XCV600-5FG676C

The XCV600-5FG676C is a Virtex® family field-programmable gate array (FPGA) offering 15,552 logic elements and 661,111 system gates in a 676-ball BGA package. This SRAM-based device provides in-system configurability and is targeted at commercial electronic systems requiring mid-to-high logic density, extensive I/O, and flexible clocking and memory resources.

Key hardware characteristics include 444 I/O pins, approximately 0.098 Mbits of embedded memory, a 2.375 V to 2.625 V supply range, and a commercial operating range of 0 °C to 85 °C. The device is RoHS compliant and designed for surface-mount assembly in a 676-FBGA (27×27) footprint.

Key Features

• Core Density & Logic 15,552 logic elements and 661,111 system gates deliver substantial programmable logic capacity for complex custom functions.
• Embedded Memory Approximately 0.098 Mbits of on-chip RAM and configurable LUT-based RAM options support local data buffering and fast on-chip storage.
• I/O & Interface Support 444 general-purpose I/Os and multi-standard SelectIO™ support (family-level feature) enable connectivity to a range of external devices and signaling standards.
• Clock Management Four dedicated delay-locked loops (DLLs) with multiple global and local clock distribution nets provide advanced clock control and low-skew routing.
• Arithmetic & Logic Support Dedicated carry logic, multiplier support, and cascade chains facilitate efficient implementation of high-speed arithmetic and wide-input functions.
• In-System Configuration SRAM-based architecture with unlimited re-programmability and four programming modes allows flexible development and field updates.
• Package & Mounting 676-BGA package (supplier device package: 676-FBGA, 27×27) optimized for surface-mount PCB assembly.
• Power & Operating Range Voltage supply range 2.375 V to 2.625 V and commercial operating temperature of 0 °C to 85 °C.
• Regulatory & Process RoHS compliant; built on a 0.22 µm, 5-layer-metal CMOS process and 100% factory tested (family-level information).

Typical Applications

• PCI and Compact PCI Systems Suitable for FPGA roles in PCI-compliant designs and Compact PCI applications where hot-swap and board-level reconfiguration are required (family-level PCI support noted).
• High-performance Embedded Systems Implement custom control, data parsing, and acceleration logic where significant on-chip logic and local memory are required.
• Networking & Telecom Modules Provide packet processing, protocol bridging, and interface adaptation using abundant I/O and programmable logic resources.
• Prototyping & In-system Upgradable Designs Ideal for development platforms and products that benefit from unlimited re-programmability and multiple configuration modes.

Unique Advantages

• High Logic Capacity: 15,552 logic elements and 661,111 system gates deliver the resources needed for complex, multi-function designs.
• Flexible I/O Integration: 444 pins and family SelectIO capabilities simplify interfacing to diverse peripherals and memory devices.
• Advanced Clocking Topology: Four DLLs and multiple global/local clock nets reduce clock skew and support sophisticated timing architectures.
• Field Re-programmability: SRAM-based configuration with unlimited re-programmability and four programming modes supports iterative development and field updates.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation for mainstream commercial products.
• RoHS Compliant & Factory Tested: Meets RoHS requirements and is 100% factory tested at the family level.

Why Choose XCV600-5FG676C?

The XCV600-5FG676C positions itself as a robust, mid-to-high density Virtex FPGA option for commercial electronic designs that require significant programmable logic, rich I/O, and flexible clock and memory resources. Its SRAM-based re-programmability and family-level design features provide designers with a versatile platform for prototyping, system integration, and field-updatable products.

Supported by the Virtex design ecosystem and development tools (family-level support), this device offers a balance of integration, configurability, and tested manufacturing that helps reduce development time while enabling scalable design growth.

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