XCV600-6BG432C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 316 98304 15552 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 81 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 661111 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of XCV600-6BG432C – Virtex® Field Programmable Gate Array (FPGA)
The XCV600-6BG432C is an SRAM-based Virtex FPGA device that delivers high-capacity, reprogrammable logic for complex system designs. Built on the Virtex architecture, the device provides substantial programmable logic resources, embedded memory, multi-standard I/O support, and on-chip clock-management circuitry suitable for high-performance and reconfigurable applications.
Key Features
- Programmable Logic — 15,552 logic elements (logic cells) and a total of 661,111 system gates enable the implementation of sizeable, complex logic functions.
- Embedded Memory — Approximately 98 kbits (98,304 bits) of on-chip RAM organized for flexible LUT and block RAM configurations to support local buffering and state storage.
- I/O Capacity — 316 user I/O pins provided in a surface-mount 432-LBGA exposed-pad metal package (supplier device package: 432-MBGA, 40×40 mm) for broad external connectivity.
- Clock Management — Built-in clock-management circuitry including four delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and 24 secondary local clock nets for advanced timing control.
- Multi-standard SelectIO™ — Support for multiple high-performance interface standards and direct connection to external memory types as described in the Virtex feature set.
- High-Speed System Capability — Family-level performance characteristics include system operation up to 200 MHz and 66-MHz PCI compliance where applicable to system designs.
- SRAM-Based Reprogrammability — In-system configuration via SRAM provides unlimited re-programmability and multiple configuration modes (SelectMAP™, master/slave serial, and JTAG).
- Process and Test — Implemented in a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested; RoHS compliant.
- Power and Temperature — Voltage supply range: 2.375 V to 2.625 V; operating temperature range: 0 °C to 85 °C (commercial grade).
Typical Applications
- PCI-based Systems — Use in designs requiring PCI-compliant interfaces or legacy PCI bridging where the device’s 66-MHz PCI compatibility can be leveraged.
- Compact PCI and Hot-Swappable Modules — Suitable for Compact PCI applications that require hot-swappable programmable logic, as supported by the Virtex feature set.
- Logic Prototyping and Mask-Array Replacement — Ideal for replacing or prototyping mask-programmed gate arrays with a reprogrammable FPGA implementation.
- Memory-Intensive Interfaces — Deploy where on-chip RAM and fast interfaces to external high-performance RAMs are needed for buffering, data alignment, or packet handling.
Unique Advantages
- Reprogrammable Design Flexibility: SRAM-based configuration enables unlimited re-programmability and multiple configuration modes for iterative development and field updates.
- Substantial Logic Capacity: 15,552 logic elements and 661,111 system gates support complex, high-density logic implementations without multiple-chip partitioning.
- Integrated Clock and Interface Features: On-chip DLLs and multi-standard SelectIO support simplify timing control and external interface integration.
- Compact, Surface-Mount Package: 432-LBGA exposed pad metal package (432-MBGA, 40×40) provides a high I/O count and thermal conduction suitable for board-level designs.
- Production-Ready Quality: Implemented on a 0.22 μm, 5-layer-metal process and 100% factory tested, with RoHS compliance for regulatory alignment.
- Established Development Ecosystem: Supported by the Virtex family development tools and libraries for design implementation and verification.
Why Choose XCV600-6BG432C?
The XCV600-6BG432C positions itself as a high-capacity, reprogrammable logic device for designers who need substantial on-chip logic, embedded memory, and a robust set of clock and I/O capabilities in a single FPGA. Its combination of 15,552 logic elements, approximately 98 kbits of block RAM, multi-standard I/O support, and on-chip clock management makes it suitable for demanding prototype and system-level implementations where reconfigurability and integration reduce design complexity and time-to-market.
Designed and specified as part of the Virtex family, this device benefits from family-level development support and the production controls inherent in the Virtex product line, delivering a reliable platform for engineers and procurement teams targeting commercial-grade FPGA solutions.
Request a quote or submit a parts inquiry to obtain pricing and availability for the XCV600-6BG432C and to discuss how this FPGA can fit your design requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








