XCV600-5BG560I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 404 98304 15552 560-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 1,282 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 560-MBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 560-LBGA Exposed Pad, Metal | Number of I/O | 404 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 661111 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of XCV600-5BG560I – Virtex Field Programmable Gate Array (FPGA), 560-LBGA Exposed Pad
The XCV600-5BG560I is a Virtex® SRAM-based FPGA offering high-density programmable logic for industrial applications. This device provides 15,552 logic elements (approximately 661,111 system gates), around 98 kbits of embedded RAM, and 404 user I/O in a 560-LBGA exposed-pad metal package.
Designed for reprogrammable system integration, the device supports multi-standard I/O, on-chip clock management and hierarchical memory structures, making it suitable for communication, industrial control and high-performance embedded systems where density and configurability are required.
Key Features
- Logic Capacity — 15,552 logic elements (CLBs) and approximately 661,111 system gates provide high-density programmable logic for complex designs.
- Embedded Memory — Approximately 98,304 bits of on-chip RAM to implement lookup tables, small FIFOs or scratch RAM directly in the fabric.
- I/O Capability — 404 programmable I/O pins enable broad external connectivity and support for multiple interface standards.
- Clock Management — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global/local clock nets for advanced clock control and low-skew distribution.
- Performance & Standards — System performance up to 200 MHz and 66-MHz PCI compliance with hot-swappable Compact PCI support as documented for the Virtex family.
- Configuration & Reprogrammability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes.
- Package & Mounting — 560-LBGA exposed pad, metal package (560-MBGA footprint, 42.5 × 42.5 mm) for surface-mount PCB assembly.
- Electrical & Environmental — Core supply range 2.375 V to 2.625 V and industrial operating temperature range from −40 °C to 100 °C.
Typical Applications
- Telecommunications & Networking — Implement protocol bridging, packet processing and custom I/O interfaces using the device’s high logic density and extensive I/O.
- Industrial Control & Automation — Industrial-grade temperature range and reprogrammability support control logic, motor drives and machine I/O consolidation.
- Embedded System Prototyping — SRAM-based, unlimited re-programmability makes the device suitable for iterative hardware/software co-development and proof-of-concept systems.
- High-performance Data Interfaces — On-chip clock management and multi-standard SelectIO™ interfaces enable integration with external high-performance memory and interface components.
Unique Advantages
- High-density programmable fabric: 15,552 logic elements allow integration of complex functions on a single device, reducing BOM and board area.
- Flexible memory options: Approximately 98 kbits of embedded RAM plus configurable LUT RAM and dual-ported options for local buffering and fast data paths.
- Robust clocking resources: Four DLLs and multiple global/local clock nets enable precise timing control for synchronous designs.
- Extensive I/O count: 404 I/O pins provide the connectivity needed for multi-board systems, dense sensor arrays, or high-channel-count interfaces.
- Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in demanding environmental conditions.
- Surface-mount LBGA package: 560-LBGA exposed-pad metal package for reliable thermal performance and standard surface-mount assembly.
Why Choose XCV600-5BG560I?
The XCV600-5BG560I positions itself as a high-density, reprogrammable solution for engineers who need substantial logic capacity, flexible memory options and broad I/O in an industrial-rated package. Its combination of on-chip clock management, multi-standard interfaces and proven Virtex architecture enable integration of complex subsystems while keeping design iteration fast through in-system reconfiguration.
This device is well suited to teams building communication equipment, industrial controllers, high-performance embedded platforms and prototype systems that require a balance of performance, integration and environmental robustness. Long-term value comes from reprogrammability and architecture-level support for a wide range of programmable logic tasks.
Request a quote or submit an inquiry for pricing, availability and lead-time information for XCV600-5BG560I. Our team will provide the details you need to evaluate this FPGA for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








