XCV600-6BG432C

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 98304 15552 432-LBGA Exposed Pad, Metal

Quantity 81 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates661111ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of XCV600-6BG432C – Virtex® Field Programmable Gate Array (FPGA)

The XCV600-6BG432C is an SRAM-based Virtex FPGA device that delivers high-capacity, reprogrammable logic for complex system designs. Built on the Virtex architecture, the device provides substantial programmable logic resources, embedded memory, multi-standard I/O support, and on-chip clock-management circuitry suitable for high-performance and reconfigurable applications.

Key Features

  • Programmable Logic — 15,552 logic elements (logic cells) and a total of 661,111 system gates enable the implementation of sizeable, complex logic functions.
  • Embedded Memory — Approximately 98 kbits (98,304 bits) of on-chip RAM organized for flexible LUT and block RAM configurations to support local buffering and state storage.
  • I/O Capacity — 316 user I/O pins provided in a surface-mount 432-LBGA exposed-pad metal package (supplier device package: 432-MBGA, 40×40 mm) for broad external connectivity.
  • Clock Management — Built-in clock-management circuitry including four delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and 24 secondary local clock nets for advanced timing control.
  • Multi-standard SelectIO™ — Support for multiple high-performance interface standards and direct connection to external memory types as described in the Virtex feature set.
  • High-Speed System Capability — Family-level performance characteristics include system operation up to 200 MHz and 66-MHz PCI compliance where applicable to system designs.
  • SRAM-Based Reprogrammability — In-system configuration via SRAM provides unlimited re-programmability and multiple configuration modes (SelectMAP™, master/slave serial, and JTAG).
  • Process and Test — Implemented in a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested; RoHS compliant.
  • Power and Temperature — Voltage supply range: 2.375 V to 2.625 V; operating temperature range: 0 °C to 85 °C (commercial grade).

Typical Applications

  • PCI-based Systems — Use in designs requiring PCI-compliant interfaces or legacy PCI bridging where the device’s 66-MHz PCI compatibility can be leveraged.
  • Compact PCI and Hot-Swappable Modules — Suitable for Compact PCI applications that require hot-swappable programmable logic, as supported by the Virtex feature set.
  • Logic Prototyping and Mask-Array Replacement — Ideal for replacing or prototyping mask-programmed gate arrays with a reprogrammable FPGA implementation.
  • Memory-Intensive Interfaces — Deploy where on-chip RAM and fast interfaces to external high-performance RAMs are needed for buffering, data alignment, or packet handling.

Unique Advantages

  • Reprogrammable Design Flexibility: SRAM-based configuration enables unlimited re-programmability and multiple configuration modes for iterative development and field updates.
  • Substantial Logic Capacity: 15,552 logic elements and 661,111 system gates support complex, high-density logic implementations without multiple-chip partitioning.
  • Integrated Clock and Interface Features: On-chip DLLs and multi-standard SelectIO support simplify timing control and external interface integration.
  • Compact, Surface-Mount Package: 432-LBGA exposed pad metal package (432-MBGA, 40×40) provides a high I/O count and thermal conduction suitable for board-level designs.
  • Production-Ready Quality: Implemented on a 0.22 μm, 5-layer-metal process and 100% factory tested, with RoHS compliance for regulatory alignment.
  • Established Development Ecosystem: Supported by the Virtex family development tools and libraries for design implementation and verification.

Why Choose XCV600-6BG432C?

The XCV600-6BG432C positions itself as a high-capacity, reprogrammable logic device for designers who need substantial on-chip logic, embedded memory, and a robust set of clock and I/O capabilities in a single FPGA. Its combination of 15,552 logic elements, approximately 98 kbits of block RAM, multi-standard I/O support, and on-chip clock management makes it suitable for demanding prototype and system-level implementations where reconfigurability and integration reduce design complexity and time-to-market.

Designed and specified as part of the Virtex family, this device benefits from family-level development support and the production controls inherent in the Virtex product line, delivering a reliable platform for engineers and procurement teams targeting commercial-grade FPGA solutions.

Request a quote or submit a parts inquiry to obtain pricing and availability for the XCV600-6BG432C and to discuss how this FPGA can fit your design requirements.

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