XCV600E-7FG676C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 444 294912 15552 676-BGA |
|---|---|
| Quantity | 337 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 444 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 985882 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of XCV600E-7FG676C – Virtex®-E FPGA, 1.8 V, 676-BGA
The XCV600E-7FG676C is an SRAM-based Virtex®-E field programmable gate array (FPGA) in a 676-ball BGA package. This commercial-grade device provides 15,552 logic elements, 444 user I/Os, and approximately 0.295 Mbits of embedded RAM, making it suitable for high-performance embedded systems and interface-centric designs.
Built on the Virtex‑E architecture, the device targets applications that require flexible I/O standards, on-chip memory resources, and integrated clock management while operating from a 1.71 V to 1.89 V core supply and a commercial temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity 15,552 logic elements and approximately 985,882 system gates provide substantial programmable logic for mid-density designs.
- Embedded Memory Approximately 0.295 Mbits of on-chip RAM for data buffering, lookup tables and small embedded storage.
- I/O Count & Flexibility 444 available I/Os in a 676-FBGA (27 × 27 mm) package to support complex board-level interfacing and multi-bank I/O configurations.
- Voltage & Mounting Core voltage supply range of 1.71 V to 1.89 V; surface-mount package case (676-BGA) for modern PCB assembly processes.
- Commercial Temperature Grade Specified for 0 °C to 85 °C operation, aligned with commercial embedded and telecom applications.
- High-Performance Architecture (Series-Level) Virtex‑E family features such as SelectI/O+ technology, support for differential signaling (LVDS, BLVDS, LVPECL), and SelectRAM+ memory hierarchy are part of the series capabilities.
- Clock and Timing Features (Series-Level) Integrated digital clock-management circuitry including multiple DLLs for clock multiply/divide and DDR-friendly duty-cycle control.
- RoHS Compliant Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- High-Speed Interfaces Used to implement PCI-compliant interfaces and other high-bandwidth connections where flexible I/O standards and numerous I/O pins are required.
- Memory Interface Controllers Ideal for designing controllers and bridge logic for external memories such as ZBT SRAMs and DDR SDRAMs (series-level support noted in the datasheet).
- Embedded System Integration Suitable for mid-density embedded designs that need on-chip RAM, clock management, and programmable logic for glue logic, protocol handling, or control functions.
- Signal Processing and Arithmetic Leverages dedicated carry and multiplier support in the Virtex‑E architecture for arithmetic-heavy blocks and DSP-like tasks.
Unique Advantages
- Balanced Logic and Memory 15,552 logic elements combined with on-chip RAM offer designers a balanced resource mix for control, buffering, and data-path implementations.
- Extensive I/O Resources With 444 I/Os in a compact 676-FBGA package, the device simplifies board-level routing for multi-interface designs and reduces the need for external multiplexers.
- Programmable Clock Management Integrated DLLs and digital clock circuitry (series-level) enable flexible clocking schemes and DDR-friendly timing without external PLLs.
- SRAM-Based Reprogrammability SRAM configuration allows unlimited in-system reprogramming to support iterative development and field updates.
- Proven Development Ecosystem (Series-Level) Supported by Xilinx Foundation and Alliance Series development tools to accelerate design implementation and debugging.
Why Choose XCV600E-7FG676C?
The XCV600E-7FG676C positions itself as a versatile mid-density Virtex‑E FPGA combining substantial logic capacity, a broad I/O count, and embedded memory suitable for interface-focused and embedded applications. Its 676-FBGA package and surface-mount mounting make it compatible with standard PCB assembly flows, while the commercial temperature rating fits mainstream electronic products.
Designed with series-level features such as flexible I/O standards, advanced clock management, and in-system reprogrammability, this device is appropriate for teams implementing memory controllers, high-speed interfaces, or DSP-related functions that rely on programmable logic and reliable tooling support.
Request a quote or submit an inquiry to receive pricing and availability for the XCV600E-7FG676C and to discuss how it fits your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








