XCV600-6FG680C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 512 98304 15552 680-LBGA Exposed Pad |
|---|---|
| Quantity | 1,140 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 680-FTEBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 680-LBGA Exposed Pad | Number of I/O | 512 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3456 | Number of Logic Elements/Cells | 15552 | ||
| Number of Gates | 661111 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of XCV600-6FG680C – Virtex® FPGA, 15,552 Logic Elements, 512 I/O, 680‑LBGA
The XCV600-6FG680C is a commercial-grade Virtex® field programmable gate array (FPGA) IC offering 15,552 logic elements and 98,304 bits of embedded RAM. This SRAM-based FPGA delivers high-capacity programmable logic with on-chip memory and flexible I/O for complex digital designs.
Designed for systems that require dense programmable logic, extensive I/O and configurable clock management, the device supports in-system reprogrammability and a range of configuration modes while operating within a 2.375 V to 2.625 V supply window and a commercial temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity — 15,552 logic elements provide significant programmable resource for implementing complex digital functions.
- Embedded Memory — Total on-chip RAM of 98,304 bits (approximately 98 kbits) for buffering, local storage, and state retention within designs.
- I/O Density — 512 user I/O pins to support wide external connectivity and parallel interfaces.
- Clock Management — Four dedicated delay-locked loops (DLLs) and multiple global and local clock distribution nets for advanced clock control and low-skew distribution.
- Multi‑standard SelectIO — Support for multiple high-performance interface standards to simplify direct connections to a variety of external devices.
- Arithmetic and DSP Support — Dedicated carry logic and multiplier support for high-speed arithmetic and signal processing functions.
- SRAM-based Configuration — In-system reprogrammability with multiple programming modes (including Master Serial, Slave Serial, SelectMAP™, and JTAG).
- Process and Test — Implemented in a 0.22 µm, five-layer-metal CMOS process and 100% factory tested.
- Package & Mounting — 680‑LBGA exposed pad package (supplier package: 680‑FTEBGA, 40×40) in a surface-mount form factor.
- Power & Temperature — Operating supply range 2.375 V to 2.625 V and commercial operating temperature 0 °C to 85 °C.
Typical Applications
- PCI and Compact PCI systems — 66‑MHz PCI compliance and hot-swappable support make the device suitable for Compact PCI modules and mezzanine logic implementations.
- High-performance logic and prototyping — Large logic capacity and on-chip RAM allow integration of complex prototypes and custom processing engines.
- Memory interface control — Hierarchical memory architecture and fast interfaces to external high-performance RAMs support memory controller and buffering functions.
- Custom I/O bridging — 512 I/O pins and multi-standard SelectIO support facilitate protocol bridging and interface translation between subsystems.
Unique Advantages
- Large programmable resource: 15,552 logic elements and ~98 kbits of embedded RAM enable dense implementation of control, datapath, and protocol logic.
- Comprehensive clocking options: Four DLLs and multiple clock nets provide designers with granular clock control and low-skew distribution for synchronous systems.
- Flexible I/O and interface support: 512 I/Os plus multi-standard SelectIO simplify connections to diverse external devices and memory components.
- SRAM-based in-system reprogrammability: Multiple configuration modes allow iterative development and field updates without device removal.
- Proven manufacturing process: 0.22 µm, five-layer-metal CMOS process and 100% factory testing provide traceable production quality.
- Commercial-grade suitability: Rated for 0 °C to 85 °C operation and surface-mount 680‑LBGA packaging for standard commercial electronics assemblies.
Why Choose XCV600-6FG680C?
The XCV600-6FG680C positions itself as a high-capacity, reprogrammable logic device for commercial electronic systems that require substantial logic resources, abundant I/O and built-in clock management. Its balance of logic elements, embedded RAM and flexible I/O support makes it appropriate for designs that integrate protocol handling, custom computation and memory interfacing on a single device.
Supported by established development tool ecosystems and a standardized configuration approach, the device provides a scalable platform for teams developing complex FPGA-based solutions who need predictable electrical characteristics (2.375 V–2.625 V) and commercial temperature operation.
Request a quote or submit a pricing and availability inquiry to get started with XCV600-6FG680C for your next programmable logic design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








