XCV600-5FG680I

IC FPGA 512 I/O 680FTEBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 512 98304 15552 680-LBGA Exposed Pad

Quantity 1,702 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package680-FTEBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case680-LBGA Exposed PadNumber of I/O512Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates661111ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of XCV600-5FG680I – Virtex® Field Programmable Gate Array (FPGA) IC 512 98304 15552 680-LBGA Exposed Pad

The XCV600-5FG680I is an SRAM-based Virtex® FPGA offering a high-capacity, high-performance programmable-logic fabric optimized for system-level designs. Its architecture combines abundant logic resources, a hierarchical memory system, and multi-standard I/O to address applications that require reprogrammable, high-density logic.

Designed for industrial environments, this device delivers a balance of integration and configurability through features such as on-chip embedded memory, dedicated clock-management circuitry, and flexible I/O support.

Key Features

  • Logic Capacity — 15,552 logic elements, enabling implementation of substantial custom logic and complex functions.
  • On-chip Memory — Approximately 0.098 Mbits of embedded memory (98,304 bits) for block RAM and SelectRAM+ usage to support data buffering and local storage.
  • I/O Density — 512 user I/O pins suitable for wide parallel interfaces and system-level connectivity.
  • System Gates — Approximately 661,111 system gates for estimating overall design scale and integration.
  • Clock Management — Four dedicated delay-locked loops (DLLs) with four primary low-skew global clock nets plus 24 secondary local clock nets for advanced clock distribution and timing control.
  • Multi-standard SelectIO — Support for multiple high-performance interface standards and direct connection options to external ZBTRAM devices.
  • Flexible Memory Architecture — LUTs configurable as 16-bit/32-bit RAM, dual-ported RAM, or shift registers, and configurable synchronous dual-ported 4k-bit RAMs for varied memory-use cases.
  • Process and Testing — Built on a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested.
  • Package and Mounting — 680-LBGA exposed pad package (supplier device package: 680-FTEBGA, 40×40); surface-mount mounting type.
  • Power and Temperature — Supported supply range 2.375 V to 2.625 V; operating temperature −40 °C to 100 °C (industrial grade).
  • Configuration — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes.
  • Additional System Features — Dedicated carry logic, multiplier support, cascade chains for wide functions, internal 3-state bussing, IEEE 1149.1 boundary-scan logic, and a die-temperature sensor diode.
  • Performance — System performance figures referenced in product documentation (for example, up to 200 MHz system performance and 66-MHz PCI compliance where applicable).

Typical Applications

  • PCI and CompactPCI Systems — Implementation of PCI-compliant logic and hot-swappable CompactPCI interfaces, leveraging the device’s interface standards and timing resources.
  • High-density Custom Logic — Replacement of mask-programmed gate arrays in designs that benefit from reprogrammability and high gate count.
  • Memory-Intensive Control and Buffering — Local data storage and buffering using the hierarchical on-chip memory and SelectRAM+ capabilities.
  • Clock-critical Systems — Designs requiring advanced clock control and low-skew distribution using the device’s DLLs and global/local clock nets.

Unique Advantages

  • Highly Reconfigurable: SRAM-based architecture with unlimited re-programmability enables iterative development and in-field updates without hardware changes.
  • Balanced Speed and Density: High logic element count and dedicated arithmetic resources support complex, high-performance functions while managing silicon area.
  • Robust Clocking: Four DLLs and multiple global/local clock nets simplify timing closure and deliver controlled clock distribution for synchronized systems.
  • Comprehensive I/O Support: 512 I/O pins and multi-standard SelectIO interfaces streamline integration with external memory and peripheral devices.
  • Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in industrial environments requiring extended temperature capability.
  • Proven Manufacturing and Test: 0.22 μm, 5-layer-metal process and 100% factory testing help ensure consistent device quality.

Why Choose XCV600-5FG680I?

The XCV600-5FG680I provides a large, flexible FPGA fabric with a combination of logic density, embedded memory, and advanced clock and I/O resources suited to demanding, reprogrammable system designs. Its industrial temperature rating, surface-mount 680-LBGA package, and validated process/testing pedigree make it appropriate for designs where robustness and configurability are required.

This device is well matched to teams and projects that need to migrate or replace mask-programmed logic, implement complex interface logic, or iterate hardware functionality in-field—while maintaining a clear path for scaling within the Virtex family architecture documented in product literature.

Request a quote or submit your requirements to receive pricing and availability for the XCV600-5FG680I. Include your desired quantity and target lead time for the fastest response.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up