XCV600E-7BG432I

IC FPGA 316 I/O 432MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 316 294912 15552 432-LBGA Exposed Pad, Metal

Quantity 695 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-7BG432I – Virtex®-E Field Programmable Gate Array (FPGA), 432-LBGA

The XCV600E-7BG432I is a Virtex®-E family FPGA in a 432-LBGA exposed-pad metal package, designed for high-performance, reprogrammable logic applications. This 1.8 V-class FPGA integrates substantial logic capacity, on-chip memory, and flexible high-speed I/O to address system designs that require dense logic, embedded RAM, and broad interface support.

Targeted for industrial-grade systems, the device combines configurable logic (15,552 logic elements) and approximately 0.295 Mbits of embedded memory with 316 I/O pins and up to 985,882 gates of implementation capacity, making it suitable for designs that need significant on-chip resources and multiple high-performance interfaces.

Key Features

  • Core and Performance Operates from a VCCINT supply range of 1.71 V to 1.89 V consistent with 1.8 V-class Virtex-E architecture; family-level performance features include multi-level LUT implementations and digital clock management circuitry.
  • Logic Capacity Provides 15,552 logic elements and a reported implementation capacity of 985,882 gates for complex combinational and sequential logic functions.
  • Embedded Memory Contains 294,912 bits of on-chip RAM (approximately 0.295 Mbits) to support embedded buffering, FIFOs, and local data storage for high-throughput designs.
  • I/O and Interface Support 316 user I/O pins with family-level support for a wide range of high-performance interface standards including LVDS, BLVDS, and LVPECL for differential signaling and high-speed clocking.
  • Configuration and Re-programmability SRAM-based in-system configuration provides unlimited re-programmability and design flexibility for iterative development and field updates.
  • Package and Mounting 432-LBGA exposed pad, metal package supplied in a 432-MBGA (40×40) footprint for surface-mount assembly; optimized for compact, board-level integration.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial applications requiring extended temperature tolerance.
  • Factory Test and Reliability Manufactured and 100% factory tested as part of the Virtex-E family production specification.

Typical Applications

  • High-Speed Interface Bridging Use in systems requiring PCI-compliant or other high-performance bus interfaces and protocol bridging leveraging the family-level PCI and Source Synchronous capabilities.
  • Memory Interface and Controller Functions Implement controllers and interface logic for external memories (ZBT SRAM, DDR SDRAM) using the device’s on-chip RAM and high-bandwidth memory hierarchy.
  • Data Acquisition and Signal Processing Deploy for high-throughput data capture and real-time processing where differential signaling (LVDS/LVPECL) and dense logic resources are required.
  • In-System Programmable Logic for Industrial Systems Reprogrammable FPGA functions for industrial control, protocol translation, and embedded processing within the specified −40 °C to 100 °C range.

Unique Advantages

  • High Logic Density: 15,552 logic elements and nearly one million gates enable implementation of large, integrated digital functions with fewer external components.
  • Significant On-Chip Memory: Approximately 0.295 Mbits of embedded RAM supports local buffering and memory-centric IP without immediate dependence on external RAM.
  • Broad High-Speed I/O Capability: 316 I/O pins with family-level support for LVDS, BLVDS, and LVPECL simplifies high-speed, differential interface designs.
  • Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
  • SRAM-Based Reprogrammability: In-system, unlimited re-programmability allows iterative firmware updates and design evolution without hardware changes.
  • Compact, Surface-Mount Package: 432-LBGA (40×40) package provides a high-density footprint for space-constrained boards while maintaining thermal management via the exposed pad.

Why Choose XCV600E-7BG432I?

The XCV600E-7BG432I combines Virtex®-E family capabilities—high logic capacity, embedded RAM, and extensive I/O—with an industrial operating range and a compact 432-LBGA package to deliver a flexible, reprogrammable building block for complex system designs. Its mix of on-chip resources and family-level support for high-speed differential interfaces and memory subsystems makes it well suited for applications that demand both integration and performance.

Designed for engineers seeking a programmable, factory-tested FPGA with in-system re-programmability and proven development tool support, this device offers a practical platform for prototyping, deploying, and updating complex digital systems across industrial deployments.

Request a quote or submit an inquiry for pricing and availability of XCV600E-7BG432I to begin specifying this Virtex®-E FPGA in your next design.

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