable logic for hardware-accelerated algorithms, control logic, and system prototyping where in-system reconfiguration is required.
  • Embedded system controllers — Integrate glue logic, state machines, and peripheral interfaces for mid-range embedded platforms.

Unique Advantages

  • Substantial mid-range logic capacity: 15,552 logic elements provide room for complex state machines and moderate compute acceleration without external ASIC development.
  • On-chip RAM for local storage: Approximately 0.295 Mbits of embedded memory reduces external memory dependency for many buffering and temporary storage needs.
  • High I/O count: 316 I/Os allow multiple peripheral and interface connections directly to the FPGA, simplifying board routing and BOM.
  • Robust packaging: 432-LBGA exposed-pad, metal package supports surface-mount assembly and thermal conduction suitable for compact PCB designs.
  • Commercial temperature rating: Rated for 0 °C to 85 °C, matching standard commercial deployment environments.
  • RoHS compliant: Conforms to RoHS requirements for environmentally restricted substances.

Why Choose XCV600E-7BG432C?

The XCV600E-7BG432C offers a practical combination of programmable logic, embedded memory, and extensive I/O in a compact 432-LBGA footprint. It is well suited to development and production systems that need reprogrammable logic with mid-range capacity and solid I/O capability while operating from a 1.71 V–1.89 V core supply.

Engineers designing communication modules, embedded controllers, or interface bridges will find the Virtex®-E family features and the device’s resource mix valuable for reducing external components and accelerating time-to-market.

Request a quote or submit a purchase inquiry for the XCV600E-7BG432C today to check availability, pricing, and lead time.

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