XCV600-6FG676C

The XCV600-6FG676C is a Virtex® SRAM-based FPGA offering a balanced mix of logic capacity, on-chip memory, and high I/O density in a 676‑FBGA (27×27) surface-mount package. Built on the Virtex architecture, this device provides re-programmable programmable logic with on-board clock management and configurable memory resources suitable for high-performance embedded systems and custom digital designs.

Key system-level attributes include 15,552 logic elements, approximately 0.098 Mbits of embedded RAM, 444 I/O pins, and an operating voltage range of 2.375 V to 2.625 V. The device is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Logic Capacity — Provides 15,552 logic elements to implement medium-to-large custom logic and control functions.
• Embedded Memory — Approximately 0.098 Mbits of on-chip RAM with configurable LUT-based RAM and dedicated 4k-bit synchronous dual-ported RAM blocks for flexible data buffering and state storage.
• I/O and Interface — 444 user I/O pins and Multi‑standard SelectIO™ support (16 high-performance interface standards) for direct interfacing to a variety of external memories and peripherals.
• Clock Management — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock control across the device.
• Arithmetic and Routing — Dedicated carry logic, multiplier support, cascade chains, and abundant registers for efficient implementation of arithmetic and wide-input functions.
• SRAM-Based In-System Configuration — Unlimited re-programmability with multiple programming modes for in-system updates and design iteration.
• Package and Mounting — 676‑FBGA (27×27) package, surface-mount mounting type, suitable for compact board layouts.
• Power and Environmental — Supply voltage range of 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• High‑performance data paths — Implement custom packet processing, protocol bridging, and timing-critical logic leveraging the device’s logic density and clock management resources.
• Memory interface and buffering — Use embedded RAM and fast external memory interfaces for buffering, queuing, and temporary storage in data acquisition and communication systems.
• Custom I/O and interface conversion — Take advantage of the Multi‑standard SelectIO support and 444 I/O pins to implement protocol conversion, peripheral interfaces, and board-level glue logic.
• Reconfigurable prototypes and production logic — SRAM-based in-system configuration provides flexibility for iterative development and field updates without requiring replacement silicon.

Unique Advantages

• High logic density: 15,552 logic elements enable complex control, signal-processing, and glue-logic implementations in a single device.
• Flexible embedded memory: Approximately 0.098 Mbits of on-chip RAM with LUT-configurable and dual-ported RAM options simplifies data buffering and state machine design.
• Extensive I/O capability: 444 I/O pins and Multi‑standard SelectIO support reduce the need for external interface components and simplify board-level integration.
• Robust clocking resources: Four DLLs and a hierarchical clock-distribution network provide precise clock control for multi-domain designs.
• In-system re-programmability: SRAM-based configuration with multiple programming modes enables design updates and iterative development without hardware changes.
• Compact package: 676‑FBGA (27×27) surface-mount package supports high-density PCB designs while providing substantial I/O and logic resources.

Why Choose XCV600-6FG676C?

The XCV600-6FG676C positions itself as a versatile, re-programmable logic building block for embedded systems that require a combination of substantial logic resources, flexible on-chip memory, and high I/O counts. Its Virtex architecture and integrated clock-management features make it well suited for designers implementing medium-to-large custom digital functions, high-speed interfaces, and reconfigurable logic solutions within commercial temperature ranges.

Supported by established development toolchains and with a range of on-chip resources, the XCV600-6FG676C delivers scalability and design flexibility for teams focused on rapid prototyping, in-field updates, and compact system integration while maintaining conformance to RoHS requirements.

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