XCV600-5BG560I

IC FPGA 404 I/O 560MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 404 98304 15552 560-LBGA Exposed Pad, Metal

Quantity 1,282 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates661111ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of XCV600-5BG560I – Virtex Field Programmable Gate Array (FPGA), 560-LBGA Exposed Pad

The XCV600-5BG560I is a Virtex® SRAM-based FPGA offering high-density programmable logic for industrial applications. This device provides 15,552 logic elements (approximately 661,111 system gates), around 98 kbits of embedded RAM, and 404 user I/O in a 560-LBGA exposed-pad metal package.

Designed for reprogrammable system integration, the device supports multi-standard I/O, on-chip clock management and hierarchical memory structures, making it suitable for communication, industrial control and high-performance embedded systems where density and configurability are required.

Key Features

  • Logic Capacity — 15,552 logic elements (CLBs) and approximately 661,111 system gates provide high-density programmable logic for complex designs.
  • Embedded Memory — Approximately 98,304 bits of on-chip RAM to implement lookup tables, small FIFOs or scratch RAM directly in the fabric.
  • I/O Capability — 404 programmable I/O pins enable broad external connectivity and support for multiple interface standards.
  • Clock Management — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global/local clock nets for advanced clock control and low-skew distribution.
  • Performance & Standards — System performance up to 200 MHz and 66-MHz PCI compliance with hot-swappable Compact PCI support as documented for the Virtex family.
  • Configuration & Reprogrammability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes.
  • Package & Mounting — 560-LBGA exposed pad, metal package (560-MBGA footprint, 42.5 × 42.5 mm) for surface-mount PCB assembly.
  • Electrical & Environmental — Core supply range 2.375 V to 2.625 V and industrial operating temperature range from −40 °C to 100 °C.

Typical Applications

  • Telecommunications & Networking — Implement protocol bridging, packet processing and custom I/O interfaces using the device’s high logic density and extensive I/O.
  • Industrial Control & Automation — Industrial-grade temperature range and reprogrammability support control logic, motor drives and machine I/O consolidation.
  • Embedded System Prototyping — SRAM-based, unlimited re-programmability makes the device suitable for iterative hardware/software co-development and proof-of-concept systems.
  • High-performance Data Interfaces — On-chip clock management and multi-standard SelectIO™ interfaces enable integration with external high-performance memory and interface components.

Unique Advantages

  • High-density programmable fabric: 15,552 logic elements allow integration of complex functions on a single device, reducing BOM and board area.
  • Flexible memory options: Approximately 98 kbits of embedded RAM plus configurable LUT RAM and dual-ported options for local buffering and fast data paths.
  • Robust clocking resources: Four DLLs and multiple global/local clock nets enable precise timing control for synchronous designs.
  • Extensive I/O count: 404 I/O pins provide the connectivity needed for multi-board systems, dense sensor arrays, or high-channel-count interfaces.
  • Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in demanding environmental conditions.
  • Surface-mount LBGA package: 560-LBGA exposed-pad metal package for reliable thermal performance and standard surface-mount assembly.

Why Choose XCV600-5BG560I?

The XCV600-5BG560I positions itself as a high-density, reprogrammable solution for engineers who need substantial logic capacity, flexible memory options and broad I/O in an industrial-rated package. Its combination of on-chip clock management, multi-standard interfaces and proven Virtex architecture enable integration of complex subsystems while keeping design iteration fast through in-system reconfiguration.

This device is well suited to teams building communication equipment, industrial controllers, high-performance embedded platforms and prototype systems that require a balance of performance, integration and environmental robustness. Long-term value comes from reprogrammability and architecture-level support for a wide range of programmable logic tasks.

Request a quote or submit an inquiry for pricing, availability and lead-time information for XCV600-5BG560I. Our team will provide the details you need to evaluate this FPGA for your next design.

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