XCV600-6HQ240C

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 98304 15552 240-BFQFP Exposed Pad

Quantity 38 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates661111ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of XCV600-6HQ240C – Virtex® FPGA IC 240-BFQFP Exposed Pad

The XCV600-6HQ240C is an AMD Virtex® field programmable gate array (FPGA) in a 240-BFQFP exposed-pad package intended for commercial applications. It delivers a high-density, SRAM-based programmable logic architecture with on-chip embedded memory and extensive I/O, suited for high-performance system designs and interface-centric applications.

This device supports in-system reprogrammability and a hierarchical memory and clocking architecture, enabling flexible design partitioning and integration for PCI and Compact PCI systems, memory interfaces, and other complex digital subsystems.

Key Features

  • Logic Capacity — 15,552 logic elements for implementing complex digital functions and custom logic.
  • Configurable Logic Blocks (architecture) — SRAM-based programmable fabric with abundant registers and dedicated carry and multiplier support for arithmetic and wide-input functions.
  • Embedded Memory — Approximately 0.098 Mbits of embedded memory (98,304 bits) and configurable LUT-based RAM and SelectRAM+ options for flexible on-chip storage.
  • I/O Resources — 166 user I/Os with multi-standard SelectIO™ support and interfaces for external high-performance RAMs and ZBTRAM devices.
  • Clock Management — Four dedicated delay-locked loops (DLLs), multiple global and local clock distribution nets for advanced clock control and low-skew distribution.
  • Performance and Standards — Designed for high-density, high-performance applications with documented family-level system performance up to 200 MHz and 66-MHz PCI compliance.
  • Configuration and Reprogrammability — SRAM-based in-system configuration with multiple programming modes (SelectMAP™, serial, JTAG) and unlimited re-programmability.
  • Package and Power — 240-BFQFP exposed-pad (240-PQFP, 32×32) surface-mount package; nominal supply range 2.375 V to 2.625 V.
  • Operating Conditions — Commercial grade device with operating temperature range 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • PCI and Compact PCI systems — Implements custom interface logic and protocol handling for PCI-compliant designs and hot-swappable Compact PCI subsystems.
  • High-performance digital systems — Provides dense programmable fabric and on-chip memory for compute- and throughput-oriented functions in communications and test equipment.
  • Memory interface and bridging — Fast interfaces to external high-performance RAMs and support for ZBTRAM connectivity enable memory-intensive designs and buffer management.
  • Custom arithmetic and signal processing — Dedicated carry logic and multiplier support simplify implementation of wide arithmetic and DSP-like functions.

Unique Advantages

  • High integration density: 15,552 logic elements and abundant embedded memory reduce external component count and simplify system design.
  • Flexible I/O and interfacing: 166 user I/Os with multi-standard SelectIO support enable direct connectivity to a wide range of peripherals and memory devices.
  • Advanced clocking: Four DLLs and multiple clock distribution nets provide robust options for low-skew, multi-clock designs.
  • In-system reprogrammability: SRAM-based configuration with multiple programming modes allows design updates and field reconfiguration without hardware changes.
  • Commercial reliability and compliance: Surface-mount 240-BFQFP exposed-pad package and RoHS compliance aid manufacturability and regulatory alignment for commercial products.

Why Choose XCV600-6HQ240C?

The XCV600-6HQ240C positions itself as a versatile, high-density Virtex FPGA option for commercial embedded and system-level designs that require substantial logic capacity, flexible on-chip memory, and extensive I/O. Its SRAM-based architecture and in-system configuration support development agility and field updates.

Designed for engineers building PCI-capable systems, memory interfaces, and compute-focused modules, this device provides a balance of performance, integration, and configurable resources backed by the Virtex family architecture and development ecosystem.

Request a quote or submit a purchase inquiry to check availability and lead times for the XCV600-6HQ240C and to discuss how this device can fit your next design.

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