XCV600E-7BG432I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 316 294912 15552 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 695 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 985882 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of XCV600E-7BG432I – Virtex®-E Field Programmable Gate Array (FPGA), 432-LBGA
The XCV600E-7BG432I is a Virtex®-E family FPGA in a 432-LBGA exposed-pad metal package, designed for high-performance, reprogrammable logic applications. This 1.8 V-class FPGA integrates substantial logic capacity, on-chip memory, and flexible high-speed I/O to address system designs that require dense logic, embedded RAM, and broad interface support.
Targeted for industrial-grade systems, the device combines configurable logic (15,552 logic elements) and approximately 0.295 Mbits of embedded memory with 316 I/O pins and up to 985,882 gates of implementation capacity, making it suitable for designs that need significant on-chip resources and multiple high-performance interfaces.
Key Features
- Core and Performance Operates from a VCCINT supply range of 1.71 V to 1.89 V consistent with 1.8 V-class Virtex-E architecture; family-level performance features include multi-level LUT implementations and digital clock management circuitry.
- Logic Capacity Provides 15,552 logic elements and a reported implementation capacity of 985,882 gates for complex combinational and sequential logic functions.
- Embedded Memory Contains 294,912 bits of on-chip RAM (approximately 0.295 Mbits) to support embedded buffering, FIFOs, and local data storage for high-throughput designs.
- I/O and Interface Support 316 user I/O pins with family-level support for a wide range of high-performance interface standards including LVDS, BLVDS, and LVPECL for differential signaling and high-speed clocking.
- Configuration and Re-programmability SRAM-based in-system configuration provides unlimited re-programmability and design flexibility for iterative development and field updates.
- Package and Mounting 432-LBGA exposed pad, metal package supplied in a 432-MBGA (40×40) footprint for surface-mount assembly; optimized for compact, board-level integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial applications requiring extended temperature tolerance.
- Factory Test and Reliability Manufactured and 100% factory tested as part of the Virtex-E family production specification.
Typical Applications
- High-Speed Interface Bridging Use in systems requiring PCI-compliant or other high-performance bus interfaces and protocol bridging leveraging the family-level PCI and Source Synchronous capabilities.
- Memory Interface and Controller Functions Implement controllers and interface logic for external memories (ZBT SRAM, DDR SDRAM) using the device’s on-chip RAM and high-bandwidth memory hierarchy.
- Data Acquisition and Signal Processing Deploy for high-throughput data capture and real-time processing where differential signaling (LVDS/LVPECL) and dense logic resources are required.
- In-System Programmable Logic for Industrial Systems Reprogrammable FPGA functions for industrial control, protocol translation, and embedded processing within the specified −40 °C to 100 °C range.
Unique Advantages
- High Logic Density: 15,552 logic elements and nearly one million gates enable implementation of large, integrated digital functions with fewer external components.
- Significant On-Chip Memory: Approximately 0.295 Mbits of embedded RAM supports local buffering and memory-centric IP without immediate dependence on external RAM.
- Broad High-Speed I/O Capability: 316 I/O pins with family-level support for LVDS, BLVDS, and LVPECL simplifies high-speed, differential interface designs.
- Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
- SRAM-Based Reprogrammability: In-system, unlimited re-programmability allows iterative firmware updates and design evolution without hardware changes.
- Compact, Surface-Mount Package: 432-LBGA (40×40) package provides a high-density footprint for space-constrained boards while maintaining thermal management via the exposed pad.
Why Choose XCV600E-7BG432I?
The XCV600E-7BG432I combines Virtex®-E family capabilities—high logic capacity, embedded RAM, and extensive I/O—with an industrial operating range and a compact 432-LBGA package to deliver a flexible, reprogrammable building block for complex system designs. Its mix of on-chip resources and family-level support for high-speed differential interfaces and memory subsystems makes it well suited for applications that demand both integration and performance.
Designed for engineers seeking a programmable, factory-tested FPGA with in-system re-programmability and proven development tool support, this device offers a practical platform for prototyping, deploying, and updating complex digital systems across industrial deployments.
Request a quote or submit an inquiry for pricing and availability of XCV600E-7BG432I to begin specifying this Virtex®-E FPGA in your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








