XCV600E-7FG676C

IC FPGA 444 I/O 676FCBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 444 294912 15552 676-BGA

Quantity 337 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O444Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-7FG676C – Virtex®-E FPGA, 1.8 V, 676-BGA

The XCV600E-7FG676C is an SRAM-based Virtex®-E field programmable gate array (FPGA) in a 676-ball BGA package. This commercial-grade device provides 15,552 logic elements, 444 user I/Os, and approximately 0.295 Mbits of embedded RAM, making it suitable for high-performance embedded systems and interface-centric designs.

Built on the Virtex‑E architecture, the device targets applications that require flexible I/O standards, on-chip memory resources, and integrated clock management while operating from a 1.71 V to 1.89 V core supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity  15,552 logic elements and approximately 985,882 system gates provide substantial programmable logic for mid-density designs.
  • Embedded Memory  Approximately 0.295 Mbits of on-chip RAM for data buffering, lookup tables and small embedded storage.
  • I/O Count & Flexibility  444 available I/Os in a 676-FBGA (27 × 27 mm) package to support complex board-level interfacing and multi-bank I/O configurations.
  • Voltage & Mounting  Core voltage supply range of 1.71 V to 1.89 V; surface-mount package case (676-BGA) for modern PCB assembly processes.
  • Commercial Temperature Grade  Specified for 0 °C to 85 °C operation, aligned with commercial embedded and telecom applications.
  • High-Performance Architecture (Series-Level)  Virtex‑E family features such as SelectI/O+ technology, support for differential signaling (LVDS, BLVDS, LVPECL), and SelectRAM+ memory hierarchy are part of the series capabilities.
  • Clock and Timing Features (Series-Level)  Integrated digital clock-management circuitry including multiple DLLs for clock multiply/divide and DDR-friendly duty-cycle control.
  • RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

  • High-Speed Interfaces  Used to implement PCI-compliant interfaces and other high-bandwidth connections where flexible I/O standards and numerous I/O pins are required.
  • Memory Interface Controllers  Ideal for designing controllers and bridge logic for external memories such as ZBT SRAMs and DDR SDRAMs (series-level support noted in the datasheet).
  • Embedded System Integration  Suitable for mid-density embedded designs that need on-chip RAM, clock management, and programmable logic for glue logic, protocol handling, or control functions.
  • Signal Processing and Arithmetic  Leverages dedicated carry and multiplier support in the Virtex‑E architecture for arithmetic-heavy blocks and DSP-like tasks.

Unique Advantages

  • Balanced Logic and Memory  15,552 logic elements combined with on-chip RAM offer designers a balanced resource mix for control, buffering, and data-path implementations.
  • Extensive I/O Resources  With 444 I/Os in a compact 676-FBGA package, the device simplifies board-level routing for multi-interface designs and reduces the need for external multiplexers.
  • Programmable Clock Management  Integrated DLLs and digital clock circuitry (series-level) enable flexible clocking schemes and DDR-friendly timing without external PLLs.
  • SRAM-Based Reprogrammability  SRAM configuration allows unlimited in-system reprogramming to support iterative development and field updates.
  • Proven Development Ecosystem (Series-Level)  Supported by Xilinx Foundation and Alliance Series development tools to accelerate design implementation and debugging.

Why Choose XCV600E-7FG676C?

The XCV600E-7FG676C positions itself as a versatile mid-density Virtex‑E FPGA combining substantial logic capacity, a broad I/O count, and embedded memory suitable for interface-focused and embedded applications. Its 676-FBGA package and surface-mount mounting make it compatible with standard PCB assembly flows, while the commercial temperature rating fits mainstream electronic products.

Designed with series-level features such as flexible I/O standards, advanced clock management, and in-system reprogrammability, this device is appropriate for teams implementing memory controllers, high-speed interfaces, or DSP-related functions that rely on programmable logic and reliable tooling support.

Request a quote or submit an inquiry to receive pricing and availability for the XCV600E-7FG676C and to discuss how it fits your next design.

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