XCV600-5FG676I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 444 98304 15552 676-BGA |
|---|---|
| Quantity | 526 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 444 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 661111 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of XCV600-5FG676I – Virtex® Field Programmable Gate Array (FPGA) IC 444 98304 15552 676-BGA
The XCV600-5FG676I is a Virtex® SRAM-based FPGA offering high-density programmable logic for industrial applications. It provides 661,111 system gates, 15,552 logic elements, approximately 0.098 Mbits of embedded memory, and 444 user I/Os, enabling complex, reprogrammable system designs.
Designed for industrial environments, the device is packaged in a 676-FBGA (27×27) surface-mount package, supports a supply voltage range of 2.375 V to 2.625 V, and operates from −40°C to 100°C. The device is RoHS compliant.
Key Features
- Core logic — 661,111 system gates and 15,552 logic elements for high-density programmable logic.
- Embedded memory — Total on-chip RAM of 98,304 bits (approximately 0.098 Mbits) with LUT-configurable RAM and shift-register options described in the product specification.
- I/O and interfaces — 444 available I/Os with multi-standard SelectIO™ interfaces and direct connection capability to ZBT RAM devices (as described in the device specification).
- Clock and timing — Four dedicated delay-locked loops (DLLs) for advanced clock control, four primary low-skew global clock nets and 24 secondary local clock nets (from the device specification).
- Arithmetic and DSP support — Dedicated carry logic and multiplier support for high-speed arithmetic and cascade chains for wide-input functions (from the device specification).
- Configuration and re-programmability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (documented in the device specification).
- Package and power — 676-FBGA (27×27) surface-mount package; supply voltage 2.375 V to 2.625 V.
- Industrial temperature and compliance — Rated for −40°C to 100°C and RoHS compliant.
Typical Applications
- PCI and Compact PCI systems — Device specification cites 66-MHz PCI compliance and hot-swappable Compact PCI capability, suitable for PCI-based system implementations.
- High-density programmable logic — For designs that require substantial gate count and logic elements to implement complex functions and custom processing.
- High-performance I/O interfaces — Multi-standard SelectIO™ and extensive I/O count enable integration with external high-performance memories and diverse signalling standards.
Unique Advantages
- High-density programmable fabric: 661,111 system gates and 15,552 logic elements enable significant on-chip integration.
- Versatile embedded memory: On-chip RAM and LUT-configurable memory options support a range of buffering and storage needs.
- Advanced clock management: Four DLLs plus multiple global and local clock nets simplify timing strategies across large designs.
- Extensive I/O flexibility: 444 I/Os with multi-standard SelectIO™ support a wide array of interface standards and external memory connections.
- Industrial-ready operation: −40°C to 100°C operating range and RoHS compliance for industrial deployment.
- In-system re-programmability: SRAM-based configuration and multiple programming modes support iterative development and field updates.
Why Choose XCV600-5FG676I?
XCV600-5FG676I positions itself as a high-density, industrial-grade FPGA well suited to designs that require significant logic capacity, flexible I/O, and advanced clock management. Its combination of system gates, logic elements, and embedded memory supports complex programmable implementations while providing in-system re-programmability.
The device’s documented architecture and development support make it appropriate for engineering teams and procurement sourcing industrial FPGA solutions where integration density, timing control, and configurability are key requirements.
Request a quote or submit an inquiry for availability and pricing for XCV600-5FG676I today.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








