XCV600E-7BG432C0773

FPGA VIRTEX-E FAMILY 186.624K GA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 316 294912 15552 432-LBGA Exposed Pad

Quantity 1,096 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case432-LBGA Exposed PadNumber of I/O316Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-7BG432C0773 – Virtex®-E FPGA, 432-LBGA

The XCV600E-7BG432C0773 is a Virtex®-E Field Programmable Gate Array (FPGA) IC designed for programmable logic applications. It combines a mid-range logic capacity with on-chip RAM and a substantial I/O count to address complex digital designs that require integrated memory and flexible interfacing.

This device provides 15,552 logic elements, approximately 0.295 Mbits of embedded memory (294,912 total RAM bits), and 316 I/O pins in a 432-LBGA exposed pad package, making it suitable for designs that need compact surface-mount packaging, moderate logic density, and configurable I/O.

Key Features

  • Core Logic  15,552 logic elements and 985,882 gates provide the programmable logic resources required for mid-range digital systems.
  • Logic Array Blocks  3,456 LABs support structured logic grouping and design partitioning for modular FPGA implementations.
  • Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 bits) to store data, buffers, and state without external memory in many use cases.
  • I/O Capability  316 available I/O pins enable broad interfacing options for sensors, peripherals, and communication interfaces.
  • Power and Supply  Operates from a core voltage supply range of 1.71 V to 1.89 V, supporting consistent power design and voltage planning.
  • Package & Mounting  432-LBGA exposed pad package (supplier device package: 432-MBGA, 40×40) for surface-mount PCB assembly and thermal/contact considerations.
  • Operating Conditions  Commercial-grade operation from 0 °C to 85 °C and RoHS compliance for regulatory and environmental alignment.

Typical Applications

  • Embedded System Control  Use the FPGA's logic capacity and on-chip RAM for control logic, state machines, and glue logic in embedded platforms.
  • High-Density I/O Interfaces  With 316 I/Os, the device is suited to designs that require multiple peripheral connections, parallel interfaces, or configurable bus bridging.
  • Data Buffering and Processing  Embedded RAM enables temporary data storage and local buffering for signal processing, packet handling, or protocol conversion tasks.

Unique Advantages

  • Balanced Logic and Memory: 15,552 logic elements paired with approximately 0.295 Mbits of RAM provide a balance of computational capacity and on-chip storage for integrated designs.
  • Extensive I/O Count: 316 I/Os allow flexible interfacing to sensors, peripherals, and external logic without extensive external multiplexing.
  • Compact Surface-Mount Package: The 432-LBGA exposed pad package supports compact PCB layouts while addressing thermal and assembly requirements.
  • Predictable Power Envelope: A defined core voltage range (1.71 V to 1.89 V) simplifies power-supply selection and system power budgeting.
  • Regulatory Compliance: RoHS-compliant construction supports environmentally conscious design and global market acceptance.

Why Choose XCV600E-7BG432C0773?

The XCV600E-7BG432C0773 positions itself as a practical mid-range Virtex®-E FPGA, offering a combination of logic density, embedded RAM, and a high I/O count in a 432-LBGA surface-mount footprint. Its commercial-grade temperature range and RoHS compliance make it suitable for a wide range of standard electronic products and development projects.

This device is well suited for engineers and procurement teams building systems that need integrated memory, multiple I/O channels, and a compact package—delivering predictable electrical and thermal characteristics through specified supply and operating temperature ranges.

Request a quote or submit an RFQ for XCV600E-7BG432C0773 to check current pricing and availability for your design and production needs.

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