XCV600E-6FG900I

The XCV600E-6FG900I is a Virtex®-E family Field Programmable Gate Array (FPGA) provided by AMD. It implements a high-density, 1.8 V FPGA architecture optimized for reprogrammable digital logic, offering significant I/O count and on-chip memory for complex embedded and industrial designs.

Targeted at systems that require abundant logic resources, flexible I/O and reliable operation across a wide temperature range, this device delivers a balance of performance, integration and industrial-grade qualification for demanding applications.

Key Features

• Logic Capacity — Approximately 15,552 logic elements and 985,882 system gates, enabling sizable custom logic implementations.
• Embedded Memory — Approximately 0.295 Mbits of on-chip RAM (294,912 total RAM bits) for local buffering and state storage.
• I/O Density & Flexibility — 512 user I/Os to support rich peripheral and bus interfacing; Virtex‑E family features include broad support for differential signalling standards such as LVDS, BLVDS and LVPECL.
• Clocking & Timing — Series-level capabilities include multi-DLL clock management and internal performance characteristics suitable for high‑speed synchronous designs (series internal performance references available in the product family documentation).
• Power Supply — Internal core supply operating from 1.71 V to 1.89 V, consistent with the Virtex‑E 1.8 V family design.
• Package & Mounting — Surface-mount 900-BBGA package (supplier package: 900‑FBGA, 31×31 mm) for compact board integration.
• Industrial Temperature Rating — Qualified for operation from -40°C to 100°C for robust performance in industrial environments.
• Reprogrammable SRAM Configuration — SRAM-based in-system configuration supports unlimited reprogramming for iterative development and field updates (family-level feature).
• Compliance — RoHS compliant.

Typical Applications

• High-speed Memory Interfaces — Implement controllers and interfaces for external memory subsystems using on-chip block RAM and the device’s memory hierarchy features.
• PCI and Bus-Based Systems — Suitable for PCI-compliant 3.3 V designs and other high-bandwidth bus implementations (series-level PCI support referenced in documentation).
• Differential I/O Connectivity — Ideal for designs requiring LVDS, BLVDS or LVPECL signaling for high-speed data links and clock distribution.
• Embedded Processing & DSP — Use dedicated arithmetic structures and abundant logic elements to implement custom signal-processing pipelines and control logic.

Unique Advantages

• High Integration — Large logic count and substantial embedded RAM reduce the need for external glue logic and memory components.
• Flexible I/O Standards — Series-level support for multiple differential and single-ended I/O standards enables a wide range of interface options without additional translator devices.
• Industrial Reliability — Rated for -40°C to 100°C operation, making it suitable for industrial and harsh-environment deployments.
• Reprogrammability — SRAM-based configuration enables iterative development cycles and field updates to extend product lifecycles.
• Compact, Surface-Mount Packaging — 900‑BBGA package and surface-mount mounting support dense board layouts and modern PCB assembly processes.

Why Choose XCV600E-6FG900I?

The XCV600E-6FG900I places a sizable pool of logic resources, I/O channels and embedded memory into a compact, industrial-grade BGA package. It is positioned for engineers who need a reprogrammable platform with broad interface flexibility, reliable operation across extended temperatures, and compatibility with the Virtex‑E family’s development ecosystem.

For designs that require scalable logic capacity, on-chip buffering and support for high‑speed differential interfaces, this device offers a pragmatic combination of performance, integration and field-programmability backed by the Virtex‑E family documentation and tool support.

Request a quote or submit an inquiry to obtain pricing and availability for the XCV600E-6FG900I.