XCV600E-6BG560C

The XCV600E-6BG560C is a Virtex®-E Field Programmable Gate Array (FPGA) in a 560-LBGA exposed-pad metal package. It provides a reconfigurable logic fabric with high I/O count and embedded memory suited to designs that require flexible, high-bandwidth interfaces and in-system reprogrammability.

Built on the Virtex-E family architecture, this device targets applications needing substantial on-chip logic and memory capacity combined with a broad set of I/O standards and clock management features. It operates with an internal supply range of 1.71 V to 1.89 V and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity — 15,552 logic elements and approximately 985,882 gates provide a sizeable configurable fabric for medium-to-high density logic implementations.
• Embedded Memory — 294,912 total RAM bits, equivalent to approximately 0.295 Mbits of embedded memory, enabling on-chip buffering and local data storage.
• I/O Density & Flexibility — 404 I/O pins support high-bandwidth external interfaces and system-level connectivity in a compact package.
• High-Performance I/O Standards (series-level) — Virtex‑E SelectI/O+ technology supports a wide range of interface standards and differential signaling (LVDS, BLVDS, LVPECL) for system designs requiring source-synchronous and differential data paths.
• Clock Management (series-level) — Advanced clock management with multiple DLLs enables clock multiplication/division and duty-cycle control for timing-critical applications.
• Memory Hierarchy (series-level) — SelectRAM+ architecture provides distributed RAM and block RAM options to support high bandwidth memory interfaces and true dual-port block RAM functionality.
• Configuration — SRAM-based in-system reconfigurability allows unlimited re-programmability for iterative development and field updates.
• Package & Mounting — 560-LBGA exposed pad, metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) and surface-mount mounting type for board-level integration.
• Power and Thermal — Internal supply specified from 1.71 V to 1.89 V; commercial operating temperature range from 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-speed interface controllers — Use the device’s broad I/O support and differential signaling capabilities for designs that require source-synchronous or differential data channels.
• Memory interface and buffering — Leverage the on-chip block and distributed RAM to implement high-performance interfaces to external memories and local buffering.
• PCI-compliant systems — Applicable to designs targeting PCI 3.3 V, 32/64-bit, 33/66-MHz interfaces as supported by the Virtex‑E family.
• Reconfigurable prototyping and system integration — SRAM-based in-system configuration enables iterative development, updates, and flexible system functions.

Unique Advantages

• Substantial logic and gate count: 15,552 logic elements and 985,882 gates provide the resources needed for complex combinational and sequential functions without immediate partitioning across multiple devices.
• High I/O bandwidth: 404 I/O pins allow wide parallel data paths and multiple interfaces on a single device, reducing board-level complexity.
• Embedded memory for local storage: Approximately 0.295 Mbits of on-chip RAM supports buffering, FIFOs, and small embedded datasets close to logic for reduced latency.
• Flexible clocking and interface options: Family-level clock management and SelectI/O+ capabilities enable precise timing control and support for a variety of signaling standards.
• RoHS compliant and surface-mount package: Modern packaging with an exposed pad and metal BGA footprint simplifies thermal management and assembly for commercial designs.
• Re-programmability and development ecosystem (series-level): SRAM-based configuration and support from Virtex‑E development systems speed design iteration and deployment.

Why Choose XCV600E-6BG560C?

The XCV600E-6BG560C combines a sizable logic fabric, meaningful embedded memory, and a high I/O count in a commercial-grade Virtex‑E FPGA package. Its 1.8 V internal supply and series-level features—such as advanced I/O standards support, clock management primitives, and in-system reconfiguration—make it a practical choice for designs that require flexible, high-bandwidth interfacing and iterative development.

This device is appropriate for engineers and system designers implementing medium-to-high density logic functions, memory interface controllers, and PCI-compliant subsystems who value reprogrammability, on-chip memory resources, and robust I/O capability within a surface-mount BGA package.

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