XCV600E-7BG560C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 404 294912 15552 560-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 841 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 560-MBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 560-LBGA Exposed Pad, Metal | Number of I/O | 404 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 985882 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of XCV600E-7BG560C – Virtex®-E Field Programmable Gate Array (FPGA)
The XCV600E-7BG560C is a Virtex®-E family FPGA in a 560-LBGA exposed-pad package, designed for reprogrammable digital logic and high-performance interface designs. It provides 15,552 logic elements, 404 I/Os, and on-chip memory to support complex custom logic, memory controller, and high-bandwidth interface implementations.
Built around the Virtex‑E architecture, this device targets applications that require a balance of logic density, embedded memory, and flexible I/O while operating from a 1.71–1.89 V core supply in commercial-temperature environments.
Key Features
- Core Logic — 15,552 logic elements and approximately 985,882 equivalent gates provide substantial programmable logic capacity for complex designs.
- On‑Chip Memory — 294,912 total RAM bits (approximately 0.295 Mbits) of embedded memory to support local buffering and state storage for custom logic and memory interfaces.
- I/O and Interface Flexibility — 404 I/O pins and Virtex‑E SelectI/O+ series capabilities (differential signaling support and multiple high‑performance interface standards as described for the Virtex‑E family) enable a wide range of external interface options.
- Clock Management — Virtex‑E family clock-management circuitry (including multiple DLLs) supports synthesized and high‑speed clocking strategies for synchronous system designs.
- Package and Mounting — 560‑LBGA exposed pad, metal package (supplier package: 560‑MBGA, 42.5 × 42.5 mm) in a surface‑mount form factor suitable for compact board layouts.
- Power and Operating Range — Core supply specified at 1.71 V to 1.89 V; commercial operating temperature range of 0 °C to 85 °C.
- Commercial Grade and Compliance — Commercial grade device with RoHS compliance.
Typical Applications
- High‑Performance Interface Controllers — Implement PCI and other high‑speed interfaces and bridge logic where flexible I/O standards and differential signaling support are required.
- Memory Interface and Controller Logic — Create controllers for external memories (ZBT SRAM, DDR SDRAM architectures referenced in Virtex‑E documentation) using the device’s embedded RAM and interface capabilities.
- Custom Digital Processing — Offload or accelerate application‑specific digital functions using the device’s logic capacity and on‑chip memory for buffering and state machines.
- In‑System Reprogrammable Designs — Use SRAM‑based in‑system configuration for designs requiring field updates, prototyping, or iterative development.
Unique Advantages
- Substantial Logic Capacity: 15,552 logic elements and nearly one million equivalent gates enable implementation of sizable custom logic functions without external ASIC development.
- Embedded Memory for Local Buffers: Approximately 0.295 Mbits of on‑chip RAM reduces external memory dependency for many control and buffering tasks.
- Flexible I/O and Differential Support: 404 I/Os combined with the Virtex‑E family’s SelectI/O+ and differential signaling features allow a broad set of interface standards and high‑speed I/O topologies.
- Integrated Clock Management: Family clock management resources (multiple DLLs) simplify clock distribution and rate conversion for synchronous designs.
- Compact, Thermally Aware Packaging: 560‑LBGA exposed‑pad metal package supports dense board integration and thermal conduction via the exposed pad.
- RoHS‑Compliant Commercial Device: Suitable for commercial applications within the specified 0 °C to 85 °C range and compliant with RoHS directives.
Why Choose XCV600E-7BG560C?
The XCV600E-7BG560C combines significant programmable logic density, embedded memory, and flexible I/O in a compact 560‑LBGA package, making it well suited for engineers building high‑speed interfaces, memory controllers, and reprogrammable digital processing blocks. Its Virtex‑E family capabilities—such as SelectI/O+ interface flexibility, on‑chip RAM, and clock management—support efficient integration of complex functions while enabling in‑system reconfiguration.
This device is aimed at commercial‑temperature designs that require a robust, reprogrammable FPGA solution with clear electrical and packaging specifications, long‑term configurability, and compatibility with the Virtex‑E development ecosystem referenced in the product documentation.
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Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








