XCV600E-6BG560I

The XCV600E-6BG560I is a Virtex®-E field programmable gate array (FPGA) in a 560-ball LBGA exposed-pad metal package. It delivers a balanced combination of configurable logic, on-chip memory, and a high I/O count for industrial-grade designs requiring reprogrammable silicon.

With a 1.8 V internal supply range and support for advanced I/O and memory architectures, this device is suited for designs that need substantial logic resources, dense I/O connectivity, and embedded RAM within an industrial operating temperature window.

Key Features

• Core Logic  15,552 logic elements (cells) providing programmable logic capacity for custom digital functions and state machines.
• Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 total bits) for buffering, FIFOs, and small data stores.
• I/O Resources  404 user I/Os to support wide external connectivity and parallel interfaces.
• Gate Count  985,882 equivalent system gates for estimating overall design density and integration level.
• Power Supply  Internal VCCINT supply range of 1.71 V to 1.89 V consistent with 1.8 V Virtex‑E family operation.
• Operating Range  Industrial temperature rating from -40 °C to 100 °C for deployment in demanding ambient conditions.
• Packaging  560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) for surface-mount applications and thermal conduction through the exposed pad.
• Environmental Compliance  RoHS compliant.
• Family-Level Capabilities (Virtex‑E)  Family features include 1.8 V operation, high-density logic, SelectI/O+ technology and advanced SelectRAM memory hierarchy as documented for the Virtex‑E family.

Typical Applications

• High-performance memory interfaces  Implement synchronous and high-bandwidth memory interface controllers using the device’s embedded RAM and logic resources.
• PCI and bus-based systems  Support for PCI-compliant signaling and dense I/O makes the device suitable for PCI and other bus-interface implementations.
• Signal interfacing and protocol bridging  Use the FPGA to implement protocol converters, data serializers/deserializers, and custom interface logic leveraging the extensive I/O count.
• Industrial control and automation  Industrial-grade temperature range and reprogrammability support control systems, motor interfaces, and factory automation logic.

Unique Advantages

• Substantial programmable logic: 15,552 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Integrated on-chip RAM: Approximately 0.295 Mbits of embedded memory supports buffering and local data storage without external memory for many use cases.
• High I/O density: 404 I/Os provide flexibility to interface with a wide range of peripherals and parallel buses directly from the FPGA.
• Robust industrial operating range: Rated from -40 °C to 100 °C to meet environmental demands typical in industrial deployments.
• Thermally aware packaging: 560-LBGA with exposed pad and metal construction supports thermal conduction for reliable operation in installed systems.
• Standards and family support: Device characteristics align with Virtex‑E family capabilities for clock management, I/O standards, and memory hierarchy as documented for the family.

Why Choose XCV600E-6BG560I?

The XCV600E-6BG560I positions itself as a versatile, industrial-grade FPGA option combining significant logic capacity, extensive I/O, and embedded RAM in a thermally capable 560-LBGA exposed-pad package. Its 1.8 V core operation and family-level Virtex‑E features are geared toward designs that require reconfigurability, dense interfacing, and on-chip memory resources.

This device is well matched to engineering teams building systems that demand configurable logic with industrial temperature tolerance, and who value the ability to iterate designs in-system using an SRAM-based FPGA architecture.

Request a quote to check current availability and pricing for the XCV600E-6BG560I or to submit a quotation request for procurement and project planning.