XCV600E-7BG560C

IC FPGA 404 I/O 560MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 404 294912 15552 560-LBGA Exposed Pad, Metal

Quantity 841 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-7BG560C – Virtex®-E Field Programmable Gate Array (FPGA)

The XCV600E-7BG560C is a Virtex®-E family FPGA in a 560-LBGA exposed-pad package, designed for reprogrammable digital logic and high-performance interface designs. It provides 15,552 logic elements, 404 I/Os, and on-chip memory to support complex custom logic, memory controller, and high-bandwidth interface implementations.

Built around the Virtex‑E architecture, this device targets applications that require a balance of logic density, embedded memory, and flexible I/O while operating from a 1.71–1.89 V core supply in commercial-temperature environments.

Key Features

  • Core Logic — 15,552 logic elements and approximately 985,882 equivalent gates provide substantial programmable logic capacity for complex designs.
  • On‑Chip Memory — 294,912 total RAM bits (approximately 0.295 Mbits) of embedded memory to support local buffering and state storage for custom logic and memory interfaces.
  • I/O and Interface Flexibility — 404 I/O pins and Virtex‑E SelectI/O+ series capabilities (differential signaling support and multiple high‑performance interface standards as described for the Virtex‑E family) enable a wide range of external interface options.
  • Clock Management — Virtex‑E family clock-management circuitry (including multiple DLLs) supports synthesized and high‑speed clocking strategies for synchronous system designs.
  • Package and Mounting — 560‑LBGA exposed pad, metal package (supplier package: 560‑MBGA, 42.5 × 42.5 mm) in a surface‑mount form factor suitable for compact board layouts.
  • Power and Operating Range — Core supply specified at 1.71 V to 1.89 V; commercial operating temperature range of 0 °C to 85 °C.
  • Commercial Grade and Compliance — Commercial grade device with RoHS compliance.

Typical Applications

  • High‑Performance Interface Controllers — Implement PCI and other high‑speed interfaces and bridge logic where flexible I/O standards and differential signaling support are required.
  • Memory Interface and Controller Logic — Create controllers for external memories (ZBT SRAM, DDR SDRAM architectures referenced in Virtex‑E documentation) using the device’s embedded RAM and interface capabilities.
  • Custom Digital Processing — Offload or accelerate application‑specific digital functions using the device’s logic capacity and on‑chip memory for buffering and state machines.
  • In‑System Reprogrammable Designs — Use SRAM‑based in‑system configuration for designs requiring field updates, prototyping, or iterative development.

Unique Advantages

  • Substantial Logic Capacity: 15,552 logic elements and nearly one million equivalent gates enable implementation of sizable custom logic functions without external ASIC development.
  • Embedded Memory for Local Buffers: Approximately 0.295 Mbits of on‑chip RAM reduces external memory dependency for many control and buffering tasks.
  • Flexible I/O and Differential Support: 404 I/Os combined with the Virtex‑E family’s SelectI/O+ and differential signaling features allow a broad set of interface standards and high‑speed I/O topologies.
  • Integrated Clock Management: Family clock management resources (multiple DLLs) simplify clock distribution and rate conversion for synchronous designs.
  • Compact, Thermally Aware Packaging: 560‑LBGA exposed‑pad metal package supports dense board integration and thermal conduction via the exposed pad.
  • RoHS‑Compliant Commercial Device: Suitable for commercial applications within the specified 0 °C to 85 °C range and compliant with RoHS directives.

Why Choose XCV600E-7BG560C?

The XCV600E-7BG560C combines significant programmable logic density, embedded memory, and flexible I/O in a compact 560‑LBGA package, making it well suited for engineers building high‑speed interfaces, memory controllers, and reprogrammable digital processing blocks. Its Virtex‑E family capabilities—such as SelectI/O+ interface flexibility, on‑chip RAM, and clock management—support efficient integration of complex functions while enabling in‑system reconfiguration.

This device is aimed at commercial‑temperature designs that require a robust, reprogrammable FPGA solution with clear electrical and packaging specifications, long‑term configurability, and compatibility with the Virtex‑E development ecosystem referenced in the product documentation.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the XCV600E-7BG560C.

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